CN112090217A - Water-gas separation device and chemical mechanical polishing system - Google Patents

Water-gas separation device and chemical mechanical polishing system Download PDF

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Publication number
CN112090217A
CN112090217A CN202010994573.6A CN202010994573A CN112090217A CN 112090217 A CN112090217 A CN 112090217A CN 202010994573 A CN202010994573 A CN 202010994573A CN 112090217 A CN112090217 A CN 112090217A
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chamber
waste liquid
gas
water
plate
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Chinese (zh)
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吴兴
许振杰
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Huahaiqingke Co Ltd
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Huahaiqingke Co Ltd
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Priority to CN202010994573.6A priority Critical patent/CN112090217A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D50/00Combinations of methods or devices for separating particles from gases or vapours
    • B01D50/20Combinations of devices covered by groups B01D45/00 and B01D46/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D53/00Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • B01D53/26Drying gases or vapours
    • B01D53/266Drying gases or vapours by filtration
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/34Accessories
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01DSEPARATION
    • B01D2257/00Components to be removed
    • B01D2257/80Water

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Analytical Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Gas Separation By Absorption (AREA)

Abstract

The invention discloses a water-gas separation device and a chemical mechanical polishing system, wherein the water-gas separation device comprises a shell, the shell is of a rectangular groove structure, a vertically arranged partition plate is arranged in the shell, and the rectangular groove structure is divided into a first cavity and a second cavity, the bottoms of the first cavity and the second cavity are communicated with each other by the partition plate; a top plate of the shell is provided with a waste liquid inlet which is communicated with the first chamber, and a bottom plate of the shell is provided with a waste liquid outlet; the housing is further provided with an exhaust gas outlet which is communicated with the second chamber; waste liquid enters the first chamber through the waste liquid inlet and is discharged through the waste liquid outlet, and waste gas and/or waste gas generated by the waste liquid enters the second chamber through the first chamber and is discharged through the waste gas outlet; and a mesh plate is arranged in the second chamber to prevent foam liquid generated by waste liquid from being discharged through the waste gas outlet.

Description

Water-gas separation device and chemical mechanical polishing system
Technical Field
The invention belongs to the technical field of chemical mechanical polishing, and particularly relates to a water-gas separation device and a chemical mechanical polishing system.
Background
The integrated circuit industry is the core of the information technology industry and plays a key role in the process of upgrading the boosting manufacturing industry to digitalization and intellectualization transformation. The chip is a carrier of an integrated circuit, and the chip manufacturing relates to the process flows of chip design, wafer manufacturing, wafer processing, electrical property measurement, cutting packaging, testing and the like. Chemical Mechanical Polishing (CMP) is an ultra-precise surface processing technique for global Planarization.
The chemical mechanical polishing generally comprises a polishing unit, a cleaning unit and a drying unit, and the wafer is subjected to polishing, cleaning and drying processes in sequence to realize global planarization of the wafer. In the chemical mechanical polishing process, a large amount of chemicals such as polishing liquid, cleaning liquid, etc. are used, and these chemicals are supplied from the IC Fab factory to each unit of the chemical mechanical polishing system. Waste liquid and/or waste gas formed after the chemicals are used must be discharged in time to prevent the waste liquid and/or waste gas from influencing the environment of each functional unit and reducing the yield of wafer processing.
Waste streams of some chemicals further generate exhaust gases. In order to prevent the two-phase flow of the waste gas and the waste liquid from entering the exhaust pipe to block the exhaust pipe with the liquid, the chemical mechanical polishing system is generally provided with a water-gas separation device which separates the gas-liquid two-phase flow into the gas and the liquid and discharges the gas and the liquid respectively. Such an arrangement also facilitates separate treatment of the waste liquid and the waste gas using different treatment processes.
Patent CN103878694B discloses a gas-liquid separator provided with a gas-liquid separation tank, wherein a nozzle unit is disposed inside the gas-liquid separation tank, and the spray nozzle sprays pure water into the liquid accumulated at the bottom of the gas-liquid separation tank to eliminate bubbles generated in the waste liquid. The gas-liquid separation device disclosed by the patent is complex in structure and large in overall dimension, pure water needs to be introduced through a pipeline, the construction requirement of the device is increased invisibly, and the application range of the gas-liquid separation device is influenced.
