JP4587834B2 - Non-masking continuous partial plating equipment - Google Patents

Description

The present invention provides a plating method in which comb-like portions are selected while continuously conveying a workpiece having a strip-like common portion that is continuous in the longitudinal direction and a plurality of comb-like portions that are discontinuous in the longitudinal direction and extend in the width direction. The present invention relates to a non-masking type continuous partial plating apparatus for continuously performing plating on necessary portions.

  The workpiece to be processed shown in FIG. 6 is a work 1R having a continuous strip-like long object (for example, a lead frame) and a continuous plating required portion 1RY. In the case of such a workpiece 1R, the plating solution surface in the processing tank constituting the continuous partial plating apparatus is kept constant by using the adjusting plate, and the lower portion (the portion requiring plating) 1RY is conveyed while being immersed in the plating solution. For example, the plating process can be continuously performed only on the selected part (the plating required part) without performing the plating process on the plating unnecessary part 1RN.

  However, since it is almost impossible to eliminate the fluctuation of the plating solution level, it is difficult to improve the accuracy of the partial plating position (boundary). Further, in such a liquid level adjustment type continuous partial plating apparatus, for example, the intermediate plating unnecessary portion 1MN of the workpiece 1C shown in FIG. 8C (representing the state viewed from the plate thickness direction) is excluded. In addition, it is impossible to perform the plating process on both the lower plating required portion 1DY and the upper plating required portion 1UY sandwiching this in the vertical direction.

  Therefore, there is a case where a direct sticking masking method is adopted in which a tape or the like is attached (masking) to the plating unnecessary portion 1MN, and the tape or the like is peeled off after completion of the partial plating. However, the amount of tape purchased increases, and the tape application work and the peeling work are necessary, so that the production efficiency is greatly reduced and the production cost is increased. Since variations in tape application work, tape deformation, and the like occur, it is impossible to obtain positional accuracy of 3 to 2 mm or less, for example.

  Furthermore, a workpiece 1A having a plating-unnecessary portion 1UN, a plating-necessary portion 1MY and a plating-necessary portion 1DN shown in FIG. 8A, or a plating-necessary portion 1DY, a plating-necessary portion 1MN and a plating-necessary shown in FIG. When there is a large deformation (unevenness or bend) like the work 1B with the part 1UY, masking itself is difficult and difficult to adopt.

  On the other hand, a so-called indirect fixing masking method has been proposed (see Patent Document 1). The partial plating apparatus according to Patent Document 1 performs insulation masking on an unnecessary part of plating, discharges a plating solution from a nozzle and causes it to flow while infiltrating into a holding body layer (cloth, etc.) 10, and rotates the drum in this state. Thus, the liquid reservoir is formed at the portion in contact with the holding body layer, and the portion that needs to be plated can be partially plated while being immersed in the liquid reservoir. However, even if compared with the above-described liquid level control method and direct sticking masking method, a significant improvement in plating position accuracy cannot be expected for the high device cost. On the contrary, since the liquid flow in the longitudinal direction of the workpiece cannot be prevented and the holder layer is deformed, the positional accuracy is deteriorated as compared with the case of the direct sticking masking method.

  Furthermore, in the case of the direct pasting masking system and the indirect adhesion masking system (Patent Document 1), it is difficult to mask with a tape or a masking member. Inappropriate.

  In view of this, an apparatus has been proposed in which a space is formed between a plating-required portion and a masking member, and a plating solution is supplied into the space to perform a plating process on the plating-required portion (for example, Patent Document 2). That is, the mask member is fixed to the outer peripheral wall of the rotating drum, the metal strip is wound around the outer surface of the mask member, and the plating solution is supplied from the rotating drum through the masking member, while the inner surface of the metal strip is not on the masking member. Partial plating can be performed on a contact area (a part where plating is necessary).

  An apparatus having a similar concept and a movable masking member has also been proposed (see Patent Document 3 and Patent Document 4). The rotating drum and the rotating masking belt are brought into intimate contact with each other, and the plating solution is supplied to the space corresponding to the portion where the masking belt is not in contact with the workpiece wound around the rotating drum (the plating is necessary). In this structure, only part) is plated.

  However, even in the apparatuses according to Patent Documents 2, 3, and 4, since the plating solution is infiltrated between the masking material and the object to be processed, the boundary between the plating necessary part and the plating unnecessary part is partially. fluctuate. The accuracy requirements cannot be met. Since replacement of the masking belt or the like is necessary, the production cost increases. In addition, the plating film is damaged by press working after the plating treatment, so that the plating film is also scratched. This is a fatal defect in reducing product costs. In other words, it cannot be applied to the workpiece 1F having the discontinuous portion (1K) shown in FIG.

