JP2003221698A - Plating apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To transfer a plating solution to a filter located outside a plating tank through a flow of the plating solution without retaining the plating solution at the bottom of the plating tank and depositing foreign matters, and to prevent the foreign matters at the bottom of the plating tank from diffusing and being raised by liquid flow to the proximity of an object to be plated. <P>SOLUTION: The plating tank has a divider having penetrating holes for dividing the upper and lower tank parts, a first plating solution inlet established on the lower tank part of a side wall of the plating tank, a second plating solution inlet established on the upper tank part of the side wall with the first inlet and a plating solution outlet at the lower tank part of a side wall that faces the side wall with the first and the second inlets. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating apparatus, and more particularly to a plating apparatus used in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art Generally, a plating apparatus is provided with a plating solution stirring mechanism in order to form a plating layer having a uniform thickness on an object to be plated. For example, Japanese Patent Laid-Open No. 2000-2568
As a stirring mechanism, Japanese Patent Publication No. 91 describes a circulation mechanism of a plating solution by a stirring propeller fan provided inside the plating tank or a pump provided outside the plating tank. In addition, in the manufacturing process of a semiconductor device, the plating process is used for forming electrodes and wiring patterns of the semiconductor device, and the plating film to be formed is thin, uniform, and fine. When foreign matter is mixed in, it causes a defect in the semiconductor device. However, since the plating solution is agitated as described above, foreign matter generated in the plating solution may come into contact with the object to be plated and mix into the plating film. A means for removing foreign matters in the plating solution generated inside the plating tank is indispensable. Japanese Unexamined Patent Application Publication No. 2000-256891 describes that a filter is provided in the circulation path of the plating solution as a means for removing foreign matter.

[0003]

In general, foreign matter generated in the plating solution is deposited on the bottom of the plating bath, which floats when the plating solution is stirred and adheres to the surface of the object to be plated. That is, in the circulation type plating apparatus described in Japanese Patent Application Laid-Open No. 2000-256891, the foreign matter deposited on the bottom of the plating tank collects the plating solution from the opening of the plating solution supply pipe provided in the plating tank. The liquid flow to the opening at the bottom is carried to the filter outside the plating tank and removed. However, there is a problem in that some of the foreign substances diffuse into the plating solution in the plating tank and adhere to the surface of the object to be plated, causing plating failure. Particularly, in the vicinity of the part where the side wall and the bottom part are joined in the plating tank, the plating solution is retained, and the foreign matter is likely to be accumulated. When the accumulated amount of the foreign matter is large, the foreign matter diffuses into the plating solution or is wound up. However, there has been a problem that plating defects due to adhesion of foreign matter on the surface of the object to be plated increase.

The present invention has been made in order to solve the problems of the conventional plating bath as described above, and eliminates the portion where the plating solution stays at the bottom of the plating bath and accumulates the foreign substances that collect at the bottom of the plating bath. The foreign matter can be transferred to the filter outside the plating tank without causing the foreign matter to collect, and the foreign matter collected at the bottom of the plating tank diffuses to the vicinity of the object to be plated or is wound up by the liquid flow. It is an object of the present invention to provide a plating apparatus that can prevent the occurrence of damage.

[0005]

A first plating apparatus according to the present invention comprises a plating tank, a partition plate which divides the plating tank into an upper tank portion and a lower tank portion, and which has a through hole, A first inlet of the plating solution is provided in a portion of the side wall of the plating tank below the partition plate, and a portion of the side wall having the first inlet is provided above the partition plate. A second inlet of the plating solution and a portion of a side wall of the plating tank opposite to the side wall provided with the first inlet and the second inlet are provided below the partition plate. An outlet for the plating solution, a liquid flow pump having a suction port connected to this discharge port by a flow path, and a filtration device having a liquid intake port connected to the jet port of this liquid flow pump by a flow path, A first provided in a flow path connecting a liquid outlet of the filtering device and the first inlet. A flow rate control mechanism is made of a second flow rate control mechanism provided in the channel that connects the outlet and the second inlet of the liquid of the filtration device.