Disclosure of Invention
The present invention aims to solve at least to some extent one of the technical problems existing in the prior art.
To this end, a first aspect of an embodiment of the present invention provides a water-gas separation device, which includes a housing, where the housing has a rectangular groove structure, and a partition board is vertically disposed in the housing, and the partition board divides the rectangular groove structure into a first chamber and a second chamber, whose bottoms are communicated with each other; a top plate of the shell is provided with a waste liquid inlet which is communicated with the first chamber, and a bottom plate of the shell is provided with a waste liquid outlet; the housing is further provided with an exhaust gas outlet which is communicated with the second chamber; waste liquid enters the first chamber through the waste liquid inlet and is discharged through the waste liquid outlet, and waste gas and/or waste gas generated by the waste liquid enters the second chamber through the first chamber and is discharged through the waste gas outlet; and a mesh plate is arranged in the second chamber to prevent foam liquid generated by waste liquid from being discharged through the waste gas outlet.
As a preferred embodiment, the mesh plate is a perforated plate horizontally disposed in the second chamber.
As a preferred embodiment, the distance between the mesh plate and the bottom plate of the housing is 100mm-150mm, and the exhaust gas outlet is arranged on the upper side of the mesh plate and connected with an external exhaust pipeline in a flange mode.
As a preferred embodiment, the mesh plate is slidably connected to the second chamber, and can move in a vertical direction of the second chamber to adjust a distance between the mesh plate and a bottom plate of the housing.
In a preferred embodiment, the number of the mesh plates is two or more, and the mesh plates are horizontally arranged in the second chamber at intervals.
As a preferred embodiment, the mesh plate has an opening rate of 20% -30%, and the cross-sectional shape of the openings is circular, oval, triangular, trapezoidal and/or rectangular.
As a preferred embodiment, the interior of the first chamber is provided with a flow slowing structure which is arranged in the vertical direction of the first chamber to reduce the speed of the waste liquid flowing to the bottom plate.
In a preferred embodiment, the flow slowing structures are baffles, the number of the baffles is two or more, and the baffles are staggered and stacked in the first chamber in the vertical direction.
As a preferred embodiment, the guide plate is hinged to a side plate of the housing, and the inclination angle of the guide plate is adjustable.
A second aspect of the embodiments of the present invention provides a chemical mechanical polishing system, which includes a polishing unit and a cleaning unit, wherein a waste liquid collecting device is disposed on an outer peripheral side of the polishing unit, and the waste liquid collecting device is connected to the above water-gas separating device to realize gas-liquid separation; and a waste liquid port of the cleaning unit is connected with the water-gas separation device through a pipeline so as to realize gas-liquid separation.
The beneficial effects of the invention include: a partition plate is arranged in the water-gas separation device to form a first chamber specially used for waste liquid discharge and a second chamber specially used for waste gas discharge in an isolated manner; a mesh plate is arranged in the second chamber to prevent foam liquid generated by waste liquid from being discharged through the waste gas outlet, and the foam liquid can prevent the waste gas from being normally discharged; a flow buffering structure is arranged in a first chamber formed by the partition plates, so that the speed of waste liquid flowing to the bottom of the water-gas separation device is reduced, and the quantity of foams generated by waste liquid impact is reduced.
Drawings
The advantages of the invention will become clearer and more readily appreciated from the detailed description given with reference to the following drawings, which are given by way of illustration only, and which do not limit the scope of protection of the invention, wherein:
fig. 1 is a schematic structural view of a water-gas separation device 1 according to the present invention;
fig. 2 is a schematic view of the hidden front side plate of the water-gas separation device 1 of the present invention;
fig. 3 is a schematic view of an embodiment of the water gas separation device 1 according to the invention;
fig. 4 is a schematic view of another embodiment of the water gas separation device 1 according to the invention;
FIG. 5 is a schematic view of a chemical mechanical polishing system of the present invention;
figure 6 is a schematic view of another embodiment of the chemical mechanical polishing system of the present invention.