  Accordingly, the present applicant responds to the request to further reduce the size and complexity of the workpiece and to further improve the position accuracy of partial plating and to perform partial plating with high productivity and low cost. Has proposed a new non-masking system device (for example, Japanese Patent Application No. 2003-429635).

  The previously proposed apparatus has a workpiece (for example, a plurality of comb-like portions 1K that are discontinuous in the longitudinal direction and extend in the width direction, for example, a belt-like common portion 1C continuous in the longitudinal direction (left and right in the drawing) shown in FIG. (Lead frame, etc.) Based on a novel concept that pays attention to the relationship between the discontinuous form of 1F and the fluidity of the plating solution, and skillfully uses the space between the comb-like portions (1K) as the flow path of the plating solution.

  Specifically, an anode potential is applied and supplied to the plating solution supplied from the outside in the rotating electrode structure (90) rotating around the base axis, and the plating solution after the supply is supplied in the radial direction from the slit portion continuous in the entire circumferential direction. And a selected portion of the workpiece (1B) in the width direction that is necessary for plating [for example, 1UY or 1DY in FIG. 8B (in the case where the workpiece 1B is turned upside down for the second time, 1DY or 1UY) ], The plating solution can be sprayed only on the necessary parts for plating. Since the plating solution is not attached to the plating-unnecessary portion [barrier portion 1MN in FIG. 8B], a low-quality and unnecessary plating film that deteriorates the positional accuracy is not deposited. .

Thus, it is possible to produce a high-quality product by a stable plating process, to greatly improve the production efficiency and reduce the production cost, and to handle easily.
Japanese Patent Laid-Open No. 02-97692 JP 2002-38294 A JP-A-11-131284 JP 11-293489 A

  However, further improvement is necessary to meet the current demands for higher positioning accuracy, improved productivity, and higher quality assurance stability.

  That is, in the previously proposed apparatus of the present applicant, the plating solution jetted in the radial direction (radial direction) from the slit portion provided on the entire circumference (360 degrees) of the rotating body 30 is, for example, a hat circular ridge as a whole. It becomes a thin disk-shaped liquid thin film that spreads out toward the outside. However, if there is a pulsation of the supply plating solution, a fluctuation in the rotational speed of the rotating body 30, etc., the disc-shaped liquid thin film that should be horizontal over the entire circumference may partially cause disturbances in the vertical direction and the twist direction. possible. In retrospect, this is considered to be one cause of the occurrence of variations in plating quality (height position accuracy) that sometimes occurs.

  In addition, the plating solution adheres (contacts) to the work (1F) within a certain period of time before being brought into contact with the outer peripheral (guide) surface 33 of the rotating body 30 on the upstream side of the continuous conveyance, and plating is provided on the downstream side thereof. The plating solution adheres (contacts) even within a certain period after the non-contact state after the treatment. Although it is a short time, a defective plating process which is not normal is performed on the work part in contact with the plating solution. The plating quality at this time is low. This is also considered to be one cause of the occurrence of uneven plating quality (height position accuracy). However, it is physically impossible to guide the conveyance of the workpiece 1 </ b> F that is continuously conveyed around the entire circumference of the rotating body 30.

  Further, the plating solution is jetted from the inner side of the rotating body 30 through the rotating electrode structure 90 (liquid channel 95) and the rectifying liquid chamber 51S in the entire radial direction from one nozzle portion 52 that is continuous in the entire circumferential direction. With this structure, it is difficult to increase the power supply area per unit amount of the plating solution. Therefore, it is difficult to further improve the power supply efficiency.

  Furthermore, since the electrode structure 90 is a rotating structure that rotates synchronously with the rotating body 30, it is a factor that suppresses productivity improvement due to a one-stage rotation speed increase of the rotating body 30. Even if the rotational speed of the rotator 30 is increased as much as possible, there is a risk of insufficient power supply. Abandonment of high-speed rotation is equivalent to abandonment of device miniaturization.

  An object of the present invention is to provide a continuous partial plating apparatus capable of reliably and stably performing partial plating processing with high position accuracy.

The present invention solves the above technical problems at a stroke as a result of tests and research including actual operation of a non-masking type continuous partial plating apparatus according to the previous proposal (Japanese Patent Application No. 2003-429635). It is. That is, the present invention allows the plating solution to be ejected vigorously in the radial direction from a plurality of small-diameter electrode nozzles provided on the cylindrical and stationary electrode structure within a certain angular range in the circumferential direction. Formed so as not to cause vertical disturbance, the workpiece being continuously conveyed is engaged with the rotating body and is contacted with the plating solution only after reaching the position corresponding to the electrode nozzle and is not engaged with the rotating body. It is formed so as to avoid contact with the plating solution by cutting the contact with the plating solution before and unnecessary plating treatment, and the power supply area per unit amount of the plating solution can be increased by passing multiple electrode nozzles. It is formed so as to be able to improve the power supply efficiency by increasing it, and in addition to the staticization of the electrode structure, it is formed so as to increase the rotational speed of the rotating body.

