JP5364674B2 - Continuous partial plating apparatus and continuous partial plating method using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a continuous partial-plating device and a continuous partial-plating method using the same capable of efficiently cleaning a mask rotator, to which surplus plating liquid sticks, while performing continuous partial-plating by jetting the plating liquid only to a necessary region of a continuously conveyed band-shaped workpiece. <P>SOLUTION: The continuous partial-plating device applies plating only to a plating necessary region while conveying a long workpiece 11. The continuous partial-plating device includes: an electrode structure wherein a plating liquid is radially jetted from multiple electrode nozzle holes formed in a side plate serving as an anode electrode; a mask rotator 3 which is arranged concentrically on the outside of the electrode structure and rotates while conveying the workpiece 11 serving as a cathode electrode itself to prevent a plating unnecessary part of the workpiece 11 from contact with the plating liquid; a cleaning nozzle 1 spraying a minute amount of pure water toward the mask rotator 3 to which surplus plating liquid sticks; and a wiping member 2 removing the surplus liquid from the surface of the mask rotator 3. <P>COPYRIGHT: (C)2012,JPO&amp;INPIT

Description

  The present invention relates to a continuous partial plating apparatus and a continuous partial plating method using the same, and more specifically, sprays a plating solution only on a necessary portion of a strip-like workpiece (hereinafter also referred to as a workpiece) that is continuously conveyed. The present invention relates to a continuous partial plating apparatus and a continuous partial plating method using the same, which can efficiently clean a mask rotating body to which an excess plating solution adheres while performing continuous partial plating with high accuracy.

  In recent years, in addition to the widespread use of electronic devices such as personal computers and mobile phones, the demand for leaded terminal components (connectors) has greatly expanded due to the widespread use of network environments that connect and use multiple electronic devices. Yes. In addition, to meet the demands of mobile devices such as mobile phones and music players for miniaturization, high performance, multiple functions, and high-speed data transmission for processing large volumes of data in digital home appliances such as flat-screen TVs. As important parts, development of technological products such as connector miniaturization, low profile, multi-pole, multi-pin, narrow pitch, etc. is being actively promoted.

As shown in FIG. 7, in forming the electrode on the terminal member (connector) with leads, as shown in FIG. 7, the strip-shaped common portion that is continuous in the longitudinal direction and a plurality of comb-like portions that are discontinuous in the longitudinal direction and extend in the width direction An apparatus for continuously plating by continuously spraying the plating solution onto the portion of the comb-like portion that needs to be plated while the workpiece is continuously conveyed (hereinafter referred to as a continuous partial plating device). It is used. And the strip | belt-shaped workpiece | work after completion | finish of partial plating is finally cut | disconnected before and behind a comb-tooth shaped part, and becomes a terminal member with a lead.
However, the dimensions of the workpiece are very small. In the terminal member with leads, for example, the total length is about 2 mm, and the length of the terminal portion to be plated is only 0.5 mm.
Therefore, when soldering the lead portion to the printed wiring end in the product manufacturing process, there is a possibility that the molten solder flows through the barrier portion where plating is not performed and adheres to the terminal portion, resulting in an electrical short circuit state.

  For example, in the case of workpieces that are continuous strip-like long objects (lead frames) and have continuous plating-required parts, conventionally, the plating liquid level in the processing tank constituting the continuous partial plating apparatus is held constant by the adjusting plate. And the part which needs plating was conveyed, being immersed in a plating solution. As a result, unnecessary portions of the plating are not plated, but it is practically impossible to eliminate the fluctuation of the plating solution level. Continuous partial plating of the workpieces 1A, 1B, and 1C as shown in FIG. 8 where the parts that require plating are more complicated and there are also parts that do not require plating is difficult.

  Therefore, in the case of such workpieces 1A, 1B, and 1C, a direct sticking masking method is adopted in which a tape or the like is attached (masking) to the plating unnecessary portions 1MY and 1MN, and the tape or the like is peeled off after completion of the partial plating. There is a case. However, it is necessary to purchase the tape, and to apply the tape and to peel off the tape. This greatly reduces the production efficiency and increases the production cost. Since variations and tape deformation occur at the time of applying the tape, it is impossible to obtain a position accuracy of 2 mm or less. Furthermore, in the case as shown in FIG. 8D where the workpiece has a large deformation portion such as unevenness or bending, masking is difficult.

  On the other hand, a so-called indirect bonding masking method has been proposed. Insulating masking is applied to the unnecessary parts of the plating, and the plating solution is discharged from the nozzle and allowed to flow while infiltrating the holding layer such as cloth, and the drum is rotated in this state. There is a partial plating apparatus configured to form a liquid pool in a portion in contact with the holding body layer and to perform partial plating in a state of being immersed in the liquid pool (see Patent Document 1). However, even in this method, as with the direct attachment masking method, masking with a tape or a masking member is difficult, and it is unsuitable for partial plating of a small (fine) and complex shaped strip-shaped workpiece.