Detailed Description
The technical solution of the present invention will be described in detail with reference to the following embodiments and accompanying drawings. The embodiments described herein are specific embodiments of the present invention for the purpose of illustrating the concepts of the invention; the description is intended to be illustrative and exemplary and should not be taken to limit the scope of the invention. In addition to the embodiments described herein, those skilled in the art will be able to employ other technical solutions which are obvious based on the disclosure of the claims and the specification thereof, and these technical solutions include technical solutions which make any obvious replacement or modification of the embodiments described herein.
The drawings in the present specification are schematic views to assist in explaining the concept of the present invention, and schematically show the shapes of respective portions and their mutual relationships. It should be understood that the drawings are not necessarily to scale, the same reference numerals being used to identify the same elements in the drawings in order to clearly show the structure of the elements of the embodiments of the invention.
In the present invention, "Chemical Mechanical Polishing" is also referred to as "Chemical Mechanical Planarization (CMP), and its meaning and practical effect are equivalent.
Fig. 1 is a schematic structural diagram of a water-gas separation device 1 according to the present invention, and the water-gas separation device 1 includes a housing having a rectangular groove structure formed by assembling a plurality of plates so as to provide a space for gas-liquid separation.
Fig. 2 is a schematic view of the water-gas separating device 1 with the front side plate hidden so as to clearly show the internal structure of the housing. A partition plate 10 is disposed inside the case, and the partition plate 10 divides the rectangular groove structure into a first chamber C1 and a second chamber C2. Since the length of the partition plate 10 is smaller than the height of the rectangular groove structure, i.e., the lower end surface of the partition plate 10 is provided with a gap from the bottom plate of the case, the first chamber C1 and the second chamber C2 are communicated at the bottom of the rectangular groove structure.
Further, the partition board 10 is vertically arranged in the rectangular groove structure, and the length of the partition board 10 is 60% -85% of the height of the rectangular groove structure. The length of the partition 10 is related to the size of the inner space of the water-gas separation device 1 and the flow rate of the waste liquid entering the water-gas separation device 1. The flow rate of the waste liquid is 10-20L/min, and the length of the partition plate 10 is preferably 75% of the height of the rectangular groove structure, so that a certain buffer height is provided for the waste liquid.
In fig. 2, a waste liquid inlet 1a is provided in the top plate of the housing and communicates with the first chamber C1, and a waste liquid outlet 1b is provided in the bottom plate of the housing. Waste liquid enters the first chamber C1 through the waste liquid inlet 1a and is discharged through the waste liquid outlet 1b at the bottom of the housing. The housing is also provided with an exhaust gas outlet 1C, which communicates with a second chamber C2, into which exhaust gas from the exhaust gas and/or waste liquid enters and is discharged by the exhaust gas outlet.
As an embodiment of the present invention, the waste liquid inlet 1a, the waste liquid outlet 1b, and the waste gas outlet 1c all adopt a flange-type connecting structure. Namely, the outer end faces of the waste liquid inlet 1a, the waste liquid outlet 1b and the waste gas outlet 1c are provided with connecting flanges. The upper portion of flange is provided with the seal groove, and the sealing washer sets up in the seal groove to flange and outside pipeline sealing connection. The technical scheme of the invention adopts a flange connection mode, reduces the requirement on pipeline interfaces and effectively improves the convenience of pipeline connection.
Further, the exhaust gas outlet 1c is provided at a side plate of the housing, as shown in fig. 2. The top plate of the housing may also be provided with an exhaust outlet 1c as a backup. When the spare exhaust gas outlet 1c is not used, an end cover can be used for blocking, so that the used exhaust gas outlet 1c can be normally used.
Waste liquid enters the first chamber C1 via a waste liquid inlet 1a located in the top plate of the housing and is discharged by a waste liquid outlet 1b located in the bottom plate of the housing. Since the exhaust gas outlet 1c is connected to an external exhaust line connected to an exhaust valve of the IC Fab facility, a pumping action is formed at the exhaust gas outlet 1 c. The exhaust gas generated by the exhaust gas and/or waste liquid is sucked into the second chamber C2 under negative pressure and is guided to the IC Fab exhaust gas treatment part through the exhaust gas outlet 1C and the external exhaust pipeline.
