JP2011021226A - Intermittently partial plating apparatus and method for intermittently partial plating by use of the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an intermittently partial plating apparatus for intermittently plating a required portion for plating while continuously carrying a film carrier tape for mounting electronic components, the tape which is wide and long, continuing in the longitudinal direction, and to provide a method of intermittently partial plating by use of the apparatus. <P>SOLUTION: The intermittently partial plating apparatus aims to plate a required portion for plating of a tape for mounting electronic components while carrying the tape, the tape being wide and long, continuing in the longitudinal direction. The apparatus includes: an electrode structure that has a great number of electrode nozzle holes formed in a side plate having a large anode area and radially jetting a plating liquid; and a mask rotator that rotates while carrying the tape. The mask rotator acts as a masking material to prevent the plating liquid from contacting an unnecessary portion for plating of the tape, and is concentrically disposed outside the electrode structure. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a continuous partial plating apparatus and a continuous partial plating method using the same, and more specifically, sprays a plating solution only on a necessary portion of a long and wide film carrier tape for electronic component mounting that is continuously conveyed. The present invention relates to a continuous partial plating apparatus that includes an electrode structure that can be used and a masking material, and that can stably perform partial plating with high accuracy, and a continuous partial plating method using the same.

  TAB (Tape Automated Bond) Tape, COF (Chip On Film) Tape, T-BGA (Tape Ball Grid Array) Tape, Tape CSP (Chip Size Package Electronic Parts), ASIC (Application Specific Tape) Has features such as fine, lightweight, thin, flexible, and high flexibility in circuit design, and is used in applications such as mobile phones, portable game machines, thermal heads, LCD drivers or mainframes. .

  For example, a TAB tape substrate has a very thin conductive layer on an insulating film support such as a continuous polyimide film, and this conductive layer is bonded to a metal foil, or is formed by sputtering, vacuum deposition or electroless plating. A wiring pattern having a predetermined thickness is formed by electroplating the conductive layer patterned in a predetermined shape. The polyimide film of the TAB tape has openings such as a sprocket hole for conveyance and a device hole for arranging semiconductor elements.

  When the bump of a semiconductor element such as LSI is a gold bump, gold plating is applied to a portion of the inner lead of the copper foil lead formed on the polyimide film that is thermocompression bonded to the gold bump. By performing the gold plating in this manner, the gold plating and the gold contained in the gold bump are melted together, and the connection reliability between the inner lead and the gold bump is improved. However, since gold is an expensive metal material, we want to reduce the amount used. Therefore, after forming the copper foil lead on the polyimide film, only a part of the copper foil lead is subjected to gold plating.

  In order to perform such partial plating, it is common to adhere an insulating masking material to a plating unnecessary portion of the TAB tape, and the masking material is peeled off from the TAB tape after plating (see Patent Document 1). ). However, since the used masking material cannot be reused, it must be discarded, and resources are wasted. In order to solve this problem, it has also been proposed that the masking material is looped, pressed against the TAB tape at the time of plating, separated from the masking material after use, and repeatedly used by washing and drying (see Patent Document 2). ). However, in such a system, although the productivity is increased, there is a problem that the plating accuracy is lowered due to the masking material being gradually deformed or damaged.

  By the way, semiconductor devices have been miniaturized and mass-produced, and the demand for wiring tapes such as the TAB tape has increased. Therefore, in order to efficiently produce the wiring tape in large quantities, a multi-strip wiring tape that simultaneously manufactures a plurality (multiple strips) of wiring tape on a wide insulating substrate has been developed. According to this multi-stripe wiring tape, for example, by using a wide insulating substrate having a width of 70 mm, two 35 mm wide wiring tapes can be manufactured together, and a wide insulating property having a width of 105 mm. If a base material is used, the same three can be manufactured collectively.

  However, the wide and multi-wiring wiring tape obtained in this way has an elongated strip-shaped portion for charging (feed line, slit) between each strip, and its area is more than several times that of the conventional one. Therefore, if gold plating on this part can be omitted, the cost can be further reduced. However, since the wiring tape is wide, the conventional method cannot stably transport the tape, and such partial plating is extremely difficult.

  The present applicant has previously developed and proposed a partial plating apparatus for plating a part of a terminal member with leads (see Patent Document 3). Since this partial plating apparatus is a dedicated apparatus for plating a part of the terminal member with leads, even if this is used, it is not possible to accurately perform gold plating on a part of the wide and large area wiring tape.

  Under such circumstances, it is possible to accurately perform partial plating on the copper foil inner leads at multiple locations without applying gold plating to the elongated strips for charging of the multi-stripe wiring tape, resulting in variations in plating quality. The appearance of a continuous partial plating apparatus that does not occur and can improve productivity at a low cost and a continuous partial plating method using the same are desired.