  In view of this, there has been proposed an apparatus that forms a space between a plating-required portion and a masking member, supplies a plating solution into the space, and performs a plating treatment on the plating-required portion (for example, Patent Document 2). Even in such an apparatus, since the plating solution permeates between the masking member and the workpiece, the boundary between the plating-necessary portion and the plating-unnecessary portion partially fluctuates and the accuracy requirement cannot be satisfied.

Accordingly, the present applicant has developed a drum mask (hereinafter referred to as “drum mask”) that is capable of partial plating with high productivity and low cost while further improving the position accuracy of partial plating while the form of the workpiece is further miniaturized and complicated. A partial plating apparatus using a mask rotating body has been proposed (Patent Documents 3 and 4).
The apparatus of Patent Document 3 applies an anode potential to a plating solution supplied from outside in an electrode structure that rotates about a base axis, and feeds the plating solution after feeding from a slit portion continuous in the entire circumferential direction. This is a device that jets in a direction and sprays a plating solution only on selected plating-required portions in the width direction of the workpiece. If this is used, partial plating can be performed only on the plating-required portion, and the plating solution does not adhere to the plating-unnecessary portion, so that a low-quality and unnecessary plating film is not deposited.
Moreover, in patent document 4, by adding the improvement to the electrode structure of the continuous partial plating apparatus of patent document 3, and setting it as the specific split type which one split member and the other split member were combined up and down, An electrode nozzle hole is horizontally and accurately formed on a cylindrical outer periphery formed by close contact between these divided members, and this is incorporated into a continuous partial plating apparatus, from the electrode nozzle hole of the stationary electrode structure in the circumferential direction. The plating solution was sprayed vigorously. As a result, there is no turbulence in the vertical direction of the spray plating solution, and the workpiece that is engaged with the rotating body and is being continuously conveyed is prevented from contacting unnecessary plating solution, and the power supply area per unit amount of plating solution is reduced. The power supply efficiency has been increased and the productivity has been further improved by the high-speed rotation of the rotating body.

  By the way, TAB (Tape Automated Bonding) tape, COF (Chip On Film) tape, T-BGA (Tape Ball Grid Array) tape, Tape CSP (Chipclic Crate Application), and ASIC (Applied Critical Application) are tapes for mounting electronic components. ) Tapes, etc. have features such as the ability to form fine wiring, light weight, thinness, flexibility, and high flexibility in circuit design, so mobile phones, portable game machines, thermal heads, LCD drivers Or it is adopted in applications such as mainframes.

  For example, a TAB tape substrate has a very thin conductive layer on an insulating film support such as a continuous polyimide film, and this conductive layer is bonded to a metal foil, or is formed by sputtering, vacuum deposition or electroless plating. A wiring pattern having a predetermined thickness is formed by electroplating the conductive layer patterned in a predetermined shape. The polyimide film of the TAB tape has openings such as a sprocket hole for conveyance and a device hole for arranging semiconductor elements.

  When the bump of a semiconductor element such as LSI is a gold bump, gold plating is applied to a portion of the inner lead of the copper foil lead formed on the polyimide film that is thermocompression bonded to the gold bump. By performing the gold plating in this manner, the gold plating and the gold contained in the gold bump are melted together, and the connection reliability between the inner lead and the gold bump is improved. However, since gold is an expensive metal material, we want to reduce the amount used. Therefore, after forming the copper foil lead on the polyimide film, only a part of the copper foil lead is subjected to gold plating.

  In order to perform such partial plating, it is common to bond an insulating masking material to a plating unnecessary portion of the TAB tape, and the masking material is peeled off from the TAB tape after plating (see Patent Document 5). ). However, since the used masking material cannot be reused, it must be discarded, and resources are wasted. In order to solve this problem, it has also been proposed that the masking material is looped, pressed against the TAB tape at the time of plating, separated from the masking material after use, and repeatedly used by washing and drying (see Patent Document 6). ). However, in such a system, although the productivity is increased, there is a problem that the plating accuracy is lowered due to the masking material being gradually deformed or damaged.

  Semiconductor devices are becoming more and more miniaturized year by year and are mass-produced, and the demand for wiring tape such as the TAB tape is increasing. Therefore, in order to efficiently produce the wiring tape in large quantities, a multi-strip wiring tape that simultaneously manufactures a plurality (multiple strips) of wiring tape on a wide insulating substrate has been developed. According to this multi-stripe wiring tape, for example, by using a wide insulating substrate having a width of 70 mm, two 35 mm wide wiring tapes can be manufactured together, and a wide insulating property having a width of 105 mm. If a base material is used, the same three can be manufactured collectively.

