JP2021165423A - Partial plating device - Google Patents

Abstract

To provide a partial plating device capable of applying plating only to one surface of a plating object.SOLUTION: A partial plating device 30 comprises an electrolytic solution circulation structure 31 comprising an electrolytic solution circulation passage disposed therein, and a plating object transfer structure 32 transferring a plating object P. The electrolytic solution circulation passage comprises a slit shaped window 317 disposed between an electrolytic solution expanding passage 314 and an electrolytic solution narrowing passage 315 to open toward outside of the electrolytic solution circulation structure 31. The plating object transfer structure 32 transfers the plating object P along the window 317 while allowing an area a1 on one face of the plating object P to face the window 317.SELECTED DRAWING: Figure 8

Description

The present invention relates to a partial plating apparatus that applies plating only to necessary parts of an object to be plated.

Conventionally, in electronic parts and the like, plating may be applied only to a part of necessary parts. For example, in electrode terminal parts and the like, by partially plating Au only on the contact points, the amount of Au used for plating can be reduced, which can contribute to cost reduction.

In Patent Document 1, a plating solution supply cell and a plating solution recovery cell are arranged so as to face each other across a moving path of the object to be plated, and the object to be plated is formed in a plating solution flow path formed between both cells. A partial plating apparatus for partially plating an object to be plated by passing a part thereof is disclosed.

Japanese Unexamined Patent Publication No. 2015-157984

Since Patent Document 1 has a configuration in which a part of the object to be plated is passed through the plating solution flow path, plating is performed on four surfaces of the front and back surfaces of the object to be plated and the wall surface connecting them. That is, it is not possible to plate only one surface of the object to be plated. For this reason, when the object to be plated has only one surface that requires plating, the plating metal (for example, Au) is used extra by plating the unnecessary parts, which increases the cost. There's a problem.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a partial plating apparatus capable of partially plating only one surface of an object to be plated.

In order to solve the above problems, the partial plating apparatus of the present invention is a partial plating apparatus that plating only a part of an object to be plated, and has an electrolytic solution circulation portion having an electrolytic solution circulation path inside. A part of the electrolytic solution circulation path is provided with a slit-shaped window portion that is open to the outside of the electrolytic solution circulation portion. The object to be plated is characterized in that the object to be plated can be conveyed along the window while the plating region on one surface of the object to be plated faces the window. ..

According to the above configuration, in the object to be plated that is conveyed by the object to be plated, only the plating region on one surface of the object to be plated is brought into contact with the electrolytic solution flowing through the electrolytic solution circulation path through the window portion. Can be done. As a result, partial plating can be applied to only one surface of the object to be plated.

Further, in the partial plating apparatus, the electrolytic solution circulation path has an arcuate portion in a part thereof, and the window portion is provided on the outer peripheral side of the arcuate portion in the electrolytic solution circulation path. Can be configured as

According to the above configuration, since the window portion is provided on the outer peripheral side of the arcuate portion, the electrolytic solution after passing through the window portion flows away from the surface of the object to be plated in the normal direction. Therefore, it becomes difficult for the electrolytic solution to wrap around from the plating region on the surface of the object to be plated to the side surface or the back surface, and unnecessary plating on the object to be plated can be suppressed.

Further, the partial plating apparatus may be configured to include an electrolytic solution suction portion for generating an attractive force of the electrolytic solution on the downstream side of the window portion in the electrolytic solution circulation path.

According to the above configuration, by generating a suction force of the electrolytic solution on the downstream side of the window portion, the electrolytic solution is suppressed from coming into contact with the area other than the plating area of the object to be plated, and unnecessary plating on the object to be plated is performed. It can be suppressed more effectively.

Further, in the partial plating apparatus, the electrolytic solution circulation portion is an edge on the upstream side in the flow direction of the electrolytic solution in the window portion, and the corner portion on the surface in contact with the electrolytic solution circulation path has a corner radius. It can be configured to be formed in.