JP 2008-288406 A JP 2004-315916 A JP 2009-13466 A

  In view of the above-described conventional problems, the object of the present invention is to continuously convey a long and wide electronic component mounting film carrier tape (hereinafter also referred to as an electronic component mounting tape or simply a tape) continuous in the longitudinal direction. Another object of the present invention is to provide a continuous partial plating apparatus and a continuous partial plating method using the same, in which only a necessary portion for plating is stably plated.

  The inventors of the present invention have made extensive studies to solve the above problems, and arranged a large number of electrode nozzles so as to correspond to multiple copper foil inner lead portions where partial plating of electronic component mounting tape is required. By placing a masking material with a specific material and a specific structure on the outside of the electrode structure so that the plating solution does not hit any part other than the part that does not require partial plating, The present invention was completed by finding that gold plating on the elongated strips for charging existing between both ends and each strip can be omitted, and there is no variation in plating quality, and productivity can be improved at low cost. It came to do.

  That is, according to the first invention of the present invention, continuous partial plating for continuously plating a necessary portion of plating while continuously transporting a long and wide electronic component mounting tape continuous in the longitudinal direction. Rotating mask that rotates while carrying the electrode structure in which a large number of electrode nozzle holes are formed in the side plate having a wide anode area and ejecting the plating solution radially, and the tape itself serving as the cathode electrode And the mask rotating body serves as a masking material for preventing the plating solution from coming into contact with the plating unnecessary portion of the tape, and is arranged concentrically on the outer side of the electrode structure. A partial plating apparatus is provided.

According to a second aspect of the present invention, in the first aspect, the masking material covers a silicon rubber film on the surface of a glass-epoxy composite support. An apparatus is provided.
According to a third aspect of the present invention, there is provided the continuous partial plating apparatus according to the first aspect, wherein the masking material has a smooth surface polished on the side in contact with the tape. Is done.
According to a fourth aspect of the present invention, in the first aspect of the present invention, the tape pressing contact rotating body is further provided in the vicinity of the mask rotating body, and the tape is in close contact with the surface of the mask rotating body. A continuous partial plating apparatus is provided.

  On the other hand, according to the fifth invention of the present invention, using the continuous partial plating apparatus according to any one of the first to fourth inventions, a necessary part of a long and wide electronic component mounting tape continuous in the longitudinal direction. A partial plating method in which only gold is plated, and masking is performed from an electrode nozzle of an electrode structure in a power supply state while contacting the tape with an outer peripheral surface of a mask rotating body that rotates at a speed corresponding to the transport speed of the tape. A partial plating method characterized in that a partial gold plating is performed on a tape being continuously conveyed by ejecting a plating solution toward the member and conveying the tape in close contact with the surface of the mask rotating body. Is provided.

According to a sixth aspect of the present invention, there is provided the continuous partial plating method according to the fifth aspect, wherein the electronic component mounting tape is a polyimide film in which a plurality of copper foil leads are formed. Is done.
According to a seventh aspect of the present invention, there is provided the continuous partial plating method according to the fifth aspect, wherein the electronic component mounting tape has a width of 100 to 300 mm.
Furthermore, according to an eighth aspect of the present invention, there is provided the continuous partial plating method according to the fifth aspect, wherein the transport speed of the electronic component mounting tape is 3 to 80 mm / sec.

The continuous partial plating apparatus of the present invention employs a specific electrode structure that can take a wide anode area and eject a plating solution corresponding to the plating portion. It is possible to eliminate unevenness of the plating film thickness with respect to a wide tape that tends to be shifted in the circulation and current density distribution.
Further, according to the continuous partial plating apparatus of the present invention, since the plating solution can be uniformly sprayed to the necessary portions of the partial plating over a wide range of the upper and lower and left and right sides of the wide electronic component mounting tape, the current density distribution Therefore, there is an effect that the height of the film is not generated and the plating film thickness is constant.

Furthermore, since the continuous partial plating apparatus of the present invention is provided with a large number of windows having a specific shape on the masking material and covers the power supply wiring portion of the tape for mounting electronic components, the plating solution is in contact with other portions. Therefore, there is an effect of saving (saving money) the gold plating solution.
In addition, if the continuous partial plating apparatus of the present invention is used, the masking material becomes a mask rotating body, and the outer peripheral surface is in close contact with the wide electronic component mounting tape, so that the tape is less likely to be bent during plating, and uniform. The tape can be fed in a flat state, the productivity is remarkably increased, and the manufacturing cost can be greatly reduced.