The second plating apparatus according to the present invention is the first plating apparatus.
In the plating apparatus, the first flow rate control mechanism and the second flow rate control mechanism are provided so that the flow rate of the plating solution in the lower tank section of the plating tank is higher than the flow rate of the plating solution in the upper tank section of the plating tank. Is set.

A third plating apparatus according to the present invention comprises a plating tank, a partition plate which divides the plating tank into an upper tank portion and a lower tank portion and which is provided with through holes, and the side wall of the plating tank. The first plating solution provided in the part below the partition plate
Inlet, a second inlet of the plating solution provided in a portion of the side wall provided with the first inlet above the partition plate, and the first inlet of the plating tank. Second above
A discharge port of the plating solution provided in a portion of the side wall opposite to the side wall provided with the flow inlet of the partition plate, and a liquid flow pump having a suction port connected to the discharge port by a flow path. , A first filtration device having a liquid intake port connected to a jet port of the liquid flow pump by a flow path, and connecting the liquid intake port of the first filtration device to the first inflow port Second filtration having a finer filter than the filter of the first filtration device provided in the flow channel, which connects the liquid outlet and the second inflow port of the first filtration device. It consists of a device.

The fourth plating apparatus according to the present invention is the first plating apparatus.
In the plating apparatus according to any one of 1 to 3, the position where the partition plate is provided is higher than the height at which the first inlet and the discharge port can be provided from the bottom of the plating tank, When the depth to the bottom is d, the height is not more than (1/3) d from the bottom of the plating tank.

The fifth plating apparatus according to the present invention is the first
In any of the plating apparatuses of Nos. 4 to 4, the number of through holes of the partition plate is larger on the side closer to the side wall of the plating tank having the first and second inlets.

The sixth plating apparatus according to the present invention is the first
In the plating apparatus of any one of 1 to 5, a pipe is attached to the surface of the partition plate on the side of the lower tank portion of the through-hole, which is inclined at an angle of 80 degrees or less toward the side wall having the outlet.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. FIG. 1 is a schematic diagram showing the configuration of the plating apparatus according to the first embodiment. In FIG. 1, 1 is a plating tank, 2 is a partition plate, 3 is a through hole of the partition plate, 4 is a first inflow port, 5 is a second inflow port, 6 is a discharge port, and 7 7a and 7b are flows. A passage, 8 is a liquid flow pump, 9 is a filtration device, 10 is a first flow velocity control mechanism, 11 is a second flow velocity control mechanism, 20 is a plating solution, 21 is a foreign substance, 22 is an object to be plated, and 30 is a plating device. Is.

The plating apparatus 30 of the present embodiment is provided with a partition plate 2 substantially parallel to the bottom of the plating tank 1, and the plating tank 1 is divided into an upper tank portion and a lower tank portion. The partition plate 2 is provided with a through hole 3 so that the plating solution 20 in the upper tank portion and the lower tank portion of the plating tank 1 communicates with each other. A first inflow port 4 is provided on the side wall of the lower bath part of the plating bath 1, and a second inflow port 5 is provided on the upper bath part of the side wall on which the first inflow port 4 is provided. ing. Further, a discharge port 6 is provided in a lower tank portion of a side wall of the plating tank 1, which is opposed to a side wall provided with the first inlet 4 and the second inlet 5.

A discharge port 6 of the plating tank 1 is connected to a suction port of a liquid flow pump 8 by a flow path 7. The jet outlet of the liquid flow pump 8 is connected to the liquid intake of the filtering device 9 by the flow path 7. The flow path 7 connected to the liquid outlet of the filtering device 9 is branched into two, one branched flow path 7a is connected to the first flow velocity control mechanism 10, and the other branched flow path 7a is connected. The flow path 7b is connected to the second flow velocity control mechanism 11. The outlet of the first flow velocity control mechanism 10 is connected to the first inlet 4 of the plating tank 1 by the flow passage 7a, and the outlet of the second flow velocity control mechanism 11 is connected by the flow passage 7b. Is connected to the second inflow port 5. The object 22 to be plated is placed in the plating solution 20 in the upper tank portion of the plating tank 1.