As an embodiment of the present invention, in order to prevent the foam generated from the waste liquid from entering the exhaust gas outlet 1c along with the waste liquid, the foam liquid enters and even fills the external exhaust line to hinder the normal discharge of the exhaust gas. The water-gas separating device 1 is provided with a mesh plate 20, and the mesh plate 20 is disposed inside the second chamber C2 to block the foam liquid generated from the waste liquid from being discharged through the waste gas outlet 1C.
Furthermore, the exhaust gas outlet 1c is disposed above the mesh plate 20, and the mesh plate 20 can reduce the wind speed of the suction of the exhaust gas outlet 1c, thereby effectively preventing the foam concentrate from being directly sucked into the external exhaust pipeline through the exhaust gas outlet 1 c.
In one aspect of this embodiment, the mesh plate 20 is a perforated plate. That is, the mesh plate 20 is provided with a plurality of through holes in a thickness direction, and the through holes are uniformly formed in the mesh plate 20 so as to exert an inhibiting effect on the bubbles generated from the waste liquid. It will be appreciated that the perforations may also be substantially evenly spaced about the web 20, and that the distribution of perforations over the web does not affect the barrier effect of the web 20 on the foam.
Further, the cross-sectional shape of the through-hole may be circular, as shown in fig. 2, to form a mesh plate having an aperture ratio of 20% to 30%. Preferably, the aperture ratio of the mesh plate 20 is 22% to 26% to properly reduce the wind speed of the suction of the waste gas outlet 1c so as not to directly suck the waste liquid to the external exhaust duct connected to the waste gas outlet 1c due to the excessive wind speed.
It is understood that the cross-sectional shape of the through holes formed in the net plate 20 may be a closed geometric shape such as an ellipse, a triangle, a trapezoid and/or a rectangle. The aperture ratio of the screen plate 20 is controlled within the required range, and the requirements of the field working conditions are met.
When the water-gas separation device 1 is used, the liquid level of the waste liquid may occasionally exceed the mesh plate 20. Since the waste liquid contains a large amount of particulate agglomerates, these particles adhere to the inner walls of the through holes of the mesh plate 20. The particulate matter is excessively accumulated and the through hole portions of the mesh plates 20 are clogged to affect the opening ratio of the mesh plates 20. Even the particles in the waste liquid can completely block the through holes of the mesh plate 20, so that the waste gas cannot be discharged.
In view of the above technical problems, a super-hydrophobic coating or a hydrophobic coating with small resistance, such as Parylene-C (Parylene-C) coating or Teflon (Teflon) coating, may be coated on the side walls of the through holes of the mesh plate 20 to reduce or prevent particles from attaching to the side walls of the through holes, and ensure that the aperture ratio of the mesh plate 20 is within a required range. As a variant of this embodiment, the mesh plate 20 can also be made directly of a non-metallic material with good hydrophobic properties, such as teflon.
In the present invention, the aperture ratio of the mesh plate 20 is related to the size of the inner space of the water-gas separation device 1, the flow rate of the waste liquid entering the water-gas separation device 1, and the wind speed sucked by the external exhaust pipeline. In some embodiments, the opening ratio of the mesh panel 20 can be controlled to be lower than 20%, such as about 18%, or the opening ratio of the mesh panel 20 can be controlled to be higher than 30%, such as about 35%.
As another embodiment of the present invention, the net plate 20 may have a plate structure with adjustable opening ratio. That is, the mesh plate 20 is formed by laminating two or more plate members provided with through holes having different hole positions and/or hole radii. The area occupied by the through holes of the screen plate 20 can be adjusted by adjusting the relative fixing position of the plate, and the adjustment of the aperture ratio of the screen plate 20 is completed.