It is sectional drawing of the electrode structure (drum) and mask rotary body which are the principal parts of the continuous partial plating apparatus of this invention. (A) is a perspective view of the electrode structure (drum) based on this invention, (B) is sectional drawing which shows the arrangement | positioning angle of an electrode nozzle. (A) is a perspective view of the mask rotary body (masking material) based on this invention, (B) is a longitudinal cross-sectional view and a partial side view. (A) is a top view of the rotary body for tape pressure welding which concerns on this invention, (B) is a side view containing the rotary body for tape speed adjustment. It is a perspective view which shows the state which the tape contact | abutted to the mask rotary body (masking material) which concerns on this invention. (A) Plan view of a general TAB tape, (B) Plan view of another wide (two-row) TAB tape.

  Hereinafter, the continuous partial plating apparatus of this invention and the continuous partial plating method using the same are demonstrated in detail using FIGS.

  The continuous partial plating apparatus of the present invention is a continuous partial plating apparatus for carrying out a plating process only on a necessary part of plating while conveying a long and wide electronic component mounting tape that is continuous in the longitudinal direction. A plurality of electrode nozzle holes are formed in a side plate having an area, and an electrode structure that ejects a plating solution radially, and a mask rotating body that rotates while conveying the tape itself serving as a cathode electrode, The mask rotating body is arranged concentrically outside the electrode structure as a masking material for preventing the plating solution from contacting the plating unnecessary portion of the tape.

1. Electrode structure In the present invention, an electrode structure is an apparatus component that supplies a plating solution to a portion of a wide electronic component mounting tape that requires partial plating, and a side plate having a wide anode area of a drum that serves as a plating solution storage tank A number of electrode nozzles are formed.

  That is, in the present invention, as shown in FIGS. 1 and 2, the electrode structure is a drum in which the upper and lower sides of the side plate 13 having a large anode area are surrounded by the disks 131 and 132, and the internal space is supplied. It serves as a reservoir for the plating solution, has a large number of electrode nozzle holes 133 in the side plate 13, and accurately injects the plating solution from the electrode nozzle holes 133 toward the wide electronic component mounting tape that is continuously conveyed. .

  In the present invention, the electrode structure (drum) is composed of a cylindrical side plate, an upper lid (disc) 131, a lower lid (disc) 132, and a pipe (rod-like body) 134. The material of the side plate, upper lid, lower lid and the like is appropriately selected from metal materials such as titanium, titanium alloy, and stainless steel, which are good electrical conductors, and is preferably made of titanium or titanium alloy having high corrosion resistance and mechanical strength.

  This electrode structure is manufactured by adopting a metal processing technique such as casting, forging, cutting, and polishing of a metal material. The side plate 13 is processed into a cylindrical shape by bending one plate-like body having a predetermined size. The vertical length (height) of the side plate 13 must be equal to or greater than the width of the electronic component mounting tape, and is preferably 100 to 330 mm, for example.

In the present invention, a large number of electrode nozzles 133 are arranged on the side plate 13 in multiple stages.
Each electrode nozzle hole 133 of the electrode structure corresponds to the number of tape plating patterns horizontally in a form extending in the normal direction of the virtual circular locus on the horizontal surface of the central height of the tape plating pattern for mounting the wide electronic component. The number of stages is arranged. If it is arranged in a zigzag pattern instead of being horizontal, plating on the electronic component mounting tape that is continuously conveyed becomes uneven, which is not preferable. The vertical cross-sectional shape of each electrode nozzle 133 is not particularly limited, but is a circle or a polygon that is equal to or greater than a quadrangle. A circular shape is particularly preferable from the viewpoint of workability and maintainability.

  The diameter of the electrode nozzle 133 is usually 0.1 mm to 2.5 mm, although it depends on the width of the tape, the size of the plating required portion, and the like. The diameter is preferably 0.2 mm to 2.0 mm, more preferably 0.3 mm to 1.5 mm. If the diameter is larger than 2.5 mm, the flow of the spray plating solution is not easily aligned. This is because the nozzle diameter may vary by several percent due to problems in manufacturing accuracy of the electrode nozzles. Therefore, the larger the diameter, the larger the variation in the cross-sectional area (diameter) of the jet liquid flow. On the other hand, if the diameter is less than 0.1 mm, the flow resistance in the nozzle becomes very large, so the pressure of the plating solution supplied to the electrode structure must be excessive. Disadvantageous.

  The number of electrode nozzles 133 is usually 10 to 200 per stage, although it depends on the size of the electrode structure. If the number of nozzles is less than 10, sufficient plating solution cannot be sprayed, and the power feeding efficiency can be improved as the number is increased. However, increasing the number of nozzles is more difficult in terms of processing technology.

