JP2011049598A5 - - Google Patents
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- JP2011049598A5 JP2011049598A5 JP2010267184A JP2010267184A JP2011049598A5 JP 2011049598 A5 JP2011049598 A5 JP 2011049598A5 JP 2010267184 A JP2010267184 A JP 2010267184A JP 2010267184 A JP2010267184 A JP 2010267184A JP 2011049598 A5 JP2011049598 A5 JP 2011049598A5
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- Japan
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- 239000004065 semiconductor Substances 0.000 claims 34
- 239000010410 layer Substances 0.000 claims 14
- 239000011229 interlayer Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 4
- 238000005530 etching Methods 0.000 claims 4
- 230000006870 function Effects 0.000 claims 4
- 238000000059 patterning Methods 0.000 claims 3
- 230000000149 penetrating effect Effects 0.000 claims 2
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010267184A JP2011049598A (ja) | 2010-11-30 | 2010-11-30 | 半導体装置及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010267184A JP2011049598A (ja) | 2010-11-30 | 2010-11-30 | 半導体装置及びその製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33843799A Division JP4703807B2 (ja) | 1999-11-29 | 1999-11-29 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011049598A JP2011049598A (ja) | 2011-03-10 |
| JP2011049598A5 true JP2011049598A5 (enExample) | 2011-04-21 |
Family
ID=43835550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010267184A Pending JP2011049598A (ja) | 2010-11-30 | 2010-11-30 | 半導体装置及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2011049598A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111259613B (zh) * | 2018-11-14 | 2023-08-15 | 华邦电子股份有限公司 | 电子装置及集成电路的布局方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0661230A (ja) * | 1992-05-28 | 1994-03-04 | Nec Corp | 半導体集積回路装置 |
| JP2940432B2 (ja) * | 1995-04-27 | 1999-08-25 | ヤマハ株式会社 | 半導体装置とその製造方法 |
| JP2000114258A (ja) * | 1998-09-29 | 2000-04-21 | Toshiba Corp | 半導体装置 |
| JP4703807B2 (ja) * | 1999-11-29 | 2011-06-15 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
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2010
- 2010-11-30 JP JP2010267184A patent/JP2011049598A/ja active Pending