When the water-gas separation device 1 is used on site, the liquid level of the waste liquid in the housing is lower than the position where the mesh plate 20 is arranged, but a part of the waste liquid is sucked into an external exhaust pipeline connected with the exhaust gas outlet 1 c. This indicates that the aperture ratio of the mesh plate 20 is greater than that required for the on-site conditions, and therefore, the mesh plate 20 having a small aperture ratio may be replaced or the aperture ratio may be reduced by adjusting the fixing position of the plate member to reduce the wind speed of the suction of the waste gas outlet 1c, thereby preventing the foam concentrate from being directly sucked into the external exhaust gas line.
As an embodiment of the present invention, the mesh plate 20 is horizontally disposed in the second chamber C2, as shown in FIG. 2. Specifically, one end of the mesh plate 20 is fixed to the partition plate 10, and the other end thereof is fixed to the inner sidewall of the second chamber C2.
Further, a certain distance is preset between the mesh plate 20 and the bottom plate of the housing, so as to provide a buffer space for the waste liquid. In one aspect of this embodiment, the distance between the mesh plate 20 and the base plate is 100mm to 150 mm. Preferably, the distance between the mesh plate 20 and the bottom plate of the case is 120 mm.
As one aspect of this embodiment, the mesh plate 20 is slidably coupled in the second chamber C2. That is, the operator may move the mesh panel 20 in the vertical direction of the second chamber C2 according to the field condition to adjust the distance between the mesh panel 20 and the bottom plate of the case. Specifically, a slide rail may be provided at a side plate of the second chamber C2, and the mesh plate 20 is connected to the slide rail by a slider. In order to prevent the waste liquid bubbles from rising through the gap between the side of the mesh plate 20 and the side plate of the second chamber C2 to enter the waste gas outlet 1C, the gap between the side plate of the mesh plate 20 and the side plate of the second chamber C2 needs to be controlled within 2mm to 8 mm.
In the embodiment shown in fig. 1, the front side plate of the water-gas separation device 1 may be made of a transparent material, such as a plexiglass plate, an acrylic plate, etc., so as to observe the operation conditions inside the water-gas separation device 1 when the water-gas separation device 1 is installed and debugged, and adjust the installation position of the mesh plate 20 as needed. Specifically, when the water-gas separation device 1 is used on site, the liquid level of the waste liquid in the housing exceeds the screen plate 20, which indicates that the installation position of the screen plate 20 is too low, and the position of the screen plate 20 in the second chamber C2 needs to be adjusted to meet the requirement of the site working condition.
As another embodiment of the present invention, the number of the mesh plates 20 may be two or more, and the mesh plates are horizontally spaced from the second chamber C2 to effectively reduce the wind speed of the suction of the waste gas outlet 1C, and prevent the foam concentrate from being directly sucked into the external exhaust pipe through the waste gas outlet 1C, i.e. prevent the waste liquid from being sucked back into the external exhaust pipe to hinder the normal discharge of the waste gas and/or the waste liquid-generated waste gas.
As one aspect of this embodiment, two mesh panels 20 may be provided, which are spaced apart from each other in the vertical direction of the second chamber C2, and the distance between the adjacent mesh panels 20 is 30mm to 50mm, so as to reduce the wind speed and block the foam concentrate from entering the external exhaust duct. Fig. 3 is a schematic structural view of the water-gas separation device 1 of the present invention, in this embodiment, the number of mesh plates 20 is two, the mesh plates 20 are arranged at intervals, and the distance between adjacent mesh plates 20 is 40 mm.
In the embodiment shown in fig. 3, the position, number and size of the through holes of the net plate 20 may be different, so as to reduce the wind speed and enhance the blocking effect of the net plate. In one aspect of this embodiment, the through holes of the mesh plate 20 may be staggered, i.e., the positions of the through holes do not overlap or partially overlap each other, so as to reduce the wind speed and block the foam liquid from entering the external exhaust pipeline.
In the present invention, the waste liquid enters the first chamber C1 through the waste liquid inlet 1a, and the waste liquid with a certain flow rate is directly conveyed to the bottom plate of the housing, and more foam is generated by the collision of the waste liquid and the bottom plate. This increases the difficulty of gas-liquid separation and places higher demands on the capacity of the water-gas separation device 1 according to the invention.