Specifically, the non-masking-type continuous partial plating apparatus according to the first aspect of the invention includes a belt-shaped common portion that is continuous in the longitudinal direction and a plurality of comb-like portions that are discontinuous in the longitudinal direction and extend in the width direction. It is a non-masking type continuous partial plating device for continuous plating of the parts that need to be plated in the comb-shaped part while continuously transporting the processed object, and is engaged with the object to be processed on the outer peripheral surface side. A rotating body on which a guide guide for conveyance is formed and which can rotate at a rotation speed corresponding to the conveyance speed of the object to be processed around a base axis in a vertical state, and a circumferential direction of a virtual circular locus around the base axis A cylindrical shape having a plurality of small-diameter hole-shaped electrode nozzles spaced apart from each other and capable of supplying power to the plating solution supplied to the inside and spraying the supplied plating solution in the radial direction from each electrode nozzle Still And an electrode structure of the state provided, disposed angle range of the electrode nozzle object to be treated is selected smaller than the angle range in engagement with the conveying guide surface of the rotating body, the rotating body and around the base axis The electrode member is detachably attached to an upper portion of a shaft member that is rotatably mounted on the outer side of the hollow cylindrical body that is a stationary structure, and the base axis of the shaft member. It is possible to adjust the relative position of the rotating body and the electrode structure in the base axis direction by adjusting the position of the direction , and plating is necessary during continuous conveyance of the plating solution sprayed from each electrode nozzle at the adjusted relative position ready to be blown in the portion is provided a work position holding unit for holding an object to be processed, characterized in that.

Further, the non-masking-type continuous partial plating apparatus according to the invention of claim 2 is a continuous transport from a housing space in which the rotating body can accommodate the electrode structure, and an electrode nozzle of the electrode structure housed in the housing space. A plating solution flow path capable of flowing a plating solution sprayed toward a necessary portion of the plating inside, and a conveyance guide surface sandwiching the plating solution flow channel in the base axis direction, a conveyance upper guide surface, and a conveyance lower guide surface Formed from .

Further, in the invention of claim 3, the diameter of the electrodes nozzles are selected from among 0.1 mm to 1.0 mm.

According to the first aspect of the present invention, the non-masking method and the continuous partial plating process can be performed while spraying the plating solution from the electrode nozzle of the stationary electrode structure. In addition, it can be performed stably, has high power supply efficiency and high production efficiency, and can promote downsizing of the apparatus. Furthermore, the relative position of the stationary electrode nozzle and the necessary plating part during continuous conveyance can be easily and reliably performed. Moreover, it is easy to replace the mounted electrode structure with an electrode structure having different specifications.

Further, according to the invention of claim 2, the same effect as in the case of the invention of claim 1 can be obtained, and each end portion in the width direction of the work (object to be processed) is applied to each conveyance guide surface. Since it can touch, the posture of the workpiece can be secured more accurately and stably.

Second Correction According to the invention of claim 3 , in addition to having the same effects as those of the inventions of claims 1 and 2 , it is possible to select an electrode nozzle in accordance with the size of the plating required portion. It is much easier and can reliably prevent unnecessary plating treatment on unnecessary parts.

(First embodiment)
As shown in FIGS. 1 to 4, the non-masking type continuous partial plating apparatus 20 includes a rotating body 30 that can rotate around a base axis (Z axis) in a vertical state shown in FIG. 1 and a plurality of electrode nozzles 53. And a stationary electrode structure 50 formed to be capable of injecting a fed plating solution Qf in the radial direction, and an arrangement angle range of the electrode nozzle is related to the conveyance guide surface 32 of the rotating body. The rotating body is rotatably mounted outside the stationary structure (hollow cylindrical body 24) centered on the base axis, and the electrode structure is fitted inside the hollow cylindrical body. It is detachably attached to the upper part of the mounted shaft member 27 and is adjusted so that the relative position in the base axis direction of the rotating body and the electrode structure can be adjusted by adjusting the position of the shaft member in the base axis direction. It is injected from the electrode nozzle at a relative position The object to be treated a plating solution W ready to be sprayed in order Kki necessary portion in a continuous conveying the work position holding portion 34 for holding a (work) provided with a plating solution Qf injected from each electrode nozzle 53 It is formed in a non-masking system structure that can be sprayed on each plating-required portion 1KY during continuous conveyance and can be subjected to continuous partial plating.