However, the wide and multi-wiring wiring tape obtained in this way has an elongated strip-shaped portion for charging (feed line, slit) between each strip, and its area is more than several times that of the conventional one. Become. Therefore, in recent years, a drum mask has been used so that the gold plating on this portion can be omitted and the cost can be further reduced.
This mask rotating body is concentrically arranged outside the cylindrical electrode structure in order to save the plating solution, and serves as a masking material for preventing the plating solution from contacting the plating unnecessary portion of the tape. is there.
However, in the mask rotating body used in the terminal member and the wiring tape plating apparatus described above, the plating solution ejected from the electrode structure remains attached and gold (Au) precipitates. If gold (Au) is deposited on the mask rotating body, the adhesiveness of the tape is deteriorated, the accuracy of plating is lowered, and the guide pin is soiled to cause a failure. Therefore, depending on the type of plating solution, mask maintenance is required to remove the mask rotating body in about one day and peel gold (Au) from the surface.

  Under such circumstances, the problem of excessive plating solution adhering to the mask rotating body being deposited as gold (Au) is suppressed, and the maintenance frequency for preventing failure is reduced without lowering the plating accuracy. The advent of continuous partial plating equipment that can improve productivity at low cost has been desired.

Japanese Patent Laid-Open No. 02-97692 JP 2002-38294 A Japanese Patent Laid-Open No. 2005-187868 JP 2009-13466 A JP 2008-288406 A JP 2004-315916 A

  SUMMARY OF THE INVENTION In view of the above-described conventional problems, the object of the present invention is to spray a plating solution only on a necessary portion of a continuously conveyed belt-like workpiece, and perform continuous partial plating with high accuracy while a mask rotating body to which an excess plating solution is attached. It is an object of the present invention to provide a continuous partial plating apparatus and a continuous partial plating method using the same.

The inventors of the present invention have made extensive studies to solve the above-mentioned problems, and improved a continuous partial plating apparatus for carrying out a gold plating process only on a portion requiring plating while conveying a long workpiece continuous in the longitudinal direction. An electrode structure that ejects a plating solution radially from a large number of electrode nozzle holes formed in the side plate that serves as the anode electrode, and the workpiece that itself serves as the cathode electrode is conveyed to the outside of the electrode structure. The mask rotating body that rotates and prevents the plating solution from contacting the plating unnecessary portion of the workpiece is arranged concentrically, and further, a small amount of pure water is sprayed toward the mask rotating body to which the excess plating solution is attached. The cleaning nozzle and the wiping member were attached to the non-plating region after the plating region, that is, the region where plating was not performed.
Then, a minute amount of pure water was always sprayed with a cleaning nozzle so as not to affect the plating solution, and excess liquid was dropped with a wiping member. This eliminates the need for gold plating on the parts that do not require plating, and also suppresses the problem of excess plating solution adhering to the mask rotator depositing as gold (Au), so that the mask rotator can always be kept clean. The present inventors have found that productivity can be improved at a low cost by preventing failure of the apparatus without lowering the accuracy of plating, and the present invention has been completed.

That is, according to the first invention of the present invention, it is a continuous partial plating apparatus for carrying out a plating process only on a plating-required part while conveying a long continuous object in the longitudinal direction,
An electrode structure that ejects a plating solution radially from a large number of electrode nozzle holes formed in a side plate that becomes an anode electrode, and the object to be processed that itself becomes a cathode electrode is conveyed outside the electrode structure. The mask rotating body that rotates while preventing the plating solution from coming into contact with the plating unnecessary portion of the object to be processed is arranged concentrically,
Furthermore, a cleaning nozzle that sprays 100 to 500 ml / hr of pure water toward the mask rotating body to which excess plating solution has adhered, and a wiping member that drops excess liquid from the surface of the mask rotating body are attached to the non-plating region. A continuous partial plating apparatus characterized by the above is provided.

According to a second aspect of the present invention, in the first aspect, the mask rotating body has a side plate of polyphenylene sulfide (PPS), polyvinyl chloride (PVC), polyether ether ketone (PEEK), or glass. There is provided a continuous partial plating apparatus characterized by being one or more of epoxy composite materials.
According to a third aspect of the present invention, there is provided the continuous partial plating apparatus according to the first aspect, wherein the cleaning nozzle is a two-fluid nozzle.
According to a fourth aspect of the present invention, there is provided the continuous partial plating apparatus according to the first or third aspect, wherein the cleaning nozzle is installed at a position close to the transport roll in the non-plating region. Provided.
According to a fifth aspect of the present invention, there is provided the continuous partial plating apparatus according to the first aspect, wherein the wiping member is a brush having a fiber assembly made of synthetic resin.