In order to solve the above technical problem, the interior of the first chamber C1 may be provided with a slow flow structure to reduce the speed of the waste liquid flowing to the bottom plate, and reduce or avoid the amount of foam generated by the waste liquid impacting the bottom plate.
Further, the slow flow structure is arranged along the vertical direction of the first chamber C1 to block the waste liquid entering the first chamber C1 from top to bottom, and the flow speed of the waste liquid flowing to the bottom plate of the shell is reduced.
In the embodiment shown in fig. 4, the flow slowing structures are four flow guiding plates 30, and the flow guiding plates 30 are arranged in the first chamber C1 in a staggered and stacked manner along the vertical direction. Namely, the baffle 30 is disposed in turn on the inner sidewall of the first chamber C1 and the barrier 10.
In order to control the flow direction of the foam liquid generated by the waste liquid, the opening formed by the guide plate 30 arranged at the lower part of the first chamber C1 is away from the position of the second chamber C2. That is, the lower baffle 30 should form an opening toward the inner sidewall of the first chamber C1, as shown in fig. 4. The waste liquid slowly flows through the multi-layer guide plate 30 and finally flows to the position of the waste liquid outlet 1b through the lower guide plate 30.
It will be appreciated that the baffles 30 of the first chamber C1 may also be provided in two, three, five, etc. numbers to reduce the flow rate of the waste liquid entering the first chamber C1 to avoid the waste liquid from hitting the floor of the housing at high speed.
In fig. 4, the baffles 40 are obliquely downward and are arranged in a staggered manner on the inner side wall of the shell and the partition 10. In the embodiment shown in fig. 4, the angle of inclination of the baffle 40 is 15 °. It will be appreciated that the angle of inclination of the baffle 40 may be between 10 and 45.
In some embodiments, the baffle 40 may be fixed in a hinged manner so as to flexibly adjust the inclination angle of the baffle 40 according to circumstances.
It will be appreciated that the length of the baffle 40 is less than the distance between the inner side wall of the housing and the partition 10 so as to form a gap for the waste liquid to pass through. In some embodiments, the length of the baffle 40 is 60% -85% of the distance between the inner side wall of the housing and the baffle 10. Preferably, the length of the baffle 40 is 70% of the distance between the inner side wall of the housing and the partition 10.
As another aspect of this embodiment, the baffle 40 may also be disposed in a horizontal direction. That is, the baffle 40 is perpendicular to the inner side wall of the shell and the partition board 10 in turn, and the gap formed between the outer end face of the baffle 40 and the inner side wall of the shell or the partition board 10 is a waste liquid transmission channel.
In the embodiment shown in fig. 2 to 4, the bottom plate of the housing is an inclined plate which is inclined toward the first chamber C1. Accordingly, the waste liquid outlet 1b is provided at a low position of the bottom plate, so that the waste liquid flowing into the inside of the housing is rapidly discharged through the waste liquid outlet 1 b. Specifically, the waste liquid outlet 1b is provided in a corresponding vertical projection area of the first chamber C1, so that waste liquid entering the first chamber C1 via the waste liquid inlet 1a is discharged as directly as possible via the waste liquid outlet 1 b.
Meanwhile, the present invention provides a chemical mechanical polishing system 100 including a polishing unit 2, as shown in fig. 5. The outer peripheral side of the polishing unit 2 is provided with a waste liquid collecting device 3, and the waste liquid collecting device 3 is connected to the above-described water-gas separating device 1 to achieve gas-liquid separation.
In the embodiment shown in fig. 5, the water-gas separation device 1 is disposed under the floor 4 at a position corresponding to the polishing unit 2, and the water-gas separation device 1 is connected to the waste liquid collection device 3 through a connection pipeline. The waste liquid and/or waste gas generated by the polishing unit 2 first flows into the waste liquid collecting device 3 and then enters the water-gas separating device 1 through the connecting pipeline. The separation of the waste liquid and the waste gas is realized in the water-gas separating device 1, and the foam liquid is prevented from entering an external exhaust pipeline through the waste gas outlet 1c to block the exhaust of the waste gas.
Furthermore, the present invention provides a chemical mechanical polishing system 200 comprising a cleaning unit 5, as shown in FIG. 6.