  First, a processed material includes a strip-shaped common portion 1C that is continuous in the longitudinal direction (left and right in FIG. 7) shown in FIGS. 4 and 7 and a plurality of combs that are discontinuous in the longitudinal direction and extend in the width direction (vertical direction). A lead frame (work 1F) having a tooth-like portion 1K is provided. The form seen from the plate | board thickness (longitudinal cross section) direction of the workpiece | work 1F in conveyance is shown in FIG.

  In FIG. 4, a concave curve that expands outward via a horizontal portion 1H (a plating unnecessary portion 1HN) on the tip side (upper side in FIG. 2, lower side in FIG. 4) of the comb-like portion 1K of the work 1F. Part 1M (plating-unnecessary part 1MN) is formed and a part 1T after turning is formed. A selected portion of the comb-like portion 1K is a portion requiring plating (1KY and 1TY).

  That is, in the state shown in FIG. 2, the inner surface side of the comb-like portion 1K set so as to be sprayable with the spray plating solution Qf having a circular longitudinal section is the plating-necessary portion 1KY, and other portions 1H (1HN) other than this are necessary. ), 1M (1MN), 1T (1TY) and the belt-like common portion 1C are unnecessary portions for plating. In the case where the received portion 1T is to be a portion requiring plating (1TY), the setting posture with respect to the conveyance guide surface 32 is changed. Alternatively, the partial plating jig (20) itself is replaced.

  Incidentally, each dimension shown in FIG. 4 is very small. That is, the total length Lv of the lead-equipped terminal member (1K) is 2 mm, the length Lu of the lead portion (1KY) is 1 mm, the length Lm of the barrier portion (1MN) is 0.5 mm, and the protruding length Lw is 1.5 mm. The length Ld of (1TY) is 0.5 mm.

  In this way, a plurality of comb-like portions extending in the width direction (vertical direction) in a discontinuous state spaced apart at a constant pitch in the longitudinal direction in the workpiece 1F created by pressing a single strip in advance. Since partial plating treatment is performed on 1K (1KY), for example, in the case of the conventional example shown in FIG. 6 (after partial plating is performed on a narrow stripe-like plating-required portion 1RY continuous in the longitudinal direction, press working is performed, and FIG. Compared to the case of individual products as shown in Fig. 4, the production efficiency can be greatly improved, and burrs and film peeling during press working do not occur, and the film quality can be maintained well.

  In addition, nickel plating is given to the work 1F as a whole, and the partial plating on the plating-required portion is gold plating. Of course, the type (metal type) of partial plating is not limited to these.

  In FIG. 1, in the case of this embodiment, the continuous partial plating processing system 10 is configured such that four continuous partial plating apparatuses 20 are incorporated in the main tank 11, and each of the continuous partial plating apparatuses 20A to 20D is installed. It is just an example utilized as a head for partial plating thru | or a jig for partial plating (20).

  The workpiece 1 </ b> F is continuously conveyed in the workpiece conveyance (X) direction by continuous conveyance means 70 including guide rollers 71 disposed in the main tank 11. The upstream tank 12U, the main tank 11, the cleaning tank 14, and the downstream tank 12D are arranged in this order in the X direction.

In the upstream tank 12U and the downstream tank 12D, a power feeding roller 91 that constitutes a part of the continuous power feeding means 90 is disposed. The feeding roller 91 is connected to a cathode terminal of a plating power supply device (not shown), and an anode terminal of the plating power supply device (not shown) is connected to the electrode structure 50 shown in FIG. Thus, it is possible to supply power (for example, 1.5 A / dm ² ) to the workpiece 1F (1C) during continuous conveyance.

  A plurality of liquid draining means 16 are provided in the main tank 11, and a work cleaning means is provided in the cleaning tank 14.

  In the continuous conveyance means 70, a conveyance roller (not shown) urges the belt-like common portion 1C to continuously convey the workpiece 1F in the X direction at a set conveyance speed (for example, 2 m / sec). The workpiece 1F is subjected to partial plating while passing through the continuous partial plating apparatuses 20A to 20D in the main tank 11.

  The continuous plating solution supply means (80) includes a pressure circulation pump, piping and valves (not shown), and applies a predetermined pressure to the electrode structure 50 (plating solution supply port 51) of each of the partial plating jigs (20A to 20D). A pressurized plating solution is continuously supplied. Further, the plating solution recovered from the main tank 11 and each of the other tanks 12U, 14 and 12D is recirculated and used.

  In addition, you may form a continuous plating solution supply means (80) for every jig for partial plating (continuous partial plating apparatus 20A-20D).