According to the above configuration, by providing the corner radius at the edge of the window portion, the electrolytic solution flowing near the window portion is drawn toward the object to be plated by the Coanda effect generated by the corner radius, and the object to be plated is subjected to. Plating can be performed reliably.

In the partial plating apparatus of the present invention, only the plating region on one surface of the object to be plated is brought into contact with the electrolytic solution flowing through the electrolytic solution circulation path through the window portion, so that partial plating is performed on only one surface of the object to be plated. It has the effect of being able to be applied.

It shows one Embodiment of this invention, and is the front view which shows the appearance of the electrolytic solution supply device and the partial plating apparatus which are the main part of a plating system. It is a vertical sectional view of the electrolytic solution supply device. It is a perspective view of the partial plating apparatus. It is a vertical sectional view of a partial plating apparatus. It is a perspective view which shows the transport form of the object to be plated in a partial plating apparatus. An example of the shape of the object to be plated is shown, and is an enlarged perspective view of the object to be plated. It is an enlarged perspective view of the plating execution place in a partial plating apparatus. It is an enlarged cross-sectional view of the plating execution place in a partial plating apparatus. It is a vertical sectional view of the ejector used as an electrolytic solution suction device. It is the schematic which shows an example of a plating system.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. First, the configuration of the main part in the plating system 10 (details will be described later) to which the present invention is applied will be described. FIG. 1 is a front view showing the appearance of the electrolytic solution supply device 20 and the partial plating device 30 which are the main parts of the plating system 10.

The plating system 10 includes an electrolytic solution supply device 20 and a partial plating device 30. The electrolytic solution supply device 20 is a device that continuously supplies a constant amount of electrolytic solution to the partial plating device 30. The partial plating apparatus 30 has an electrolytic solution circulation function and an object transfer function. That is, the partial plating apparatus 30 circulates the electrolytic solution supplied from the electrolytic solution supply device 20 along a predetermined electrolytic solution circulation path. Further, the partial plating apparatus 30 performs partial plating on the object to be plated P by transporting the object to be plated P (see FIG. 6) while exposing a part (plating region) to the electrolytic solution circulation path. Hereinafter, each of the electrolytic solution supply device 20 and the partial plating device 30 will be described in detail.

[Electrolytic solution supply device 20]
FIG. 2 is a vertical cross-sectional view of the electrolytic solution supply device 20. The electrolytic solution supply device 20 has an inflow chamber 21, a supply chamber 22, and a discharge chamber 23, each of which is extended in the vertical direction.

The inflow chamber 21 has a liquid inflow port 211 connected to the pump 50 (see FIG. 10). That is, the electrolytic solution sent by the pump 50 flows into the inflow chamber 21 from the liquid inflow port 211. In FIG. 2, the liquid flow inlet 211 is provided on the bottom surface of the inflow chamber 21, but the liquid flow inlet 211 may be provided on the side surface of the inflow chamber 21.

The supply chamber 22 is arranged so as to be adjacent to the inflow chamber 21 and the discharge chamber 23 in a plan view, and a first partition wall 24 is provided between the supply chamber 22 and the inflow chamber 21, and the supply chamber 22 and the discharge chamber 22 are discharged. A second partition wall 25 is provided between the chamber 23 and the chamber 23. A liquid supply port 221 for supplying the electrolytic solution to the partial plating apparatus 30 is provided on the bottom surface of the supply chamber 22. A liquid discharge port 231 for discharging the electrolytic solution excessively supplied to the electrolytic solution supply device 20 is provided on the bottom surface of the discharge chamber 23. Further, the upper surface of the electrolytic solution supply device 20 is covered with a lid 26 for preventing evaporation of the electrolytic solution.