  The plating solution stored in the drum of the electrode structure has the lowest potential energy at the top and the highest potential energy at the bottom. As a result, if the nozzle diameter is the same, the plating solution has a low injection speed from the electrode nozzle located at the uppermost part and a maximum injection speed from the electrode nozzle located at the lowermost part. Therefore, the number of electrode nozzles 133 is desirably changed depending on the height of the electrode structure on which the nozzles are provided so that the plating solution in the drum of the electrode structure does not become uneven in the vertical direction. For example, it is preferable that the number of nozzles in the lower part (lower stage) of the electrode structure side plate 13 is small and the number of nozzles in the upper part (upper stage) is increased. As a result, the plating pattern portion in the lower part of the tape has a small injection amount from the nozzle, but a sufficient amount of plating solution is supplied by the plating solution flowing down from the plating pattern part in the upper part.

  Specifically, in the case of three stages, 20 to 80 electrode nozzles located at the upper part, 10 to 50 electrode nozzles located at the middle part, and 8 to 20 electrode nozzles located at the lowermost part. Is preferred. As shown in FIG. 2, in the case of 6 stages, 30 to 100 electrode nozzles located at the uppermost part, 20 to 80 electrode nozzles located at the middle part, and 10 to 30 electrode nozzles located at the lowermost part. It is preferable to use one.

The arrangement interval (pitch) of the electrode nozzles 133 is related to the number of electrode nozzles described above, but is usually 1 mm to 30 mm, preferably 2 mm to 20 mm. It suffices if it is within this interval range, but it is desirable that the interval be equal in the lateral direction. When the pitch exceeds 30 mm, it is not preferable because the plating solution cannot be accurately sprayed onto the tape pattern. On the other hand, as the pitch is reduced, the actual power supply area per unit amount of the plating solution can be increased, but less than 1 mm. It is difficult in terms of processing technology.
For the above reason, the pitch of the electrode nozzle 133 varies depending on the height position of the nozzle. For example, the pitch of the lower part (lower stage) is wide and the pitch of the higher part (upper stage) is narrow.

  The electrode nozzle is formed by drilling a hole in the plate-like body serving as the side plate. In the present invention, FIG. 2A shows the case where the nozzle holes are formed in six stages, but the present invention is not limited to this, and the width of the workpiece (wide electronic component mounting tape) is not limited thereto. Increase or decrease accordingly.

In the electrode structure (anode), the side plate 13, that is, a wide portion of the side surface serves as a power feeding surface, but the inner surface (the entire inner wall surface of the small diameter hole) of the electrode nozzle hole 133 formed in the side plate also serves as the power feeding surface. In order to protect each electrode nozzle hole from oxidation and corrosion, it is desirable to have a coating made of an oxidation-stable and corrosion-resistant material such as a platinum-based metal compound on the inner surface of the hole.
In the present invention, examples of the platinum-based metal compound include platinum, palladium, iridium, ruthenium, oxides and nitrides thereof. Of these, platinum is preferable. The means for forming the coating is not particularly limited, but plating, sputtering, CVD, etc. are employed. The film thickness is 3 μm or more, and 5 to 10 μm is particularly preferable. If the film thickness is less than 3 μm, sufficient oxidation resistance and corrosion resistance cannot be expected, and as a result, a desired supply current amount cannot be obtained.

The arrangement angle range (θ) of the electrode nozzles 133 arranged in a horizontal row on the outer periphery of the cylindrical side plate 13 is smaller than the angle range in which the tape contacts the conveyance guide surface of the rotating body (θ). Selection is decided.
Inside the drum, not only does the plating solution spray easily change due to the turbulent flow and diffusion of the plating solution, but also the upper and lower parts of the necessary plating area if the tape is not in close contact with the transport guide surface. However, if the electrode nozzle arrangement angle range (θ) is used, such a phenomenon is eliminated.

  The angle range θ in which the electrode nozzle is disposed is 100 to 280 degrees, preferably 150 to 250 degrees, and more preferably 180 to 230 degrees. Within this angle range θ, the plating solution can be ejected in a uniform and sufficient amount with respect to the pattern portion of the tape.

  As described above, the side plate 13 of the electrode structure has a disk-shaped upper lid 131 at the upper portion and a lower lid 132 at the lower portion, and is connected and integrated with screws 135. The side plate 13 is preferably connected and fixed to the upper and lower lids with bolts 136 in a state where the distance between the side plates 13 is kept constant by a pipe (rod-like body) 134. The pipes (rod-like bodies) 134 are preferably provided at a plurality of locations.

2. Masking Material In the present invention, the masking material is a cylindrical jig that prevents the plating solution from coming into contact with the plating unnecessary portion of the electronic component mounting tape. As shown in FIG. Are arranged concentrically.