Next, in the present embodiment, the plating tank 1
Foreign matter 21 is prevented from accumulating on the bottom of the
A mechanism for preventing the object 22 from becoming defective in plating due to the foreign material 21 being diffused or rolled up to the vicinity of the object 22 to be plated, by carrying 1 to the filtering device 9 outside the plating tank 1 and removing it. Will be explained.

First, the plating solution 20 to which the discharge pressure has been applied by the liquid flow pump 8 is first subjected to the first flow rate control mechanism 10.
Flow rate is controlled to flow from the first inlet 4 into the lower bath of the plating tank 1, and the second flow velocity control mechanism 11 controls the second flow rate to control the second flow rate from the second inlet 5 to the plating tank 1. Pour into the upper tank part. At this time, the first flow velocity control mechanism 10 and the second flow velocity control mechanism 11 are set so that the flow velocity of the plating solution in the lower bath part is higher than the flow velocity of the plating liquid in the upper bath part. Then, the plating solution 20 is discharged from the discharge port 6 provided only in the lower tank portion of the side wall opposite to the side wall provided with the first inflow port 4 and the second inflow port 5.

That is, the plating solution 20 in the upper tank portion passes through the through hole 3 of the partition plate 2, flows into the lower tank portion, and the discharge port 6
Therefore, the foreign matter 21 transferred to the lower tank portion together with the plating solution 20 does not return to the upper tank portion where the object 22 is to be plated. Then, in the lower tank portion, the plating solution 20 from the first inlet 4 is directly discharged from the discharge port 6, so that the foreign matter 21 is deposited on the bottom of the plating tank 1 without depositing the foreign matter 21. It can be discharged together with 20 to the outside of the plating tank 1. Also, since the flow rate of the plating solution in the lower tank is set to be higher than the flow rate of the plating solution in the upper tank, viscous flow causes the flow from the upper tank with a low flow rate to the lower tank with a high flow rate. Since the force causing the plating solution 20 to flow acts, the foreign matter 21 near the second inflow port 5 is also transferred to the lower tank portion before coming into contact with the object 22 to be plated, and the plating solution 2
It can be discharged to the outside of the plating tank 1 together with 0. In particular, when the flow rate of the plating solution in the lower tank section is twice or more the flow rate of the plating solution in the upper tank section, the effect of transferring the foreign matter 21 to the lower tank section before contacting the object 22 to be plated is more remarkable. become.

In the present embodiment, when the partition plate 2 has a depth d from the liquid surface to the bottom of the plating tank 1 in the amount of plating liquid normally used in the plating apparatus 30,
It is provided at a position lower than (1/2) d from the bottom surface of the plating tank 1. The position where the partition plate 2 is provided is (1 /
2) Since it is less than d, when the flow rate of the plating solution flowing in from the first inlet 4 is made higher than the flow rate of the plating solution flowing in from the second inlet 5, the flow rate of the plating solution in the lower tank portion becomes The flow rate of the plating solution in the
The force of the plating solution 20 flowing from the upper tank to the lower tank works,
The foreign material 21 can be transferred to the lower tank part.

A plurality of through holes 3 are provided in the partition plate 2,
The shape is, for example, a circle having a diameter of 3 to 10 mm.
The ratio of the area occupied by the plurality of through holes 3 in the partition plate 2 is 20 to 60%, preferably 30 to 50.
%. If the diameter of the through hole 3 is less than 3 mm, the resistance to the flow of the plating solution 20 from the upper tank portion to the lower tank portion of the plating tank 1 becomes large, and the foreign matter 21 is transferred from the upper tank portion to the lower tank portion. May prevent you from doing so. If the diameter of the through hole 3 is larger than 10 mm, the foreign matter 21 may diffuse from the lower tank portion to the upper tank portion. If the ratio of the area occupied by the plurality of through holes 3 in the partition plate 2 is less than 20%, the resistance to the flow of the plating solution 20 from the upper tank portion to the lower tank portion of the plating tank 1 becomes large, and the foreign matter 21 May be prevented from being transferred from the upper tank section to the lower tank section. Further, when the ratio of the area occupied by the plurality of through holes 3 in the partition plate 2 is larger than 60%, the foreign matter 21 may diffuse from the lower tank portion to the upper tank portion.