In the electrolytic solution supply device 20, the electrolytic solution sent to the inflow chamber 21 by the pump 50 flows through the first partition wall 24 into the supply chamber 22. At this time, if the flow rate of the electrolytic solution sent to the inflow chamber 21 by the pump 50 is equal to or higher than a predetermined flow rate, the liquid level in the supply chamber 22 reaches the height of the second partition wall 25, and the excess electrolytic solution is the first. 2 Overflows to the discharge chamber 23 side beyond the partition wall 25. Then, the electrolytic solution supply device 20 can continuously supply a constant amount of the electrolytic solution from the liquid supply port 221 as long as the liquid level in the supply chamber 22 is maintained at the height of the second partition wall 25. That is, when the liquid level height in the supply chamber 22 is h (m) and the flow path area in the liquid supply port 221 is A (m ^{2 ), the flow rate Q (m 3) of the} electrolytic solution supplied from the liquid supply port 221. / S) is represented by the following equation (1). In equation (1), g is the gravitational acceleration (9.8 m / s ² ), and C is a flow coefficient determined by the density and viscosity of the electrolytic solution.

In the electrolytic solution supply device 20, if the flow rate of the electrolytic solution supplied by the pump 50 is larger than the flow rate Q in the state where the liquid level in the supply chamber 22 is maintained at the height of the second partition wall 25, the flow rate Q is constant. Can be maintained in quantity. At this time, the excess electrolytic solution in the supply of the pump 50 overflows from the supply chamber 22 beyond the second partition wall 25 to the discharge chamber 23 side, so that the liquid level height in the supply chamber 22 is set to the height of the second partition wall 25. Be maintained. The electrolytic solution that overflows to the discharge chamber 23 side is discharged to the outside of the electrolytic solution supply device 20 from the liquid discharge port 231. The electrolytic solution discharged from the liquid discharge port 231 can be circulated so as to be sent to, for example, the control tank 52 (see FIG. 10) and sent from the control tank 52 to the inflow chamber 21 again by the pump 50.

In the electrolytic solution supply device 20, it is preferable that the bottom surface position of the inflow chamber 21 is sufficiently higher than the bottom surface position of the supply chamber 22. This is to reduce the volume of the inflow chamber 21 so that the electrolytic solution is not excessively accumulated in the electrolytic solution supply device 20. Further, in FIG. 2, the bottom surface position of the discharge chamber 23 is set to be the same height as the bottom surface position of the supply chamber 22, but these do not have to be the same height.

As described above, in the electrolytic solution supply device 20, the flow rate Q can be controlled to be constant by fixing the liquid level h in the supply chamber 22 and the flow path area A of the liquid supply port 221. Further, the flow rate Q can be adjusted by making the liquid level height h or the flow path area A variable. The flow path area A can be easily adjusted by, for example, attaching a flow rate adjusting valve to the liquid supply port 221 and changing the opening degree of the flow rate adjusting valve. The liquid level height h can be adjusted by changing the height of the second partition wall 25. To change the height of the second partition wall 25, for example, the second partition wall 25 is configured by stacking a plurality of partition wall plates in the height direction, and by changing the number of partition wall plates to be used, the second partition wall 25 is changed. The height of the can be changed. Alternatively, a part of the second partition wall 25 may be a movable plate that can slide in the height direction, and the height of the second partition wall 25 can be changed by sliding the movable plate.

The flow rate control of the electrolytic solution by the electrolytic solution supply device 20 does not require feedback control using a flow rate sensor or the like. Therefore, the response delay due to the feedback control does not occur, and the flow rate fluctuation of the flow rate Q can be extremely reduced. Further, the electrolytic solution supplied by the pump 50 flows from the inflow chamber 21 through the first partition wall 24 into the supply chamber 22, and then is supplied from the liquid supply port 221 of the supply chamber 22. Therefore, it is possible to prevent the hydraulic pressure from being pulsated by the pump 50 in the electrolytic solution supplied from the liquid supply port 221.

[Partial plating apparatus 30]
FIG. 3 is a perspective view of the partial plating apparatus 30. FIG. 4 is a vertical cross-sectional view of the partial plating apparatus 30.