On the other hand, according to the sixth invention of the present invention, the continuous partial plating apparatus according to any one of the first to fifth inventions is used to plate only the necessary portion of the long workpiece to be processed in the longitudinal direction. A continuous partial plating method,
While continuously transporting the object to be processed by the mask rotating body, a plating solution is ejected from the electrode nozzle of the electrode structure in the power supply state toward the mask rotating body, and the object to be processed is partially plated. 100-500 ml / hr of pure water is sprayed from the cleaning nozzle toward the mask rotating body to which the plating solution has adhered, and the wiping member is brought into contact with the mask rotating body sprayed with pure water to drop excess liquid. A continuous partial plating method is provided.

According to a seventh aspect of the present invention, there is provided the continuous partial plating method according to the sixth aspect, wherein the object to be processed is a leaded terminal member or a wide electronic component mounting tape. Provided.
According to an eighth aspect of the present invention, there is provided the continuous partial plating method according to the seventh aspect, wherein the lead-equipped terminal member is entirely plated with nickel in advance. The
Furthermore, according to a ninth aspect of the present invention, there is provided the continuous partial plating method according to the seventh aspect, wherein the electronic component mounting tape is a polyimide film in which a plurality of copper foil leads are formed. Provided.

  According to the continuous partial plating apparatus of the present invention, since the pure water is sprayed from the cleaning nozzle toward the mask rotating body to which the excess plating solution adheres, the mask rotating body can be efficiently cleaned. At this time, if a two-fluid nozzle is used as a cleaning nozzle, the amount of water sprayed can be limited to within several hundred ml / hr. Therefore, moisture taken out by adhering to the workpiece (product) after plating or heated plating. A state equal to or less than the evaporation of the solution can be maintained throughout the continuous operation, and excess water is not supplied to the original plating solution.

Furthermore, the continuous partial plating apparatus of the present invention can spray a small amount of pure water, then drop excess liquid with a wiping member such as a brush, and always keep the mask rotating body clean. However, continuous operation for 14 days or more is possible without changing the mask rotating body.
As a result, the frequency of maintenance and inspection work can be reduced, and the productivity of leaded terminal members and wide electronic component mounting tapes can be greatly improved.

The one embodiment of the continuous partial plating apparatus of this invention which attached the washing | cleaning nozzle and the wiping member near the mask rotary body is shown, the upper figure is a top view, and the lower figure is a side view. It is a side view of the mask rotary body and washing | cleaning nozzle of the continuous partial plating apparatus of this invention shown in FIG. It is a side view of the mask rotary body and wiping member of the continuous partial plating apparatus of this invention shown in FIG. It is a longitudinal cross-sectional view of the mask rotary body part of the continuous partial plating apparatus of this invention shown in FIG. It is a top view which shows the other embodiment of the continuous partial plating apparatus of this invention which attached the washing | cleaning nozzle and the wiping off member adjacent to the mask rotary body. It is explanatory drawing which shows the state which the tape for wide electronic component mounting adheres to a mask rotary body, and is conveyed. It is explanatory drawing which shows the plane of the strip | belt-shaped workpiece | work which has a comb-tooth-shaped part. It is explanatory drawing which shows the side surface of a strip | belt-shaped workpiece | work.

  Hereinafter, the continuous partial plating apparatus of this invention and the continuous partial plating method using the same are demonstrated in detail using FIGS.

The continuous partial plating apparatus of the present invention is a continuous partial plating apparatus for carrying out a plating process only on a plating-required part while conveying a long workpiece to be processed in the longitudinal direction,
An electrode structure that ejects a plating solution radially from a large number of electrode nozzle holes formed in a side plate that becomes an anode electrode, and the object to be processed that itself becomes a cathode electrode is conveyed outside the electrode structure. The mask rotating body that rotates while preventing the plating solution from coming into contact with the plating unnecessary portion of the object to be processed is arranged concentrically,
Furthermore, a cleaning nozzle that sprays 100 to 500 ml / hr of pure water toward the mask rotating body to which excess plating solution has adhered, and a wiping member that drops excess liquid from the surface of the mask rotating body are attached to the non-plating region. It is characterized by that.

1. Electrode Structure In the present invention, the electrode structure has a cylindrical inner space serving as a plating solution reservoir, which feeds the plating solution supplied to the inside and accurately plating from the electrode nozzle hole toward the workpiece that is continuously conveyed. The liquid is ejected.
As long as it has such a function, it is not limited by the structure, but as shown particularly in Patent Document 4, an upper and lower split type formed by combining one divided member and the other divided member vertically. Those are preferred.