In the present embodiment, the shape of the through hole 3 is circular, but the shape is not limited to this, and it may be oval, triangular, quadrangular, or other polygonal shape. In the present embodiment, the distribution of the plurality of through holes 3 provided in the partition plate 2 is
Although not particularly limited, it is preferable to provide the partition plate 2 in a uniform distribution from the viewpoint of processing the partition plate 2.

In the present embodiment, the material of the partition plate 2 is not particularly limited as long as the through holes 3 can be easily processed and has resistance to the plating solution 20, for example, polytetrafluoroethylene (PTFE) or polypropylene (PP). ) And other metals, and stainless steel and other metals. Further, as the liquid flow pump 8, a bellows pump {type: FF-1
Type 0 (manufactured by IWAKI PUMP Co., Ltd.)}, and a cartridge filter {coated type cartridge filter (manufactured by ADVANTEC Co.)} can be used as the filtration device. Further, as the first flow velocity control mechanism 10 and the second flow velocity control mechanism 11, for example, a ball valve {PV
DF ball valve (manufactured by Komatsu Ltd.)}.
In the present embodiment, the two flow rate control mechanisms 10 and 11 are used, but one flow rate control mechanism includes two needle valves {Teflon (registered trademark) needle valve (manufactured by Komatsu Ltd.)}. A device having a flow rate control unit may be used.

As the flow paths 7, 7a, 7b, pipes or hoses having resistance to the plating solution and pressure resistance can be used. Further, the plating tank 1 may be provided with a plurality of first inflow ports 4, second inflow ports 5 or discharge ports 6. Further, the plating apparatus 30 of the present embodiment is used for electroless plating, and although the anode and the power supply for plating are not shown in FIG. 1,
The present invention can also be used for electroplating with the addition of an anode and a plating power supply. Furthermore, the plating apparatus 30 of the present embodiment can be used not only for semiconductor devices but also for plating of printed wiring boards, metals and plastics.

Embodiment 2. FIG. 2 is a schematic diagram showing the configuration of the plating apparatus according to the second embodiment. In FIG. 2, 12 is a first filtering device and 13 is a second filtering device. In the plating apparatus 30 of the present embodiment, in the plating apparatus of the present invention, the jet port of the liquid flow pump 8 is connected to the liquid intake of the first filtering device 12 by the flow path 7. The flow path from the liquid outlet of the first filtering device 12 is branched and connected to the first inflow port 4 of the plating tank by the flow path 7a, and the second filtering device 13 by the flow path 7b. Is connected to the liquid intake. The flow path 7a from the liquid outlet of the second filtration device 13 is connected to the second inlet 5 of the plating tank. The filter used in the first filtration device 12 is a coarse filter having a pore size of 10 to 50 μm, and the filter used in the second filtration device 13 is a fine filter having a pore size of 0.1 to 1 μm. It is a filter.

That is, the plating solution filtered only by the first filtering device 12 using the coarse filter is the first inflow port 4
Flows into the lower tank portion of the plating tank 1. First filtration device 1
The plating solution that has passed through 2 and has been filtered by the second filtering device 13 using a finer filter flows into the upper tank portion of the plating tank 1 from the second inlet 5. That is, since the plating solution that has passed through the first filter device 12 of the coarse filter flows into the lower tank part of the plating tank 1, there is little decrease in the flow rate due to the filter device, and the plating solution at a large speed flows into the lower tank part. Enable the flow of. In addition to the first filtering device 12, the plating solution that has passed through the second filtering device 13 having a fine filter is caused to flow into the upper tank portion of the plating tank 1, so that the flow velocity of the plating solution becomes smaller than that of the lower tank portion. In the plating apparatus 30 of the present embodiment, the flow velocity of the plating solution in the lower tank portion of the plating tank 1 can be made higher than that in the upper tank portion without using a special flow rate control mechanism, and the upper tank portion can be moved to the lower tank portion. The force to flow the plating solution 20 works,
The foreign material 21 can be transferred from the upper tank portion to the lower tank portion.

