JP2011049397A - 高周波デバイス - Google Patents

高周波デバイス Download PDF

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Publication number
JP2011049397A
JP2011049397A JP2009197153A JP2009197153A JP2011049397A JP 2011049397 A JP2011049397 A JP 2011049397A JP 2009197153 A JP2009197153 A JP 2009197153A JP 2009197153 A JP2009197153 A JP 2009197153A JP 2011049397 A JP2011049397 A JP 2011049397A
Authority
JP
Japan
Prior art keywords
substrate
opening
dielectric layer
frequency device
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009197153A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011049397A5 (enExample
Inventor
Takashi Mitarai
俊 御手洗
Minehiro Sotozaki
峰広 外崎
Koichi Ikeda
浩一 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2009197153A priority Critical patent/JP2011049397A/ja
Priority to US12/860,140 priority patent/US8432316B2/en
Priority to CN2010102586866A priority patent/CN102005439B/zh
Publication of JP2011049397A publication Critical patent/JP2011049397A/ja
Publication of JP2011049397A5 publication Critical patent/JP2011049397A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2009197153A 2009-08-27 2009-08-27 高周波デバイス Pending JP2011049397A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009197153A JP2011049397A (ja) 2009-08-27 2009-08-27 高周波デバイス
US12/860,140 US8432316B2 (en) 2009-08-27 2010-08-20 High frequency device
CN2010102586866A CN102005439B (zh) 2009-08-27 2010-08-20 高频器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009197153A JP2011049397A (ja) 2009-08-27 2009-08-27 高周波デバイス

Publications (2)

Publication Number Publication Date
JP2011049397A true JP2011049397A (ja) 2011-03-10
JP2011049397A5 JP2011049397A5 (enExample) 2012-10-04

Family

ID=43623974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009197153A Pending JP2011049397A (ja) 2009-08-27 2009-08-27 高周波デバイス

Country Status (3)

Country Link
US (1) US8432316B2 (enExample)
JP (1) JP2011049397A (enExample)
CN (1) CN102005439B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12343994B2 (en) 2022-03-02 2025-07-01 Ricoh Company, Ltd. Liquid discharge head, head module, liquid discharge unit, and liquid discharge apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8674883B2 (en) 2011-05-24 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Antenna using through-silicon via
CN103887601B (zh) * 2012-12-20 2015-10-28 中国科学院上海微系统与信息技术研究所 折叠槽天线结构及其制作方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222912A (ja) 2001-01-26 2002-08-09 Matsushita Electric Ind Co Ltd 高周波マルチチップモジュール及び製造方法
CN1316858C (zh) * 2001-04-27 2007-05-16 日本电气株式会社 高频电路基板及其制造方法
JP2003100937A (ja) * 2001-09-26 2003-04-04 Hitachi Ltd 高周波モジュール
US7075167B2 (en) * 2003-08-22 2006-07-11 Agere Systems Inc. Spiral inductor formed in a semiconductor substrate
JP4553627B2 (ja) * 2004-04-30 2010-09-29 太陽誘電株式会社 高周波回路モジュールおよび無線通信機器
CN101589468A (zh) * 2007-01-17 2009-11-25 Nxp股份有限公司 具有通过衬底的通路孔的系统级封装

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12343994B2 (en) 2022-03-02 2025-07-01 Ricoh Company, Ltd. Liquid discharge head, head module, liquid discharge unit, and liquid discharge apparatus

Also Published As

Publication number Publication date
CN102005439B (zh) 2013-05-29
US8432316B2 (en) 2013-04-30
US20110050368A1 (en) 2011-03-03
CN102005439A (zh) 2011-04-06

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