The material of the division member which comprises an electrode structure will not be specifically limited if it is an electrical good conductor, It selects from titanium, a titanium alloy, or stainless steel suitably. Of these, titanium or titanium alloy, which has corrosion resistance and high mechanical strength, is preferable.
In the present invention, when the workpiece is a lead-equipped terminal member, the height of the side plate is about the same as or longer than the length of the lead-equipped terminal member, and is preferably 50 to 100 mm, for example.

The electrode nozzle holes of the electrode structure are horizontally arranged in a row extending in the normal direction of the virtual circular locus. The diameter of the electrode nozzle varies depending on the size of the workpiece, the size of the necessary part of plating, etc., but usually the diameter of the electrode nozzle is 0.1 mm to 2.5 mm, preferably 0.2 mm to 2.0 mm, especially 0. It is preferable to be 3 mm to 1.5 mm.
It is desirable that the electrode nozzle diameter corresponds to the size of the plating required part (the larger one in the front-rear direction dimension and the left-right direction dimension). The diameter of the electrode nozzle is preferably selected to be 0.3 mm for spraying.
The number of electrode nozzles is usually 10 to 200, preferably 100 to 150, although it varies depending on the size of the electrode structure. If the number of nozzles is less than 10, sufficient plating solution cannot be sprayed, and the power feeding efficiency can be improved as the number is increased. However, increasing the number of nozzles is more difficult in terms of processing technology.
The arrangement interval (pitch) of the electrode nozzles is usually 0.1 mm to 3 mm, although it varies depending on the size of the electrode structure. Although it may be within this interval range, it is particularly desirable that the interval is equal.

  The arrangement angle range (θ) of the electrode nozzles arranged in a line on the cylindrical outer periphery formed by the divided members is determined after determining the current density and processing time necessary to obtain a desired plating thickness. From there, determine the optimum outer shape. The angle range (θ) is selected and determined to be smaller than the angle range (180 degrees in the case of FIG. 1 where the workpiece is a lead terminal member) where the workpiece is engaged with the conveyance guide surface of the mask rotating body 3. Is plated.

In the case where the workpiece is a wide electronic component mounting tape, the side plate of the electrode structure is designed to be larger than the case of the leaded terminal member. That is, the vertical length (height) of the side plate must be equal to or greater than the width of the electronic component mounting tape, and is preferably 100 to 330 mm, for example.
FIG. 6 shows a state in which a wide electronic component mounting tape is conveyed in close contact with the mask rotating body. Each electrode nozzle hole of the electrode structure is horizontal and has a number of steps corresponding to the number of tape plating patterns in the form extending in the normal direction of the virtual circle locus on the horizontal surface of the central part of the tape plating pattern for mounting electronic components (see FIG. 6 is arranged in 6 steps).

The plating solution stored in the drum of the electrode structure has the lowest potential energy at the top and the highest potential energy at the bottom. As a result, if the nozzle diameter is the same, the plating solution has a low injection speed from the electrode nozzle located at the uppermost part and a maximum injection speed from the electrode nozzle located at the lowermost part. Therefore, it is desirable to change the number of electrode nozzles according to the height of the electrode structure on which the nozzles are provided so that the plating solution in the drum of the electrode structure does not become uneven in the vertical direction. For example, the number of nozzles in the lower part (lower stage) of the electrode structure side plate is small, and the number of nozzles in the upper part (upper stage) is preferably increased. As a result, the plating pattern portion in the lower part of the tape has a small injection amount from the nozzle, but a sufficient amount of plating solution is supplied by the plating solution flowing down from the plating pattern part in the upper part.
Specifically, in the case of three stages, 20 to 80 electrode nozzles located at the upper part, 10 to 50 electrode nozzles located at the middle part, and 8 to 20 electrode nozzles located at the lowermost part. Is preferred. In addition, as shown in FIG. 6, in the case of 6 stages, 30 to 100 electrode nozzles located at the uppermost part, 20 to 80 electrode nozzles located at the middle part, and 10 to 30 electrode electrodes located at the lowermost part. It is preferable to use one.
The arrangement interval (pitch) of the electrode nozzles is related to the number of electrode nozzles described above, but is usually 1 mm to 30 mm, and preferably 2 mm to 20 mm. It suffices if it is within this interval range, but it is desirable that the interval be equal in the lateral direction. When the pitch exceeds 30 mm, it is not preferable because the plating solution cannot be accurately sprayed onto the tape pattern. On the other hand, as the pitch is reduced, the actual power supply area per unit amount of the plating solution can be increased, but less than 1 mm. It is difficult in terms of processing technology.
For the above reason, the pitch of the electrode nozzles changes according to the height position of the nozzle. For example, the pitch of the low part (lower stage) is wide and the pitch of the high part (upper stage) is narrow.
The electrode nozzle is formed by drilling a hole in the plate-like body serving as the side plate. In this invention, although the case where the nozzle hole was formed in 6 steps | paragraphs or 3 steps | paragraphs was shown, it is not limited to this, It increases / decreases according to the width | variety of a workpiece | work (wide electronic component mounting tape). .

