CN102005439B - 高频器件 - Google Patents

高频器件 Download PDF

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Publication number
CN102005439B
CN102005439B CN2010102586866A CN201010258686A CN102005439B CN 102005439 B CN102005439 B CN 102005439B CN 2010102586866 A CN2010102586866 A CN 2010102586866A CN 201010258686 A CN201010258686 A CN 201010258686A CN 102005439 B CN102005439 B CN 102005439B
Authority
CN
China
Prior art keywords
substrate
dielectric layer
opening
frequency
frequency device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010102586866A
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English (en)
Chinese (zh)
Other versions
CN102005439A (zh
Inventor
御手洗俊
外崎峰广
池田浩一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN102005439A publication Critical patent/CN102005439A/zh
Application granted granted Critical
Publication of CN102005439B publication Critical patent/CN102005439B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type
    • H01F17/0006—Printed inductances
    • H01F2017/0046—Printed inductances with a conductive path having a bridge
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN2010102586866A 2009-08-27 2010-08-20 高频器件 Expired - Fee Related CN102005439B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009197153A JP2011049397A (ja) 2009-08-27 2009-08-27 高周波デバイス
JP2009-197153 2009-08-27

Publications (2)

Publication Number Publication Date
CN102005439A CN102005439A (zh) 2011-04-06
CN102005439B true CN102005439B (zh) 2013-05-29

Family

ID=43623974

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010102586866A Expired - Fee Related CN102005439B (zh) 2009-08-27 2010-08-20 高频器件

Country Status (3)

Country Link
US (1) US8432316B2 (enExample)
JP (1) JP2011049397A (enExample)
CN (1) CN102005439B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8674883B2 (en) 2011-05-24 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Antenna using through-silicon via
CN103887601B (zh) * 2012-12-20 2015-10-28 中国科学院上海微系统与信息技术研究所 折叠槽天线结构及其制作方法
JP2023127716A (ja) 2022-03-02 2023-09-14 株式会社リコー 液体吐出ヘッド、ヘッドモジュール、液体吐出ユニット及び液体を吐出する装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1392755A (zh) * 2001-04-27 2003-01-22 日本电气株式会社 高频电路基板及其制造方法
CN1694250A (zh) * 2004-04-30 2005-11-09 太阳诱电株式会社 高频电路模块和无线通信设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222912A (ja) 2001-01-26 2002-08-09 Matsushita Electric Ind Co Ltd 高周波マルチチップモジュール及び製造方法
JP2003100937A (ja) * 2001-09-26 2003-04-04 Hitachi Ltd 高周波モジュール
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法
US7075167B2 (en) * 2003-08-22 2006-07-11 Agere Systems Inc. Spiral inductor formed in a semiconductor substrate
CN101589468A (zh) * 2007-01-17 2009-11-25 Nxp股份有限公司 具有通过衬底的通路孔的系统级封装

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1392755A (zh) * 2001-04-27 2003-01-22 日本电气株式会社 高频电路基板及其制造方法
CN1694250A (zh) * 2004-04-30 2005-11-09 太阳诱电株式会社 高频电路模块和无线通信设备

Also Published As

Publication number Publication date
JP2011049397A (ja) 2011-03-10
US8432316B2 (en) 2013-04-30
US20110050368A1 (en) 2011-03-03
CN102005439A (zh) 2011-04-06

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20170109

Address after: Kanagawa Japan Atsugi Asahi 4-14-1

Patentee after: SONY SEMICONDUCTOR SOLUTIONS Corp.

Address before: Tokyo, Japan

Patentee before: Sony Corp.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130529