As shown in FIG. 3B, the masking material 21 includes a support 211 and an insulating film 212. For example, a glass epoxy composite in which a silicon rubber film is coated on a glass epoxy support surface is preferable.
The glass-epoxy composite material is FRP in which glass fibers are hardened with an epoxy resin, and the surface thereof is a silicon rubber film to which a silicone paint is applied. In addition to glass fibers, inorganic fibers such as carbon fibers or organic fibers such as aramid fibers may be used as the reinforcing material, and thermosetting resins or thermoplastic resins other than epoxy resins may be used as the matrix. An epoxy resin is preferable as a matrix because of good adhesion from the viewpoint of heat resistance, water resistance, solvent resistance, chemical resistance, dimensional stability, and the like. The glass fiber can be impregnated with an epoxy resin and cured in a mold, or formed into a pipe by drawing or extruding to form a support.

A prepreg in which glass fiber is impregnated with an epoxy resin and B-staged (a state in which a liquid thermosetting resin is dried and polymerized to some extent) is commercially available, and is used to wind it around a predetermined mandrel. If it is heat-cured, it can be easily formed into a cylindrical shape. It is also possible to impregnate a fiber bundle (strand or filament) with an epoxy resin, directly wind the filament on a mandrel at a certain angle, and then cure and mold.
Since the cylindrical shape molded by these methods is not smooth enough as it is, in order to obtain the roundness required for the use of a high-speed rotating body, surface polishing is performed after molding, and further crosslinking is performed. A silicone rubber solution is applied to form a silicon rubber film. It is preferable to perform surface polishing even after the silicon rubber film is formed. That is, in the present invention, the masking material is smoothened by polishing the surface in contact with the tape.

Since the silicon rubber film 212 is formed on the surface of the masking material 21, the friction coefficient of the surface is lowered, the friction with the tape is reduced, and the tape is smoothly transported, so that the plating solution can be mounted on the electronic component accurately. Can hit a predetermined part of the tape. Moreover, since the silicon rubber film is not corroded by the plating solution, the dimensional stability of the masking material is maintained.
The thickness of the masking material 21 shall be 0.6-5 mm. The thickness of the silicon rubber film 212 on the surface and the thickness of the glass epoxy composite material 211 serving as a support are appropriately set depending on the type of electronic component mounting tape, the arrangement of the tape plating pattern, and the like. For example, the thickness is about 0.3 to 1 mm in all cases, and 0.4 to 0.8 mm is preferable. When the interval between the tape plating patterns is narrow, the thickness of the glass epoxy composite material 211 serving as the support may be set to 1 to 5 mm so that the tape can be stably conveyed while maintaining the mechanical strength. preferable.

The masking material 21 must have a tunnel passage 213 (hereinafter referred to as a window) through which the plating solution can pass so that the plating solution can be supplied to the plating-required portion of the electronic component mounting tape. The shape and size of the window are substantially the same as the shape and size of the plating pattern, and it is desirable that the window exists on the entire circumference of the cylindrical object made of the masking material 21.
The window 213 is opened at a predetermined position of a cylindrical product formed by mixing glass fiber and epoxy resin by pressing or laser processing. As a result of this work, irregularities are generated in the cut portion, and the surface becomes rough, so that the convex portions are removed by surface polishing. If there is a convex portion in the window 231, the tape does not adhere to the masking material, so that the plating solution flows to the portion that does not require plating.
Note that FIG. 3 shows an electromask rotating body for continuous partial plating of a wide (two-row) TAB tape, so that three windows are approaching each of the upper and lower stages, and in the middle horizontal direction. A wide space is provided. According to the present invention, in such a case, it is possible to provide a wider space between each of the six windows in each row, whereby the portion that does not require plating can be enlarged, and the money saving effect is further enhanced. .

The masking material 21 is sandwiched between the upper and lower disks 214 and connected and fixed to each other with bolts 215 to form a hollow cylindrical body. The disk 214 is preferably made of titanium or a titanium alloy having corrosion resistance and high mechanical strength. The masking material 21 can be fixed at the central portion where the feeding wire for charging the tape comes into contact with the positioning pin 215.
The masking material 21 is arranged concentrically on the outer side of the side plate 13 of the electrode structure, and becomes a mask rotating body. If the vertical length of the masking material 21 is equal to the width of the electronic component mounting tape, it is sufficient because it can cover the partially plated portion of the tape. A dimension slightly larger than the outer peripheral radius of the side plate 13 is required.

  That is, the inner peripheral radius is set to be about 0.1 to 3 mm larger than the outer peripheral radius of the side plate 13 of the electrode structure so that the hollow cylinder (masking material 21) does not contact the side plate 13 of the electrode structure. There must be a gap between them. If the gap is 0.1 mm or less, it becomes difficult to transport the electronic component mounting tape. If the clearance exceeds 3 mm, the distance from the spray nozzle of the electrode nozzle 133 on the outer periphery of the side plate to the electronic component mounting tape is large. Thus, the sprayed plating solution is dispersed too much, resulting in insufficient partial plating.