FIG. 5 shows a state in which a wide electronic component mounting tape is conveyed in close contact with the mask rotating body. The arrangement angle range (θ) of the electrode nozzles arranged in a horizontal row on the outer periphery of the cylindrical side plate is smaller than the angle range (about 270 degrees in FIG. 5) in which the tape contacts the conveyance guide surface of the rotating body. It is selected and determined by the angle range (θ).
Inside the drum, not only does the plating solution spray easily change due to the turbulent flow and diffusion of the plating solution, but also the upper and lower parts of the necessary plating area if the tape is not in close contact with the transport guide surface. However, if the electrode nozzle arrangement angle range (θ) is used, such a phenomenon is eliminated.

  The angle range θ in which the electrode nozzle is disposed is 100 to 260 degrees, preferably 150 to 240 degrees, and more preferably 180 to 230 degrees. Within this angle range θ, the plating solution can be ejected in a uniform and sufficient amount with respect to the pattern portion of the tape.

  The side plate of the electrode structure has a disc-shaped upper lid at the top and a lower lid at the bottom, and is connected and integrated with screws. The side plates are preferably connected and fixed to the upper and lower lids with bolts in a state where the distance between the side plates is kept constant by a pipe (rod-like body). It is preferable to provide the pipe (rod-like body) at a plurality of locations.

2. Mask Rotator In the present invention, the mask rotator is a cylindrical jig that prevents the plating solution from coming into contact with the plating-unnecessary part of the workpiece, and is located outside the side plate of the electrode structure 13 as shown in FIG. They are arranged concentrically.

The material (masking material) constituting the mask rotating body 16 is at least one of polyphenylene sulfide (PPS), vinyl chloride (PVC), polyether ether ketone (PEEK), or glass epoxy composite material.
When the workpiece is a lead terminal member, polyphenylene sulfide (PPS), vinyl chloride (PVC), or polyether ether ketone (PEEK) is preferable. When the work is an electronic component mounting tape, it is preferable that the glass epoxy composite material is used as a support and the surface thereof is covered with a silicon rubber film as an insulating film.
The glass-epoxy composite material is FRP in which glass fibers are hardened with an epoxy resin, and the surface thereof is a silicon rubber film to which a silicone paint is applied. In addition to glass fibers, inorganic fibers such as carbon fibers or organic fibers such as aramid fibers may be used as the reinforcing material, and thermosetting resins or thermoplastic resins other than epoxy resins may be used as the matrix. An epoxy resin is preferable as a matrix because of good adhesion from the viewpoint of heat resistance, water resistance, solvent resistance, chemical resistance, dimensional stability, and the like. The glass fiber can be impregnated with an epoxy resin and cured in a mold, or formed into a pipe by drawing or extruding to form a support.

A prepreg in which glass fiber is impregnated with an epoxy resin and B-staged (a state in which a liquid thermosetting resin is dried and polymerized to some extent) is commercially available, and is used to wind it around a predetermined mandrel. If it is heat-cured, it can be easily formed into a cylindrical shape. It is also possible to impregnate a fiber bundle (strand or filament) with an epoxy resin, directly wind the filament on a mandrel at a certain angle, and then cure and mold.
Since the cylindrical shape molded by these methods is not smooth enough as it is, in order to obtain the roundness required for the use of a high-speed rotating body, surface polishing is performed after molding, and further crosslinking is performed. A silicone rubber solution is applied to form a silicon rubber film. It is preferable to perform surface polishing even after the silicon rubber film is formed. That is, in the present invention, the masking material is smoothened by polishing the surface in contact with the tape.

When the silicon rubber film is formed on the surface of the support in this way, the friction coefficient of the surface is reduced, the friction with the tape is reduced, and the tape is smoothly transported. A predetermined portion of the tape can be hit. Moreover, since the silicon rubber film is not corroded by the plating solution, the dimensional stability of the masking material is maintained.
The thickness of the masking material is 0.5 to 5 mm. When a silicon rubber film is formed on the surface, the thickness of the glass epoxy composite material that serves as a support is appropriately set depending on the type of electronic component mounting tape, the arrangement of the tape plating pattern, and the like. For example, the support and the rubber film are both about 0.3 to 1 mm, preferably 0.4 to 0.8 mm. When the interval between the tape plating patterns is narrow, it is preferable to set the thickness of the glass epoxy composite material to be the support to 1 to 5 mm so that the tape can be adhered and stably conveyed while maintaining the mechanical strength. .