Since the plating solution 20 that has passed through the first filtration device 12 using a coarse filter flows into the lower tank portion,
Fine foreign matter may exist in the plating solution, but since the plating solution 20 has a force to flow from the upper tank portion to the lower tank portion, it is possible to prevent the fine foreign material from diffusing into the upper tank portion.
In addition, to the upper tank part, the second filtering device 1 of a fine filter is used.
Since the plating solution 20 that has passed through 3 flows in, fine foreign matter in the plating solution is also removed, and the foreign matter 21 remains on the object 22 to be plated.
It is possible to prevent defective plating without touching.

Embodiment 3. In the plating apparatus 30 of the present embodiment, in the plating apparatus of the present invention, the position where the partition plate 2 is provided is such a height that the first inflow port 4 and the discharge port 6 can be provided in the lower tank portion of the plating tank 1. As described above, when the depth d from the liquid surface to the bottom surface of the plating tank 1 in the amount of plating solution normally used in the plating apparatus 30 is set to a height of (1/3) d from the bottom of the plating tank. Or less.

That is, since the position where the partition plate 2 is provided is (1/3) d or less from the bottom surface, the volume of the lower tank portion is smaller than that of the upper tank portion. For example, the plating that flows in from the first inlet 4 Even if the flow rate of the solution is 1.1 times or more the flow rate of the plating solution flowing in from the second inflow port 5, the flow rate in the lower tank section becomes sufficiently higher than that in the upper tank section. The force necessary for causing the plating solution 20 to flow from the lower tank portion to the lower tank portion allows the foreign matter 21 to be transferred to the lower tank portion before coming into contact with the object 22 to be plated. Moreover, the position where the partition plate 2 is provided is (1 /
3) Since it is d or less, the volume of the upper tank portion in which the object 22 to be plated is installed is sufficient, and the size of the object 22 to be plated and the number of the object 22 to be plated are not limited. The use efficiency of the plating apparatus 30 is excellent.

Fourth Embodiment FIG. 3 is a top view of a plating tank in the plating apparatus according to the fourth embodiment. The plating apparatus 30 of the present embodiment is the same as the plating apparatus of the present invention.
The through hole 3 of the partition plate 2 is the plating solution inlet 4 of the plating tank 1.
The number is larger on the side closer to the side wall provided with Nos. 5 and 5, and is smaller on the side closer to the side wall provided with the discharge port 6. That is, since there are many through holes 3 near the inflow port 4, the plating solution in the upper tank part near the second inflow port 4 can easily move to the lower tank part, and more foreign matter 21 can be removed. Before being brought into contact with the object 22 to be plated, it is transferred from the upper tank portion to the lower tank portion, and the effect of preventing defective plating due to the foreign matter 21 is large.

Embodiment 5. FIG. 4 is a schematic sectional view showing the structure of the plating tank in the plating apparatus of the fifth embodiment. In FIG. 4, 14 is a pipe. The plating apparatus 30 of the present embodiment is different from the plating apparatus of the present invention in that the pipe 1 communicating with the through hole 3 is formed on the surface of the partition plate 2 on the lower tank portion side.
4 are provided. The pipe 14 is attached at an angle of less than 80 degrees so as to be inclined toward the side wall provided with the discharge port. With such a configuration, even if the flow rate of the plating solution in the lower tank part of the plating tank 1 is not made higher than the flow rate of the plating solution in the upper tank part, foreign matter in the plating solution in the lower tank part It can be prevented from moving to the section. Moreover, since the mounting angle of the pipe 14 is inclined toward the outlet side at an angle of less than 80 degrees, the resistance to the flow of the plating solution 20 from the upper tank portion to the lower tank portion of the plating tank 1 is small, and The foreign matter 21 in the tank portion can be easily transferred to the lower tank portion, and defective plating can be prevented.