The partial plating apparatus 30 is roughly configured to include an electrolytic solution circulation structure (electrolyte solution circulation unit) 31 and a material to be plated structure (material to be plated) 32. In FIG. 4, the electrolytic solution circulation structure 31 is shown by hatching with diagonal lines rising to the right, and the object transport structure 32 to be plated is shown with hatching with diagonal lines falling to the right.

The electrolytic solution circulation structure 31 has an electrolytic solution inlet 311 and an electrolytic solution outlet 312, and has an electrolytic solution circulation path inside the electrolytic solution inlet 311 and an electrolytic solution outlet 312. Have. The electrolytic solution circulation path is composed of an electrolytic solution introduction path 313, an electrolytic solution diffusion path 314, an electrolytic solution contraction path 315, and an electrolytic solution discharge path 316.

The electrolytic solution inlet 311 is provided on the upper surface of the partial plating apparatus 30, and is connected to the liquid supply port 221 of the electrolytic solution supply device 20. As a result, the partial plating apparatus 30 is adapted to continuously supply a constant amount of the electrolytic solution from the electrolytic solution supply device 20. The electrolytic solution outlet 312 is provided in the lower part of the partial plating apparatus 30, and the electrolytic solution after circulating in the electrolytic solution circulation path is discharged from the electrolytic solution outlet 312 to the outside of the partial plating apparatus 30.

The electrolytic solution circulation structure 31 has a substantially circular shape in a plan view, and the electrolytic solution introduction path 313 is provided in the central portion of the electrolytic solution circulation structure 31 along the vertical direction. The electrolytic solution diffusion path 314 is formed so as to radiate along the horizontal direction from the lower end of the electrolytic solution introduction path 313. That is, the electrolytic solution diffusion path 314 is formed so as to expand in a fan shape having a central angle of about 180 degrees from the center of the electrolytic solution circulation structure 31 toward the outer peripheral edge in a plan view.

The electrolytic solution contraction path 315 contracts the electrolytic solution circulation path radially expanded in the electrolytic solution diffusion path 314 from the outer peripheral edge of the electrolytic solution circulation structure 31 toward the center. That is, the electrolytic solution contraction path 315 is formed in a fan shape having a central angle of about 180 degrees so as to overlap the electrolytic solution diffusion path 314 in a plan view. In FIG. 4, the electrolytic solution diffusion path 314 and the electrolytic solution contraction path 315 are provided in the right region of the figure. The electrolytic solution discharge path 316 is connected to the downstream end portion (the central side end portion of the electrolytic solution circulation structure 31) of the electrolytic solution contraction path 315, extends along the vertical direction, and then breaks in the horizontal direction. An electrolytic solution outlet 312 is provided on the side surface of the electrolytic solution circulation structure 31.

Further, the electrolytic solution diffusion path 314 and the electrolytic solution contraction path 315 are connected in the vicinity of the outer peripheral edge of the electrolytic solution circulation structure 31 so as to invert the electrolytic solution circulation path in a U shape when viewed from the horizontal direction. There is. That is, the electrolytic solution circulation path is formed in an arc shape near the outer peripheral edge of the electrolytic solution circulation structure 31. Then, at the inverted portion (arc-shaped portion) of the electrolytic solution circulation path, the slit-shaped window portion 317 extending along the circumferential direction and opening to the outside of the electrolytic solution circulation structure 31 is formed in the electrolytic solution circulation path. It is formed on the outer peripheral side. Although the details will be described later, the object P to be plated in the partial plating apparatus 30 is partially in contact with the electrolytic solution through the window portion 317, and is partially plated.

The object transport structure 32 to be plated is arranged so as to be superposed on the upper part of the electrolytic solution circulation structure 31 (specifically, the upper part of the electrolytic solution diffusion path 314 and the electrolytic solution contraction path 315), and is the center of the electrolytic solution circulation structure 31. It can be rotated around the axis as a rotation axis. The object to be plated 32 can convey the object P to be plated in the partial plating apparatus 30 along the window portion 317 of the electrolytic solution circulation structure 31 by its rotation. That is, the object to be plated P is partially plated while being conveyed along the window portion 317.