  Moreover, the continuous partial plating apparatus 20 which can perform a continuous partial plating process can also be constructed | assembled using the jig | tool (20) for partial plating. However, if it is constructed as a continuous partial plating system using a plurality of continuous partial plating apparatuses (partial plating jigs) 20 as in this embodiment, the plating film thickness can be increased. In addition, it is not necessary to excessively increase the power supply capacity of each continuous partial plating apparatus 20, and miniaturization can be promoted. Since the replacement of the device 20 is simple, continuous production can be secured.

  In FIG. 2, the rotating body 30 has a hollow cylindrical shape as a whole, has a conveyance guide surface 32 that can be guided by engagement with the workpiece 1F on the outer peripheral surface side, and the conveyance speed of the workpiece 1F around the Z axis. It is formed so as to be rotatable at a rotation speed corresponding to.

  The rotating body 30 is rotatably mounted via a bearing 25 on the outer side of the hollow cylindrical body 24 fixed to the base 24 around the Z axis. The outer peripheral surface of the integral upright cylindrical portion 31 is a conveyance guide surface 32, and engages with the inside of the belt-like common portion 1C of the workpiece 1F to facilitate the conveyance of the workpiece 1F.

A bowl-shaped portion (upper surface portion) 33 provided below the conveyance guide surface 32 has a function of holding the position of the workpiece 1F in the vertical direction by supporting the end portion of the workpiece 1F. A portion 34 is formed. That is, the work position holding unit 34 adjusts the relative position in the base axis direction of the rotating body 30 and the electrode structure 50 by adjusting the position of the shaft member 27 in the base axis direction, which will be described later. The workpiece (work 1F) can be held in such a state that the plating solution W sprayed from can be sprayed onto the plating-necessary portions during continuous conveyance.

  As shown in FIG. 3 (transverse cross section), the electrode structure 50 has a plurality of small-diameter hole-shaped electrode nozzles 53 that are spaced apart from each other in the circumferential direction of a virtual circular locus R centering on the Z axis. A plating solution Qf formed from a good conductor and capable of supplying power to the plating solution supplied to the inside (plating solution storage section 52) and supplied with the plating solution Qf can be ejected from each electrode nozzle 53 in the radial direction. Each electrode nozzle 53 is configured to extend in the normal direction of the virtual circular locus R.

  In the electrode structure 50, at least the inner side surface that can contact the plating solution supplied from the continuous plating solution supply means (80) to the plating solution holding unit 52 in FIG. 2 is formed as a power supply surface made of a good electrical conductor. Just do it. It is not always necessary that the whole is a good electrical conductor.

  On the other hand, in this embodiment, the inner surface of each electrode nozzle 53 (the entire inner wall surface of the small-diameter hole) also forms an important power supply surface. Compared to the case of a previously proposed apparatus that supplies power from a power supply surface (parallel wall surface) facing in the vertical direction, the actual power supply area per unit amount of the plating solution can be increased efficiently. For this reason, the power supply efficiency is high, and it is possible to promote the speeding up of the plating process by increasing the current supply.

  Moreover, if the diameter (radial) direction dimension of the power feeding nozzle 53 formed in the nozzle forming portion 56 shown in FIG. 2 is increased, the power feeding efficiency can be improved. Further, the closer the nozzle tip edge 54 is to the plating required portion 1KY of the work 1F engaged with the conveyance guide surface 32, the more the power feeding efficiency can be improved.

  As shown in FIG. 3, the arrangement angle range θ of the electrode nozzle 53 is larger than the angle range in which the work 1F engages with the conveyance guide surface 32 of the rotating body 30 (in the case of FIG. 3, 180 degrees is shown). The small angle range (θ) is selected and determined. This is in order to solve one problem of the previously proposed apparatus which is a uniform jet method for the entire circumference of the plating solution in the radial direction. That is, the workpiece 1 </ b> F passing through the position is unspecified due to turbulent flow or diffusion of the plating solution generated at a place not engaged with the conveyance guide surface 32 (upstream position PTNU and downstream position PTND in FIG. 3). It eliminates the phenomenon that an unnecessary and poor quality plating film is deposited on the portion (particularly, the upper and lower portions of the plating required portion 1KY... 1C, 1HN · 1MN).

  Here, regarding the diameter of the electrode nozzle 53 and the flow rate of the spray plating solution, it is preferable to select unique and exceptional values that are significantly different from those of the conventional partial plating apparatus and the previously proposed apparatus.

