JP2011049397A5 - - Google Patents

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Publication number
JP2011049397A5
JP2011049397A5 JP2009197153A JP2009197153A JP2011049397A5 JP 2011049397 A5 JP2011049397 A5 JP 2011049397A5 JP 2009197153 A JP2009197153 A JP 2009197153A JP 2009197153 A JP2009197153 A JP 2009197153A JP 2011049397 A5 JP2011049397 A5 JP 2011049397A5
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JP
Japan
Prior art keywords
frequency device
membrane
viewed
substrate
shows
Prior art date
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Pending
Application number
JP2009197153A
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English (en)
Japanese (ja)
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JP2011049397A (ja
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Publication date
Application filed filed Critical
Priority to JP2009197153A priority Critical patent/JP2011049397A/ja
Priority claimed from JP2009197153A external-priority patent/JP2011049397A/ja
Priority to US12/860,140 priority patent/US8432316B2/en
Priority to CN2010102586866A priority patent/CN102005439B/zh
Publication of JP2011049397A publication Critical patent/JP2011049397A/ja
Publication of JP2011049397A5 publication Critical patent/JP2011049397A5/ja
Pending legal-status Critical Current

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JP2009197153A 2009-08-27 2009-08-27 高周波デバイス Pending JP2011049397A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009197153A JP2011049397A (ja) 2009-08-27 2009-08-27 高周波デバイス
US12/860,140 US8432316B2 (en) 2009-08-27 2010-08-20 High frequency device
CN2010102586866A CN102005439B (zh) 2009-08-27 2010-08-20 高频器件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009197153A JP2011049397A (ja) 2009-08-27 2009-08-27 高周波デバイス

Publications (2)

Publication Number Publication Date
JP2011049397A JP2011049397A (ja) 2011-03-10
JP2011049397A5 true JP2011049397A5 (enExample) 2012-10-04

Family

ID=43623974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009197153A Pending JP2011049397A (ja) 2009-08-27 2009-08-27 高周波デバイス

Country Status (3)

Country Link
US (1) US8432316B2 (enExample)
JP (1) JP2011049397A (enExample)
CN (1) CN102005439B (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8674883B2 (en) 2011-05-24 2014-03-18 Taiwan Semiconductor Manufacturing Company, Ltd. Antenna using through-silicon via
CN103887601B (zh) * 2012-12-20 2015-10-28 中国科学院上海微系统与信息技术研究所 折叠槽天线结构及其制作方法
JP2023127716A (ja) 2022-03-02 2023-09-14 株式会社リコー 液体吐出ヘッド、ヘッドモジュール、液体吐出ユニット及び液体を吐出する装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002222912A (ja) 2001-01-26 2002-08-09 Matsushita Electric Ind Co Ltd 高周波マルチチップモジュール及び製造方法
CN1316858C (zh) * 2001-04-27 2007-05-16 日本电气株式会社 高频电路基板及其制造方法
JP2003100937A (ja) * 2001-09-26 2003-04-04 Hitachi Ltd 高周波モジュール
JP2004235602A (ja) * 2002-12-06 2004-08-19 Matsushita Electric Ind Co Ltd 高周波回路とその製造方法
US7075167B2 (en) * 2003-08-22 2006-07-11 Agere Systems Inc. Spiral inductor formed in a semiconductor substrate
JP4553627B2 (ja) * 2004-04-30 2010-09-29 太陽誘電株式会社 高周波回路モジュールおよび無線通信機器
CN101589468A (zh) * 2007-01-17 2009-11-25 Nxp股份有限公司 具有通过衬底的通路孔的系统级封装

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