3. Mask Rotating Body In the present invention, the mask rotator 18 is to carry a wide electronic component mounting tape in contact with its surface as a guide surface. In the present invention, it corresponds to the whole of the hollow cylindrical body (masking material), and this rotates at a predetermined speed and becomes a supply source of the transport power of the tape.

  The mask rotating body 18 is rotatably mounted via a bearing 25 on an upper portion of a rotating shaft centered on the Z axis. The mounting is not limited to this, and the lower plating solution supply pipe 15 may be rotatable via a bearing. Thereby, the outer peripheral surface of the mask rotating body (masking material) 18 having the silicon rubber film 212 is used as a conveyance guide surface, and the electronic component mounting tape T can be smoothly conveyed.

  The mask rotating body (masking material) 18 can be attached and detached by tightening and loosening by fixing it to the shaft member with a bolt 216, so that another mask rotating body (masking material) with different specifications can be easily replaced. can do.

  Since the electronic component mounting tape that is partially plated in the present invention has a wide width unlike a conventional one, the tape receives a larger impact force by the plating solution ejected from a large number of electrode nozzles 133. The silicon rubber film 212 on the surface of the masking material 21 does not float up, but the place where the plating solution is applied becomes inaccurate and may be supplied unevenly.

Therefore, in the present invention, as shown in FIG. 4A, it is desirable to provide a tape pressure contact rotating body 181 for bringing the tape into close contact with the surface of the mask rotating body 18 in the vicinity of the mask rotating body 18. .
The tape pressure contact rotary body 181 has a function in which the tape T in contact with the mask rotary body 21 pulls the tape to the electrode nozzle side with a force that is not defeated by the impact force of the plating solution jet, and adheres to the mask rotary body 21. It is. Therefore, the rotary body for tape pressure contact 181 is configured to sandwich the mask rotary body 18 on both sides of the mask rotary body 18. The positional relationship between the three rotators is preferably an equilateral triangle or an isosceles triangle when the rotation axis of the mask rotator 18 is connected to the rotation axis of another tape pressing rotator 181.

  The electronic component mounting tape that is partially plated in the present invention is wider than the conventional tape, so it is difficult to keep the conveyance speed constant in a vertically standing state, and the tape becomes slack when the conveyance speed is slow, On the other hand, when the conveying speed is increased, the tape is easily damaged and easily damaged. Further, when the impact force of the plating solution hitting the tape becomes unbalanced vertically, the tape position may fluctuate up and down. The tape pressing rotator 181 may have a function of correcting the variation in the position of the tape so that the tape to be plated does not swing up and down and left and right and is stably conveyed by the mask rotator 18. desirable.

In addition, a separate rotating body is arranged in front of the tape pressure rotating body 181 so as to automatically adjust the rotational speed of the mask rotating body when it is detected that the tape transport speed fluctuates beyond the set range. It is preferable to do. In FIG. 4B, for this purpose, three tape speed detecting rotators 182 are arranged, and an intermediate rotator is provided with a fulcrum 183 that can swing according to the slack of the tape. If the tape transport direction is the X direction, the direction in which the tape speed detecting rotating body 182 slides is the Y direction.
None of the tape pressure rotating body 181 and the tape speed detecting rotating body 182 need a tape transport function, but a lining such as silicon rubber is formed on the surface of the rotating body such as aluminum or polypropylene. Are preferred.

  The continuous partial plating apparatus of the present invention includes an electrode structure that ejects the plating solution and a masking material (rotary body) that transports the tape, and supplies the plating solution to the inside of the electrode structure. A plating solution supply means and a power supply device for supplying power to the electrode nozzle of the electrode structure are provided. The plating solution supply means includes a pressure circulation pump, piping, and valves (not shown).

4). Continuous Partial Plating Method The continuous partial plating method of the present invention is a partial plating method in which gold plating is applied only to a necessary portion of a long and wide electronic component mounting tape that is continuous in the longitudinal direction using the continuous partial plating apparatus. The plating solution is ejected from the electrode nozzle of the electrode structure in a power supply state toward the masking member while contacting the tape with the outer peripheral surface of the mask rotating body that rotates at a speed corresponding to the transport speed of the tape, In that case, partial gold plating is performed to the plating required area | region of the tape in continuous conveyance by conveying a tape in the state closely_contact | adhered to the surface of the mask rotary body.