  That is, the diameter of each electrode nozzle 53 is selected from 0.1 mm to 1.0 mm. In this embodiment, a plating solution flow Qf having a dimension (diameter: 0.3 mm in this embodiment) corresponding to the size of the necessary plating portion 1KY (the larger one in the front-rear direction dimension and the left-right direction dimension) is generated and jetted. For this purpose, it is selected to be 0.3 mm. In this sense, a diameter exceeding 1.0 mm can be selected.

  However, if a relatively large diameter exceeding 1.0 mm is selected, the liquid flow straightness of the spray plating solution tends to be lost. That is, due to a problem in manufacturing accuracy of each electrode nozzle 53, a variation within a certain range (several percent) in the diameter may occur, but a change in diameter (absolute value) due to the variation becomes relatively large. In other words, the larger the absolute value, the greater the variation in the cross-sectional area (diameter) of the jet liquid flow, so that it is difficult to ensure the plating position accuracy. On the other hand, if the diameter is less than 0.1 mm, the flow resistance in the nozzle becomes very large. Naturally, the pressure of the plating solution supplied to the electrode structure 50 (51, 52) must be excessive. This excessive increase in fluid pressure causes a great technical and economic disadvantage in constructing the entire apparatus. Thus, the diameter of each electrode nozzle 53 should be selected from 0.1 mm to 1.0 mm. For more stable implementation, it is preferable to select from 0.3 mm to 0.6 mm.

  The flow rate of the plating solution Qf sprayed from the electrode nozzle 53 is selected from 5 m / sec to 20 m / sec. This is to ensure the liquid flow straightness of the spray plating solution. This is because the problem similar to that in the case where the diameter of the electrode nozzle 53 is excessively large is less than 5 m / sec, and the problem similar to that in the case where the diameter of the electrode nozzle 53 is excessively small is likely to exceed 20 m / sec.

  In practice, the optimum value should be determined while reviewing the relationship between the diameter of the electrode nozzle 53, the type / viscosity of the plating solution, the form / rigidity of the workpiece 1F, and the like. In this embodiment, when the diameter of the electrode nozzle 53 is selected to be 0.3 mm, good results can be obtained by setting it to 10 ± 5 m / sec.

The relative positions of the rotating body 30 and the electrode structure 50 in the Z-axis direction are held in such a state that the plating solution Qf sprayed from each electrode nozzle 53 can be sprayed to each plating required portion 1KY that is being continuously conveyed. In this embodiment, the electrode structure 50 is attached to the upper part of the shaft member 27 fitted inside the hollow cylindrical body 24, and the rotating member 30 and the electrode structure are adjusted by adjusting the position of the shaft member 27 in the Z-axis direction. The position relative to the body 50 in the Z-axis direction can be adjusted. The relative position between the electrode nozzle 53 of the electrode structure 50 and the plating required portion 1KY (work 1F) guided by the rotating body 30 can be easily and reliably performed.

  Since both the hollow cylindrical body 24 and the shaft member 27 are stationary structures different from the movable structure (rotating body 30), for example, the position of the shaft member 27 with respect to the position of the hollow cylindrical body 24 is shifted in the vertical direction and fixed. It is easy and the implementation of the means is very simple. For example, the structure may be such that the pin member on the hollow cylindrical body 24 side is inserted into one horizontal hole selected from a plurality of horizontal holes provided in the shaft member 27 in different vertical installation positions.

Further, the electrode structure 50 can be attached to and detached from the shaft member 27. In this embodiment, it can be attached and detached by tightening and loosening the bolt 29 shown in FIG. Another electrode structure 50 having a different specification or the like of the electrode nozzle 53 can be easily replaced. That is, it is easy to replace the mounted electrode structure 50 with an electrode structure 50 having different specifications. From this point of view as well, the applicability is wide with respect to the type and form of the workpiece and the size of the necessary plating part.

  The fed plating solution Qf sprayed from each electrode nozzle 53 is sprayed to the plating-required portion 1KY in FIG. 2 to perform a partial plating process. After that, it passes through the comb-like portion 1K shown in FIG. 7 (a gap in the left-right direction), falls, flows and is collected in the main tank 11. After that, it is recycled.

  On the upper side of the electrode structure 50, a stationary structure (cover member 36) having a form corresponding to the rotating body 30 on the lower side is provided. This eliminates the danger of miscontacting the rotating body 30 from above. Furthermore, in this embodiment, a hanging cylindrical portion 37 is provided at a position corresponding to the rising cylindrical portion 31 of the rotating body 30, and the lower tip is formed so as to be used as an auxiliary electrode.