Since the cleaning unit 5 is generally implemented in a relatively closed chamber, the cleanliness of the chamber directly affects the cleaning effect of the wafer. Therefore, the waste liquid and/or the waste gas in the cleaning unit 5 must be removed in time to ensure the stability of the wafer cleaning effect.
In fig. 6, the waste liquid port of the cleaning unit 5 is connected to the water-gas separation device 1 described above through a pipe to achieve gas-liquid separation.
Specifically, the water-gas separation device 1 is disposed at the lower side of the floor 4 at a position corresponding to the cleaning unit 5, and the water-gas separation device 1 is connected to a waste liquid port of the cleaning unit 5 through a pipeline. Waste liquid and/or waste gas generated by the cleaning unit 5 enter the water-gas separation device 1 through a pipeline, and gas-liquid separation is realized in the water-gas separation device 1.
The water-gas separation device 1 is simple in structure, adopts a modular design, effectively reduces construction difficulty, and improves the application range of the water-gas separation device. The water-gas separation device 1 has a relatively small volume, is convenient to install on the lower side of the IC Fab floor 4, and is beneficial to standardizing the design and arrangement of IC Fab plant pipelines.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A water-gas separation device is characterized by comprising a shell, wherein the shell is of a rectangular groove structure, a vertically arranged partition plate is arranged in the shell, and the rectangular groove structure is divided into a first cavity and a second cavity, the bottoms of which are communicated with each other, by the partition plate; a top plate of the shell is provided with a waste liquid inlet which is communicated with the first chamber, and a bottom plate of the shell is provided with a waste liquid outlet; the housing is further provided with an exhaust gas outlet which is communicated with the second chamber; waste liquid enters the first chamber through the waste liquid inlet and is discharged through the waste liquid outlet, and waste gas and/or waste gas generated by the waste liquid enters the second chamber through the first chamber and is discharged through the waste gas outlet; and a mesh plate is arranged in the second chamber to prevent foam liquid generated by waste liquid from being discharged through the waste gas outlet.
2. The water gas separation device according to claim 1, wherein the mesh plate is a perforated plate horizontally disposed in the second chamber.
3. The water-gas separating device according to claim 2, wherein the distance between the mesh plate and the bottom plate of the housing is 100mm-150mm, and the exhaust gas outlet is arranged on the upper side of the mesh plate and connected with an external exhaust pipeline in a flange mode.
4. The water gas separation device according to claim 2, wherein the mesh plate is slidably connected to the second chamber and is movable in a vertical direction of the second chamber to adjust a distance between the mesh plate and a bottom plate of the housing.
5. The water gas separation device according to claim 1, wherein the number of said mesh plates is two or more, and said mesh plates are horizontally spaced apart from each other in said second chamber.
6. The water-gas separating device according to claim 2, wherein the mesh plate has an opening ratio of 20% to 30% and the cross-sectional shape of the opening is circular, oval, triangular, trapezoidal and/or rectangular.
7. The water-gas separating device according to claim 1, wherein the first chamber is provided with a flow slowing structure inside, which is arranged in a vertical direction of the first chamber to reduce the speed of the waste liquid flowing to the bottom plate.
8. The water-gas separating device according to claim 7, wherein the flow slowing structures are two or more flow guiding plates, and the flow guiding plates are arranged in the first chamber in a staggered and stacked manner along the vertical direction.
9. The water-gas separating device according to claim 8, wherein the baffle is hinged to the side plate of the housing, and the inclination angle of the baffle is adjustable.
10. A chemical mechanical polishing system comprising a polishing unit and a cleaning unit, wherein a waste liquid collecting device is arranged on the outer peripheral side of the polishing unit, and the waste liquid collecting device is connected with the water-gas separating device according to any one of claims 1 to 9 to realize gas-liquid separation; the waste liquid port of the cleaning unit is connected with the water-gas separation device of any one of claims 1-9 through a pipeline to realize gas-liquid separation.
CN202010994573.6A 2020-09-21 2020-09-21 Water-gas separation device and chemical mechanical polishing system Pending CN112090217A (en)

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