In the mask rotating body 16, a tunnel passage 21 (hereinafter referred to as a window) through which the plating solution can pass must be open so that the plating solution can be supplied to a portion of the work that requires plating. The shape and size of the window are substantially the same as the shape and size of the plating pattern, and it is desirable that the window exists on the entire circumference of the cylindrical object made of the masking material.
The window 21 is opened at a predetermined position of the cylindrical material of the masking material by pressing or laser processing. In this operation, unevenness is generated at the cut portion, and it becomes rough. Therefore, it is desirable to remove the protrusion by performing surface polishing. If the window 21 has a convex portion, when the workpiece is a tape, the tape does not adhere to the masking material, so that the plating solution flows to the plating unnecessary portion.
In the mask rotating body for continuous partial plating of a wide (two-row) TAB tape, three windows are close to each of the upper and lower stages, and a wide space is provided in the middle in the middle. ing. According to the present invention, in such a case, it is possible to provide a wider space between each of the six windows in each row, whereby the portion that does not require plating can be enlarged, and the money saving effect is further enhanced. .

The mask rotating body 16 is attached to the apparatus by sandwiching the upper and lower sides with circular plates and connecting and fixing them with bolts. This disk is preferably made of titanium or a titanium alloy having corrosion resistance and high mechanical strength. Note that the masking material can be fixed by using a positioning pin at a central portion where the charging power supply line comes into contact.
The mask rotating body 16 is concentrically disposed outside the side plate of the electrode structure. As long as the vertical length (height) of the masking material is equal to the width of the workpiece, it is sufficient because it can cover the partially plated part, but the inner peripheral radius is the outer periphery of the side plate of the electrode structure. A dimension slightly larger than the radius is required.

  That is, the inner peripheral radius is set to be about 0.1 to 3 mm larger than the outer peripheral radius of the side plate of the electrode structure 13 so that the side surface of the mask rotating body 16 does not come into contact with the side plate of the electrode structure 13. Must be able to. If the gap is 0.1 mm or less, it becomes difficult to transport the workpiece. If it exceeds 3 mm, the distance from the electrode nozzle injection port on the outer periphery of the side plate to the workpiece increases, and the sprayed plating solution is dispersed. Too much and partial plating becomes insufficient.

In the present invention, the mask rotating body 16 has a function of transporting a workpiece using the surface as a guide surface.
The mask rotator 16 is rotatably mounted via a bearing on the upper part of a rotation shaft centered on the Z axis. The mounting is not limited to this, and the lower plating solution supply pipe 12 may be rotatable via a bearing. Thereby, the outer peripheral surface of the mask rotating body (masking material) 16 is used as a conveyance guide surface, and the workpiece can be conveyed smoothly.

  Further, the mask rotating body 16 can be attached / detached by tightening / relaxing by fixing it to the shaft member with a bolt, so that it can be easily replaced with another mask rotating body having different specifications.

Since the electronic component mounting tape to be partially plated is wide, the tape is subjected to a larger impact force by the plating solution ejected from a large number of electrode nozzles. Since the silicon rubber film is formed on the surface of the masking material, it does not float up, but the place where the plating solution hits becomes inaccurate and may be supplied unevenly.
Therefore, in the present invention, as shown in FIG. 5 (left side), it is desirable to provide a tape pressure contact rotating body 31 for adhering the tape to the surface of the mask rotating body 16 in the vicinity of the mask rotating body 16. .
The tape pressure contact rotating body 31 has a function in which the tape T in contact with the mask rotating body 16 has a function of pulling the tape toward the electrode nozzle side with a force that does not lose the impact force of the plating solution jet and closely contacting the mask rotating body 16. It is. Therefore, the tape pressure contact rotary body 31 has a configuration in which the mask rotary body 16 is sandwiched between the mask rotary body 16 and both sides. The positional relationship between the three rotators is preferably an equilateral triangle or an isosceles triangle when the rotation axis of another tape pressure contact rotator 31 is connected with the rotation axis of the mask rotator 16 as an apex.