[0029]

The first plating apparatus according to the present invention comprises a plating tank, a partition plate which divides the plating tank into an upper tank portion and a lower tank portion and which has through holes, and a side wall of the plating tank. A first inlet of the plating solution provided in a portion below the partition plate, and a first plating solution provided in a portion of the side wall having the first inlet above the partition plate. Drainage of the plating solution provided in a portion of the side wall of the plating tank facing the side wall provided with the first inflow port and the second inflow port below the partition plate. An outlet, a liquid flow pump having a suction port connected to the discharge port by a flow path, a filtration device having a liquid intake port connected by a flow path to the jet port of the liquid flow pump, and a filtration device of the filtration device. A first flow velocity control mechanism provided in a flow path connecting a liquid outlet and the first inlet , Which consist of a second flow rate control mechanism provided in the channel that connects the outlet and the second inlet of the liquid of the filtering device, in the plating bath,
Since the plating solution in the upper tank part flows through the through hole of the partition plate to the lower tank part and is discharged from the discharge port, the foreign matter in the upper tank part is transferred to the lower tank part together with the plating solution. The foreign matter transferred to the bath does not return to the upper bath where the object is to be plated, but is discharged from the outlet to the outside of the plating bath. Further, in the lower tank part, the plating solution from the first inlet is directly discharged from the discharge port, so that it is discharged together with the plating solution to the outside of the plating tank without depositing foreign matter on the bottom of the plating tank. It Since the foreign matter discharged together with the plating solution can be removed by the filtering device, it is possible to prevent defective plating due to the foreign matter.

The second plating apparatus according to the present invention is the first plating apparatus.
In the plating apparatus, the first flow rate control mechanism and the second flow rate control mechanism are provided so that the flow rate of the plating solution in the lower tank section of the plating tank is higher than the flow rate of the plating solution in the upper tank section of the plating tank. Is set and the flow rate of the plating solution in the lower tank is set to be higher than the flow rate of the plating solution in the upper tank. The force that the plating solution flows to the lower tank part where the flow velocity is high acts, and foreign matter near the second inlet also
Before being brought into contact with the object to be plated, it can be efficiently transferred to the lower tank part and discharged out of the plating tank together with the plating solution, so that defective plating due to foreign matter can be prevented.

A third plating apparatus according to the present invention comprises a plating tank, a partition plate which divides the plating tank into an upper tank portion and a lower tank portion and which has through holes, and the side wall of the plating tank. The first plating solution provided in the part below the partition plate
Inlet, a second inlet of the plating solution provided in a portion of the side wall provided with the first inlet above the partition plate, and the first inlet of the plating tank. Second above
A discharge port of the plating solution provided in a portion of the side wall opposite to the side wall provided with the flow inlet of the partition plate, and a liquid flow pump having a suction port connected to the discharge port by a flow path. , A first filtration device having a liquid intake port connected to a jet port of the liquid flow pump by a flow path, and connecting the liquid intake port of the first filtration device to the first inflow port Second filtration having a finer filter than the filter of the first filtration device provided in the flow channel, which connects the liquid outlet and the second inflow port of the first filtration device. It is composed of a device, and the flow rate of the plating solution in the lower tank part of the plating tank can be made higher than that in the upper tank part without using a special flow rate control mechanism, and the plating solution can be transferred from the upper tank part to the lower tank part. The fluidizing force works and foreign matter near the second inlet also contacts the object to be plated. Before being transferred to efficiently lower tank section, it is discharged to the outside of the plating tank with the plating solution, plating failure can be prevented by the foreign matter.

The fourth plating apparatus according to the present invention is the first plating apparatus.
In the plating apparatus according to any one of 1 to 3, the position where the partition plate is provided is higher than the height at which the first inlet and the discharge port can be provided from the bottom of the plating tank, When the depth to the bottom is d, the height is (1/3) d or less from the bottom of the plating tank, the volume of the lower tank is smaller than that of the upper tank, and the inflow is from the first inlet. Even if the flow rate of the plating solution to be applied is slightly higher than the flow rate of the plating solution flowing from the second inlet, the flow rate in the lower tank is sufficiently higher than that in the upper tank, and the plating from the upper tank to the lower tank is performed. The force necessary to make the liquid flow works, and the foreign matter can be transferred to the lower bath before contacting the object to be plated, and the plating failure due to the foreign matter can be prevented.

The fifth plating apparatus according to the present invention is the first plating apparatus.
In the plating apparatus according to any one of 1 to 4, the number of through holes of the partition plate is greater on the side closer to the side wall of the plating tank provided with the first and second inlets, and is closer to the second inlet. Since the plating solution in the upper tank portion can be easily moved to the lower tank portion, more foreign matter can be transferred from the upper tank portion to the lower tank portion before contacting the object to be plated.