Thus, the rotating body 30 that can rotate around the base axis in the vertical state according to the first embodiment and the plurality of electrode nozzles 53 are formed so that the fed plating solution Qf can be ejected in the radial direction. The electrode nozzle arrangement angle range is selected to be smaller than the angular range in which the object to be processed is engaged with the conveyance guide surface 32 of the rotating body, and the rotating body has a base axis. The electrode structure is rotatably attached to the outer side of the hollow cylinder 24 as the center and the electrode structure is detachably attached to the upper part of the shaft member 27 fitted on the inner side of the hollow cylinder. By adjusting the position, the relative position of the rotating body and the electrode structure in the base axis direction can be adjusted, and the plating solution W sprayed from each electrode nozzle is sprayed onto the plating-required portion during continuous conveyance at the adjusted relative position. State that can Since a continuous partial plating apparatus 20 of the non masking method in which a work position holding portion 34 for holding the object to be processed (work), along with a high positional precision parts plating performed reliably and stably, power supply efficiency and Productivity is high and downsizing of the device can be promoted. Furthermore, the relative position of the stationary electrode nozzle and the necessary plating part during continuous conveyance can be easily and reliably performed. Moreover, it is easy to replace the mounted electrode structure with an electrode structure having different specifications.

  Moreover, since the diameter of the electrode nozzle 53 is selected to be 0.3 mm according to the size of the plating required portion 1KY, it is possible to reliably prevent unnecessary plating treatment on the plating unnecessary portions (1MN, etc.). In addition, since the flow rate of the spray plating solution is selected to be high speed (10 ± 5 m / sec), it is possible to spray the plating required portion 1KY more accurately and then through the space (gap) between the comb-like portions to the outside. Can be discharged smoothly. There is no contamination due to the plating solution adhering to and around the electrode structure 50.

  Further, there is a problem in the case of the previously proposed apparatus in which the plating solution is jetted from the slit portion provided on the entire circumference (360 degrees) of the rotating body 30 (in the vertical direction on the disk-shaped liquid thin film that should be horizontal over the entire circumference). And turbulence / diffusion in the torsional direction can be eliminated), so that a high-quality and uniform film can be deposited with high quality without variation (high plating accuracy in the height position direction).

  Further, the prior proposal that the plating solution adheres (contacts) to the workpiece 1F within a certain period of time before being engaged with the outer peripheral surface (32) of the rotating body 30 and after being disengaged after the plating process. It is possible to eliminate the problem of the apparatus (a phenomenon in which a highly uneven and low quality and unnecessary plating film is deposited) can be eliminated.

  Furthermore, compared to the case where the plating solution is uniformly jetted from one nozzle part continuous in the entire circumferential direction to the entire circumference in the radial direction (the previously proposed device), the power supply area per unit amount of the plating solution is reduced. Since it can be increased easily, the power supply efficiency can be greatly improved, and it is also beneficial for speeding up production.

  Furthermore, since the electrode structure 50 is formed in a stationary type that is different from the rotary type of the previously proposed device (the electrode structure that rotates synchronously with the rotary body), the rotation speed of the rotary body 30 is greatly increased by one stage. Productivity improvement can be expected. The downsizing of the device can be promoted.

(Second Embodiment)
This second embodiment is shown in FIG. In this embodiment, the basic configuration and function of the continuous partial plating apparatus (20) are the same as those in the case of the first embodiment (FIGS. 1 to 4), but the rotating body 30 corresponds to the work form. It is formed in the structure made.

  The workpiece 1F has a side shape (1F... 1C, 1K) as shown in FIG. 7, and a shape in the plate thickness direction is a shape (1A) as shown in FIG. In FIG. 8C, the plating required portion 1DY, the plating unnecessary portion 1MN, and the plating required portion 1UY are arranged in this order. In this embodiment, as shown in FIG. It is assumed that the order is 1DN, plating-necessary portion 1MY, and plating-unnecessary portion 1UN.

  In FIG. 5, the rotating body 30 is directed from the accommodation space 39 </ b> S capable of accommodating the electrode structure 50 and the electrode-needed portion 53 of the electrode structure 50 accommodated in the accommodation space 39 </ b> S toward the plating-necessary portion 1 </ b> MY being continuously conveyed. A plating solution channel 39H through which the plating solution Qf sprayed can be circulated, and the conveyance guide surface 32 includes a conveyance upper guide surface 32U and a conveyance lower guide surface 32D sandwiching the plating solution channel 39H in the Z-axis direction. Is formed.

  In this embodiment, the rotating body 30 is a combination of a pair of upper and lower rotating bodies 30U and 30D, both of which are rotatably mounted on the upper and lower hollow cylindrical portions 24U and 24D via bearings 25U and 25D. Has been. The hollow portion of the upper hollow cylindrical portion 24U is used as the plating solution supply port 51.