In the present invention, the electronic component mounting film tape to be partially plated is a polyimide film in which a plurality of copper foil leads are formed. These include TAB tape, COF (Chip On Film) tape, T-BGA (Tape Ball Grid Array) tape, Tape CSP (Chip Size Package), and ASIC (Application Specific Integrated) tape.
In this electronic component mounting film tape, as shown in FIG. 6B, openings such as a sprocket hole 161 for transport and a device hole 165 for arranging semiconductor elements are opened to form a long and narrow strip for charging. A power supply line 164 is provided. Similarly to the TAB tape shown in FIG. 6A, interleads 163a to be plated with gold, outer leads 163b that do not require gold plating, test pads 163c, and the like are assembled.

  The width | variety of the tape for electronic component mounting films is 100-300 mm wider than the conventional tape. This is more than three times wider than the conventional single strip. The tape must be transported over a long distance in order to perform a series of processes including cleaning, plating, and post-processing, but it is difficult to stably transport the tape in such a wide width. However, if the tape width is within the above range, the continuous partial plating apparatus of the present invention can be used for transport without deteriorating the precision and productivity of plating.

  The tip of the electrode nozzle of the electrode structure is arranged at a position very close to the plating-necessary portion of the tape T in contact with the transport guide surface. The closer the both are, the more the power feeding efficiency can be improved. However, it is preferable to adjust the size of either the electrode structure or the mask rotating body that rotates while transporting the tape to 0.3 mm to 3.0 mm. . With this distance between the electrodes, there is no fear that the tip of the electrode nozzle is in contact with the mask rotating body, and sufficient plating accuracy can be obtained.

The relative positions of the mask rotating body and the electrode structure in the Z-axis direction are adjusted in advance so that the plating solution sprayed from each electrode nozzle can be sprayed to each plating-required portion of the tape being continuously conveyed.
The continuous transport means is a mask rotating body, and continuously transports the tape T previously wound around the feeding drum in the X direction at a set transport speed. The set conveyance speed of the tape T is not particularly limited, but is 3 to 80 mm / sec, preferably 5 to 60 mm / sec. If it is the tape conveyance speed of this range, the precision and productivity of plating will not be deteriorated. The tape T is conveyed in contact with the mask rotating body surface of the continuous partial plating apparatus in a state where the tape T stands vertically as shown in FIG. In the continuous partial plating apparatus, the plating solution is continuously pressurized and supplied to the electrode structure (plating solution supply port) from the continuous plating solution supply means.

The plating solution is sprayed from the electrode nozzle, passes through the window of the masking material, hits the pattern portion of the tape, and is subjected to a partial plating process. The flow rate of the plating solution sprayed from the electrode nozzle is difficult to define, but is preferably 5 m / sec to 20 m / sec. If it is this range, the liquid flow of a spraying plating solution will become a straight line, and a plating solution can be made to contact the plating pattern part of a tape.
In the actual plating process, the optimum flow rate of the plating solution is determined while reviewing the relationship with the diameter of the electrode nozzle, the type / viscosity of the plating solution, the material / size of the tape, and the like. In the present invention, since the plating solution is ejected all at once from a large number of electrode nozzles arranged in a concentrated area, a tape having a wide width receives a considerable impact by the ejection force. However, since the rotating body for tape pressure contact is disposed in the vicinity of the mask rotating body, the tape can be pulled to the electrode structure side, and the tape is kept in close contact with the mask rotating body.

The plating solution that passes through the window of the masking material and hits the tape flows down and is collected in the tank. The plating solution that has not passed through the window of the masking material is also collected in the same manner and removed from the dust, and then reused.
As mentioned above, the case where the method of the present invention is applied to an apparatus of a type in which the tape is conveyed in a vertically standing state has been shown. However, the method is similarly applied to an apparatus of a type in which the tape is conveyed in a horizontally lying state. it can.

  Examples of the present invention will be described below, but the present invention is not construed as being limited to these examples.

(First embodiment)
As shown in FIG. 1, the continuous partial plating apparatus of the present invention is formed so as to be capable of jetting radially from the electrode nozzle 133 while feeding a plating solution, and a mask rotating body 18 that can rotate around a base axis (Z axis). The stationary electrode structure 13 is attached to the apparatus main body.
Then, the plating solution sprayed from each electrode nozzle 133 is sprayed to each plating necessary portion of the tape being continuously conveyed in the X direction, and on the other hand, the masking material 21 constituting the mask rotating body 18 is used to make the plating unnecessary portion of the tape. The plating solution is not applied.

In the X direction, a plating solution storage tank, a plating solution recovery tank, and a cleaning tank are arranged, and a power supply roller that constitutes a part of the continuous power supply unit is disposed in the plating solution storage tank. The power supply roller is connected to a cathode terminal of a plating power supply device (not shown), and an anode terminal of the plating power supply device (not shown) is connected to the electrode structure. Thus, it is possible to supply power (for example, 1.5 A / dm ² ) to the tape T during continuous conveyance. A plurality of liquid draining means are provided in the plating solution storage tank, and a tape cleaning means is provided in the cleaning tank.