More specifically, as shown in FIG. 5, in the partial plating apparatus 30, the partial plating apparatus 30 is continuously arranged around the window portion 317 of the electrolytic solution circulation structure 31 (a large number of pieces are continuously arranged in the transport direction). The connected object P to be plated is transported. The object to be plated 32 conveys the object to be plated P by applying a conveying force to the object to be plated P which is continuously arranged by its rotation. The continuously arranged object P to be plated is separated into individual pieces after being plated. As for the conveying force to the continuously arranged object P to be plated, the conveying force may be directly applied to the continuously arranged object P to be plated, or the conveying force may be applied to the object P to be plated via a conveying belt or the like. May be given.

Subsequently, a method of plating the object to be plated P by the partial plating apparatus 30 will be described in detail with reference to FIGS. 6 to 8. FIG. 6 shows an example of the shape of the object to be plated P, and is an enlarged perspective view of the object to be plated P. FIG. 7 is an enlarged perspective view of a plating implementation portion in the partial plating apparatus 30. FIG. 8 is an enlarged cross-sectional view of a plating execution portion in the partial plating apparatus 30. For convenience of explanation, the transport belt 40 is not shown in FIGS. 7 and 8, and only one object P to be plated is illustrated in FIG. 7 as an example.

In the object P to be plated, the region a1 shown in FIG. 6 is a plating region to which partial plating is applied. Here, in the object to be plated P, the surface having the region a1 is the surface of the object P to be plated, and the surface opposite to the surface having the region a1 is the back surface of the object P to be plated. As shown in FIG. 7, when the object to be plated P is arranged at the plating execution location of the partial plating apparatus 30, the surface of the object to be plated P is directed toward the partial plating apparatus 30, and the region a1 has an electrolytic solution circulation structure. It faces the window portion 317 of the body 31. At this time, the region a1 (front surface) of the object to be plated P comes into contact with the electrolytic solution through the window portion 317, but the back surface of the region a1 and the side surface connecting the front surface and the back surface do not come into contact with the electrolytic solution. Therefore, the partial plating apparatus 30 can perform plating only on one surface which is the surface of the object P to be plated.

In the object to be plated P arranged at the plating implementation location, not only the region a1 but also the region a2 shown in FIG. 6 faces the window portion 317. However, the region a2 of the object to be plated P is arranged radially away from the electrolytic solution circulation path as compared with the region a1. Therefore, if the flow rate of the electrolytic solution by the partial plating apparatus 30 is appropriately controlled, it is possible to prevent the electrolytic solution from coming into contact with the region a2, and it is possible to perform partial plating only on the region a1. Further, on the surface of the object to be plated P, the regions other than the region a1 and the region a2 are in contact with the outer surface of the electrolytic solution circulation structure 31 and are not opposed to the window portion 317, so that they are in contact with the electrolytic solution. No, and no plating is applied.

At the plating implementation location in the partial plating apparatus 30, as shown in the upper drawing of FIG. 8, a + (plus) potential is applied to a member facing the window portion 317 across the electrolytic solution circulation path to serve as an anode electrode. .. On the other hand, the object to be plated P is given a − (minus) potential, and the object to be plated P is used as a cathode electrode. As a result, the object to be plated P is efficiently plated in a short time by the electrolytic plating method. Further, while the object P to be plated is conveyed along the window portion 317, the distance between the anode and the cathode is constant, and a plating film having a stable film thickness can be formed with respect to the object P to be plated. ..