The sixth plating apparatus according to the present invention is the first
In the plating apparatus according to any one of 1 to 5 above, a pipe is attached to a surface of the partition plate on the lower tank portion side of the through hole portion at a side wall side provided with an outlet inclined at an angle of 80 degrees or less, Even if the flow rate of the plating solution in the lower tank section is not made higher than the flow rate of the plating solution in the upper tank section, foreign matter in the plating solution in the lower tank section can be prevented from moving to the upper tank section.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a configuration of a plating apparatus according to a first embodiment.

FIG. 2 is a schematic diagram showing a configuration of a plating apparatus according to a second embodiment.

FIG. 3 is a top view of a plating tank in the plating apparatus according to the fourth embodiment.

FIG. 4 is a schematic sectional view showing a structure of a plating tank in a plating apparatus according to a fifth embodiment.

[Explanation of symbols]

1 plating tank, 2 partition plates, 3 partition plate through holes, 4
1st inflow port, 5 2nd inflow port, 6 discharge port, 7, 7
a, 7b flow path, 8 liquid flow pump, 9 filtration device, 10
1st flow velocity control mechanism, 11 2nd flow velocity control mechanism, 1
2 1st filtration apparatus, 13 2nd filtration apparatus, 14 pipe, 20 plating solution, 21 foreign material, 22 plated object, 30 plating apparatus.

Claims (6)

[Claims] 1. A plating tank, a partition plate which divides the plating tank into an upper tank portion and a lower tank portion and which is provided with a through hole, and a side wall of the plating tank which is provided below the partition plate. A first inlet of the plating solution, a second inlet of the plating solution provided in a portion of the side wall having the first inlet above the partition plate, and the plating tank, A discharge port of the plating solution provided in a portion of the side wall opposite to the side wall provided with the first inflow port and the second inflow port, the part being below the partition plate, and the discharge port is sucked by a flow path. A liquid flow pump having a mouth connected thereto, a filtration device having a liquid intake port connected to a jet port of the liquid flow pump by a flow path, a liquid intake port of the filtration device and the first inflow port. A first flow velocity control mechanism provided in a flow path connecting the above, a liquid outlet of the filtering device, and the second And a second flow velocity control mechanism provided in a flow path connecting the inflow port of the plating apparatus. 2. A first flow velocity control mechanism and a second flow velocity control mechanism so that the flow velocity of the plating liquid in the lower bath portion of the plating bath is higher than the flow velocity of the plating liquid in the upper bath portion of the plating bath. 2. The method according to claim 1, wherein
The plating apparatus described in. 3. A plating tank, a partition plate which divides the plating tank into an upper tank portion and a lower tank portion and which has a through hole, and a side wall of the plating tank which is provided below the partition plate. A first inlet of the plating solution, a second inlet of the plating solution provided in a portion of the side wall having the first inlet above the partition plate, and the plating tank, First above
Outlet of the plating solution provided at a portion of the side wall opposite to the side wall having the inlet and the second inlet of the plating solution, and the inlet is connected to this outlet by a flow path. A liquid flow pump, a first filtration device in which a liquid intake port is connected to a jet port of the liquid flow pump by a flow path, a liquid removal port in the first filtration device and the first filter device. Is smaller than the filter of the first filtration device provided in the flow passage that connects the liquid inlet of the first filtration device and the flow passage that connects the second fluid inlet of the first filtration device. A plating apparatus comprising a second filtering device having a filter. 4. The position where the partition plate is provided is higher than the height where the first inlet and outlet can be provided from the bottom of the plating tank, and the depth from the liquid surface of the plating solution to the bottom of the plating tank. The plating apparatus according to any one of claims 1 to 3, wherein the height is (1/3) d or less from the bottom of the plating tank, where d is d. 5. The plating according to any one of claims 1 to 4, wherein the partition plate has more through holes on the side closer to the side wall of the plating tank having the first and second inlets. apparatus. 6. The pipe is attached to the surface of the partition plate on the lower tank portion side of the through hole portion on the side wall side provided with the outlet at an angle of 80 degrees or less. The plating apparatus according to any one of 5 above.