Using the continuous partial plating apparatus of the present invention in which the electrode nozzle has a three-stage electrode structure and the mask window has three rows of masking material as a rotating body, for example, a wide tape having a width of 105 mm is continuously applied at a speed of 30 mm / sec. When transported, the tape T is brought into close contact with the rotating body by the tape pressing rotating body installed in the vicinity of the mask rotating body, and the tape is pulled to the electrode structure side with a force that does not lose the impact force of the plating solution injection.
Further, when the plating solution is ejected from the three-stage electrode nozzle, the flow of the ejected plating solution is in a straight line. In this embodiment, when the electrode nozzle diameter is selected to be 0.3 mm, the pattern portion of the tape is plated by setting the flow rate of the plating solution to 5 to 15 m / sec. Since the power supply wiring portion of the tape provided in a strip shape is covered with the masking material, the plating solution does not hit this portion, so that gold plating is saved.
In addition, when the tape to be plated swings up and down, left and right, the rotating body for tape speed detection functions, and the tape is transported to the electrode structure side without sagging or being damaged by being pulled with a strong force. .

(Second Embodiment)
In this embodiment, the electrode structure and masking material of the continuous partial plating apparatus shown in the first embodiment are removed, and instead, an electrode structure having six electrode nozzles and six mask windows are masked. The material is attached and a wider tape is plated.

  Using a wide tape having a width of 320 mm, the continuous partial plating apparatus is continuously conveyed in the X direction at a conveying speed (25 mm / sec). Since the width of the tape becomes wider, the conveyance state becomes unstable. However, when the conveyance speed is reduced and the film is continuously conveyed at 25 mm / sec, the tape T to be plated by the rotary body for tape pressure contact placed near the mask rotary body. Is in close contact with the mask rotating body and the tape is pulled to the electrode structure side with a force not defeated by the impact force of the plating solution jet. It is conveyed without shaking. As a result, the tape does not sag or, on the contrary, is pulled and damaged by a strong force, and thus the gold plating can be applied to the tape with high accuracy as shown in the first embodiment. In addition, a TAB having good corrosion resistance and conductivity can be obtained without plating the power supply wiring portion of the tape provided in a strip shape between the steps.

DESCRIPTION OF SYMBOLS 10 Continuous partial plating apparatus 13 Electrode structure 133 Electrode nozzle 15 Plating solution supply port 16 Tape for electronic component mounting 18 Mask rotating body 181 Tape pressing rotary body 21 Masking material 211 Support body 212 Silicon rubber film 213 Window

Claims (8)

A continuous partial plating apparatus for carrying out a plating process only on a plating necessary portion while conveying a long and wide electronic component mounting tape continuous in the longitudinal direction,
A large number of electrode nozzle holes are formed in a side plate having a large anode area, and an electrode structure that ejects a plating solution radially and a mask rotating body that rotates while conveying the tape itself serving as a cathode electrode are provided. ,
A continuous partial plating apparatus, wherein the mask rotating body is disposed concentrically outside the electrode structure as a masking material for preventing a plating solution from contacting a plating unnecessary portion of the tape.   2. The continuous partial plating apparatus according to claim 1, wherein the masking material covers a surface of a glass epoxy composite support with a silicon rubber film.   The continuous partial plating apparatus according to claim 1, wherein the masking material has a smooth surface polished on the side in contact with the tape.   2. The continuous partial plating apparatus according to claim 1, further comprising a rotating body for tape pressure welding in which the tape is in close contact with the surface of the mask rotating body in the vicinity of the mask rotating body. A continuous partial plating method using the continuous partial plating apparatus according to any one of claims 1 to 4 to perform gold plating only on a necessary portion of a long and wide electronic component mounting tape continuous in a longitudinal direction. ,
The plating solution is ejected from the electrode nozzle of the electrode structure in the power supply state toward the masking material while the tape is in contact with the outer peripheral surface of the mask rotating body rotating at a speed corresponding to the transport speed of the tape. A continuous partial plating method characterized in that partial gold plating is performed on a tape being continuously conveyed by conveying the tape in a state of being in close contact with the surface of the mask rotating body.   6. The continuous partial plating method according to claim 5, wherein the electronic component mounting tape is a polyimide film in which a plurality of copper foil leads are formed.   6. The continuous partial plating method according to claim 5, wherein the electronic component mounting tape has a width of 100 to 300 mm. 6. The continuous partial plating method according to claim 5, wherein a conveying speed of the electronic component mounting tape is 3 to 80 mm / sec.

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