Further, as shown in the lower drawing of FIG. 8, at the upper edge (upstream edge in the flow direction of the electrolytic solution) in the window portion 317, the surface on the side in contact with the electrolytic solution circulation path (contact surface with the object to be plated P). The corner portion 318 on the opposite surface) is formed so as to have a corner R (corner radius). In this way, by providing the corners R at the corners 318, the electrolytic solution flowing near the window 317 is generated at the corners R of the corners 318 by the Coanda effect (the effect of attracting the jet of viscous fluid to the nearby wall). It is drawn to the object to be plated P side, and the object to be plated P can be reliably plated (the electrolytic solution is surely brought into contact with the object to be plated P). In other words, if the corner portion 318 is not provided with the corner R, the electrolytic solution cannot be reliably brought into contact with the object to be plated P, and the region a1 of the object to be plated P may not be plated.

Further, in order to perform good partial plating on the object to be plated P, it is important that the electrolytic solution is brought into contact with only the region a1 of the object to be plated P and not with other parts. For example, when the electrolytic solution comes into contact with the region a2 of the object to be plated P through the window portion 317, or when the electrolytic solution wraps around from the area a1 of the object to be plated P to the side surface or the back surface of the object to be plated P. , Unnecessary plating is generated on the object to be plated P. When a large amount of unnecessary plating is generated on the object P to be plated, the amount of the plating metal (for example, Au) used in the object P to be plated increases, and the effect of cost reduction by partial plating decreases.

The partial plating apparatus 30 has an arcuate portion in a part of the electrolytic solution circulation path, and the window portion 317 is provided on the outer peripheral side of the arcuate portion. Therefore, the electrolytic solution after passing through the window portion 317 flows away from the surface of the object to be plated P in the normal direction, and the electrolytic solution flows from the region a1 of the object to be plated P to the object to be plated P. It becomes difficult to wrap around to the side or back. As a result, unnecessary plating on the object to be plated P can be suppressed.

Further, in order to suppress unnecessary plating on the object to be plated P, it is effective to generate an attractive force of the electrolytic solution on the downstream side of the window portion 317 (that is, the electrolytic solution shrinkage path 315). If the suction force of the electrolytic solution is generated in the electrolytic solution contraction path 315, it is more effective that the electrolytic solution comes into contact with the region a2 of the object to be plated P and the electrolytic solution wraps around the side surface or the back surface of the object to be plated P. Can be suppressed.

In order to generate the suction force of the electrolytic solution in the electrolytic solution contraction path 315, it is conceivable to connect the electrolytic solution suction device (electrolytic solution suction unit) 33 to the electrolytic solution outlet 312 of the electrolytic solution circulation structure 31. Of course, the electrolytic solution suction device 33 can also be regarded as a part of the partial plating device 30. As the electrolytic solution suction device 33, for example, a general-purpose ejector as shown in FIG. 9 can be used. When the ejector of FIG. 9 is used for the electrolytic solution suction device 33, a negative pressure is generated in the port Po2 by connecting the port Po2 of the ejector to the electrolytic solution outlet 312 and flowing the electrolytic solution from the port Po1 to the port Po3. , A suction force can be applied to the electrolytic solution contraction path 315 via the electrolytic solution discharge path 316. This suction force can be adjusted by changing the flow rate of the electrolytic solution flowing through the ports Po1-Po3 (increasing the AC flow rate also increases the suction force). Further, as shown in the upper drawing of FIG. 8, since the member serving as the anode electrode facing the window portion 317 is formed in an arc shape (U-shape) when viewed from the horizontal direction, the window portion is also formed in this portion. The Coanda effect can be generated in the electrolytic solution that has passed through 317, and the suction of the electrolytic solution in the electrolytic solution contraction path 315 can be assisted.

In the partial plating apparatus 30, by appropriately adjusting the flow rate of the supplied electrolytic solution and the suction force of the electrolytic solution suction device 33, it is possible to perform good partial plating on the object to be plated P. If the flow rate of the electrolytic solution is small or the suction force is too strong, the electrolytic solution does not come into contact with the region a1 of the object to be plated, and the required partial plating is not applied to the object P to be plated. It will be easier. Further, when the flow rate of the electrolytic solution is large or the suction force is too weak, the electrolytic solution comes into contact with an unnecessary region of the object to be plated P (in some cases, the electrolytic solution is ejected from the window portion 317). ), Unnecessary partial plating of the object to be plated P is likely to occur.