Thus, the plating unnecessary portions 1DN and 1UN sandwiching the plating required portion 1MY of the workpiece 1F up and down are engaged with the corresponding conveyance guide surfaces 32U and 32D . That is, since each end portion in the width direction of the workpiece (object to be processed) can be brought into contact with each conveyance guide surface, the posture of the workpiece 1F can be more accurately and stably continuously conveyed. It is more effective for the work 1F having the long comb-like portion 1K.

  Of course, as in the case of the first embodiment, the partial plating process with high positional accuracy can be performed reliably and stably, the power supply efficiency and the production efficiency are high, and the downsizing of the apparatus can be promoted.

  INDUSTRIAL APPLICABILITY The present invention is extremely useful when a partial plating process is performed without masking on a workpiece after pressing (for example, a lead frame) having a belt-like common portion continuous in the longitudinal direction and a plurality of discontinuous comb-like portions. It is.

It is a top view for demonstrating the whole structure of the continuous partial plating system which concerns on the 1st Embodiment of this invention. Similarly, it is a longitudinal sectional view for explaining the main part of the continuous partial plating apparatus. Similarly, it is a cross-sectional view based on the arrow line AA in FIG. 2 for explaining the electrode structure and the electrode nozzle. It is a figure for demonstrating the plating necessity part and plating unnecessary part of a workpiece | work. It is a longitudinal cross-sectional view for demonstrating the principal part of the continuous partial plating apparatus which concerns on the 2nd Embodiment of this invention. It is a figure for demonstrating the to-be-processed object (work) of a continuous shape. It is a figure for demonstrating the discontinuous shape to-be-processed object (workpiece | work) which has a comb-tooth shaped part. It is a figure for demonstrating each illustration of the plating required part of a workpiece | work, and a plating unnecessary part.

Explanation of symbols

1 Workpiece (object to be processed)
1C Belt-like common part 1K Comb-like part N Plating unnecessary part Y Plating necessary part 10 Continuous partial plating system 11 Main tank 20 Continuous partial plating apparatus 24 Hollow cylindrical body 27 Shaft member 30 Rotating body 32 Conveying guide surface (outer peripheral surface)
32U Transport upper guide surface 32D Transport lower guide surface 34 Work position holder
39H plating solution flow path 50 Electrode structure 53 Electrode nozzle 54 Nozzle tip edge 70 Continuous conveyance means 80 Continuous plating solution supply means 90 Continuous power supply means 91 Power supply roller (cathode electrode)
Z Vertical axis (base line)

Claims (3)

Continuously plating a workpiece having a strip-like common portion continuous in the longitudinal direction and a plurality of comb-like portions discontinuous in the longitudinal direction and extending in the width direction while continuously plating the plating-needed portions of the comb-like portion. Non-masking type continuous partial plating equipment for processing,
A rotating body that has a conveying guide surface that can be guided by being engaged with the object to be processed on the outer peripheral surface side, and that can rotate at a rotation speed corresponding to the conveying speed of the object to be processed around a base axis in a vertical state When,
Each electrode nozzle has a plurality of small-diameter-shaped electrode nozzles spaced apart in the circumferential direction of a virtual circular locus centering on the base axis, and can supply power to the plating solution supplied to the inside and supply the supplied plating solution to each electrode nozzle. A stationary electrode structure with a cylindrical shape formed so as to be capable of jetting in the radial direction from
The arrangement angle range of the electrode nozzle is selected to be smaller than the angle range in which the workpiece is engaged with the conveyance guide surface of the rotating body,
The rotating body is rotatably mounted on the outer side of the hollow cylindrical body that is a stationary structure centered on the base axis, and the electrode structure is detachably attached to the upper part of the shaft member fitted on the inner side of the hollow cylindrical body. It is attached, and by adjusting the position of the shaft member in the base axis direction, the relative position in the base axis direction of the rotating body and the electrode structure can be adjusted, and sprayed from each electrode nozzle at the adjusted relative position . provided work position holding unit for holding an object to be processed in a state capable of spraying a plating solution W in the plating necessary parts during continuous conveyance, the continuous partial plating system of the non-masking scheme. In claim 1,
The rotating body circulates a receiving space in which the electrode structure can be stored, and a plating solution sprayed from the electrode nozzle of the electrode structure stored in the receiving space toward a plating necessary portion during continuous conveyance A non-masking type continuous partial plating apparatus having a possible plating solution flow path, wherein the conveyance guide surface is formed of a conveyance upper guide surface and a conveyance lower guide surface that sandwich the plating solution flow channel in the base axis direction. . In either claim 1 or 2,
A non-masking type continuous partial plating apparatus in which the diameter of the electrode nozzle is selected from 0.1 mm to 1.0 mm .

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