[Plating system 10]
FIG. 10 is a schematic view showing an example of the plating system 10 according to the present embodiment. The plating system 10 includes pumps 50 and 51 and a control tank 52 in addition to the electrolytic solution supply device 20, the partial plating device 30, and the electrolytic solution suction device 33 described above.

As shown in FIG. 10, the liquid inflow port 211 of the electrolytic solution supply device 20 is connected to the control tank 52 via the pump 50. As a result, the electrolytic solution is supplied from the control tank 52 to the liquid inflow port 211 by the pump 50. The liquid discharge port 231 of the electrolytic solution supply device 20 is connected to the control tank 52, and the electrolytic solution discharged from the liquid discharge port 231 is returned to the control tank 52.

In the electrolytic solution suction device 33, the port Po2 is connected to the electrolytic solution outlet 312, and the port Po1 and the port Po3 are connected to the control tank 52. Further, the pump 51 is arranged between the control tank 52 and the port Po1 (or between the control tank 52 and the port Po3), and the electrolytic solution can flow from the port Po1 to the port Po3. That is, in the electrolytic solution suction device 33, the electrolytic solution flowing in from the port Po1 and the port Po2 both flows out from the port Po3 and is returned to the control tank 52.

The embodiments disclosed this time are examples in all respects and do not serve as a basis for limited interpretation. Therefore, the technical scope of the present invention is not construed solely by the above-described embodiments, but is defined based on the description of the claims. It also includes all changes within the meaning and scope of the claims.

10 Plating system 20 Electrolyte supply device 21 Inflow chamber 211 Liquid inflow port 22 Supply room 221 Liquid supply port 23 Discharge chamber 231 Liquid discharge port 24 1st partition wall 25 2nd partition wall 30 Partial plating device 31 Electrolyte solution circulation structure (electrolyte solution) Circulation part)
311 Electrolyte inlet 312 Electrolyte outlet 313 Electrolyte introduction path (electrolyte circulation path)
314 Electrolyte diffusion path (electrolyte circulation path)
315 Electrolyte contraction path (electrolyte circulation path)
316 Electrolyte discharge path (electrolyte circulation path)
317 Window part 318 Square part 32 Plated object transfer structure (plated object transfer unit)
33 Electrolyte suction device (electrolyte suction part)
40 Conveyance belt 50, 51 Pump 52 Control tank P Object to be plated

Claims (4)

A partial plating device that plating only a part of the object to be plated.
An electrolytic solution circulation section having an electrolytic solution circulation path inside,
It is provided with an object to be plated to convey the object to be plated.
The electrolytic solution circulation path has a slit-shaped window portion opened to the outside of the electrolytic solution circulation portion in a part thereof.
The partial plating apparatus is characterized in that the object to be plated can be conveyed along the window while the plating region on one surface of the object to be plated faces the window. .. The partial plating apparatus according to claim 1.
The electrolytic solution circulation path has an arcuate portion in a part thereof.
A partial plating apparatus characterized in that the window portion is provided on the outer peripheral side of the arc-shaped portion in the electrolytic solution circulation path. The partial plating apparatus according to claim 1 or 2.
A partial plating apparatus comprising an electrolytic solution suction portion for generating an electrolytic solution suction force on the downstream side of the window portion in the electrolytic solution circulation path. The partial plating apparatus according to any one of claims 1 to 3.
The electrolytic solution circulation portion is characterized in that the edge on the upstream side in the flow direction of the electrolytic solution in the window portion is formed so that the corner portion on the surface on the side in contact with the electrolytic solution circulation path has a corner radius. Partial plating equipment.

Images