The electronic component mounting tape that is partially plated according to the present invention has a wide width, so it is difficult to keep the conveyance speed constant in a vertically standing state. When the conveyance speed is slow, the tape is slackened, and conversely, the conveyance speed is high. Then, it will be damaged by the strong force on the tape. Further, when the impact force of the plating solution hitting the tape becomes unbalanced vertically, the tape position may fluctuate up and down. The tape pressure contact rotating body 31 may have a function of correcting the variation in the position of the tape so that the tape to be plated does not swing up and down and left and right and is stably conveyed by the mask rotating body 16. desirable.
In addition, a separate rotating body is arranged in front of the tape pressing rotary body 31 so as to automatically adjust the rotational speed of the mask rotating body when detecting that the tape transport speed fluctuates beyond the set range. It is preferable to do. In FIG. 5 (right side), three tape speed detecting rotators 32 are arranged for this purpose, and an intermediate rotator is provided with a fulcrum 33 that can swing according to slack of the tape. If the tape transport direction is the X direction, the direction in which the tape speed detecting rotating body 32 slides is the Y direction.
None of the rotary body 31 for pressure welding and the rotary body 32 for detecting the tape speed require a tape transport function, but a lining such as silicon rubber is formed on the surface of the rotary body such as aluminum or polypropylene. Are preferred.

  In the continuous partial plating apparatus of the present invention, a cleaning nozzle and a wiping member are attached to the outside of the mask rotating body, in the non-plating region.

3. Cleaning nozzle In this invention, a cleaning nozzle sprays a trace amount of pure water toward the mask rotary body to which the excess plating solution adhered. As long as a very small amount of pure water can be sprayed, it is not limited by the type or structure of the nozzle, but a two-fluid nozzle is preferable.

  The two-fluid nozzle 1 mixes gas and liquid supplied from a gas inlet and a liquid inlet formed in the nozzle body in a mixing chamber, and the gas-liquid mixed fluid is gas-liquid through an injection hole provided in the injection chamber. The mixed mist is injected. For example, those manufactured by Ikeuchi Co., Ltd. are preferably used. The details thereof are disclosed in JP-A-2006-167601. A gas is supplied along the axial center line of the nozzle body, and a mixing chamber is provided for mixing the gas from the outer circumferential direction with respect to the gas. The injection chamber is in communication. Although the elevation angle of the two-fluid nozzle 1 varies depending on the size and shape of the mask rotating body and the workpiece, it is preferably 50 to 90 degrees.

The cleaning nozzle is preferably installed at a position close to the transport roll in the non-plating region. And it fixes to the position which approached the conveyance roll of a non-plating area | region, ie, the position nearest to the plating area | region, with the support component 4. FIG. At the time of fixing, the distance between the mask rotating body and the nozzle tip is set by searching for a position where the water hitting the mask has sufficient strength (strength that can remove the plating solution attached). Although it depends on the type and size of the work and drum, the space inside the apparatus, the water pressure, etc., it is preferable to make them approach in the range of 10 to 100 mm, particularly in the range of 20 to 50 mm. If the distance is less than 10 mm, pure water may not be sprayed over the entire longitudinal direction of the mask rotator due to the elevation angle. If the distance exceeds 100 mm, the spraying pressure on the surface of the mask rotator decreases and the cleaning power May decrease.
In addition, when the workpiece is a lead-equipped member, the direction of the cleaning nozzle tip should be directed to the center of the mask rotating body, and in the case of a wide electronic component mounting tape, the cleaning nozzle tip should be oriented tangentially. Efficiency can be increased.

4). Wiping member In this invention, a wiping member makes a brush etc. contact the mask rotary body sprayed with the pure water, and drops excess liquid.

  As the wiping member having such a function, a brush, a sponge, a spatula, a cloth, or the like can be used. Among these, the brush 2 having a fiber assembly made of synthetic resin shown in FIG. 1 is preferable. The brush 2 is a rectangular brush whose height is about the same as the height of the mask rotating body and whose thickness is about 3 to 10 mm. The height is preferably 100 to 300 mm, for example, when the workpiece is a lead-equipped terminal member, and is preferably 100 to 300 mm, for example, for a wide TAB. The material is preferably a synthetic resin such as polypropylene (PP) or polyethylene (PE) having a heat resistance of about 150 to 250 ° C. The brush 2 of the wiping member is fixed by the member 5 so as to lightly contact the surface of the mask rotating body after the pure water is sprayed.

  On the side surface of the mask rotating body 16, ceramic pins 13 for guiding a workpiece (processed product) are arranged. When continuous partial plating is continued for a long time, an excessive plating solution adheres to the mask rotating body 16 and the ceramic pins 22 are contaminated. In addition, a plurality of windows 21 are formed in the circumferential direction in the mask rotating body 16 and the windows are extremely small, for example, several millimeters in diameter, so that the plating solution tends to remain. In the present invention, by using a wiping member such as the brush 2, it is possible to remove such dirt accumulated on the ceramic pins 22 or prevent liquid pooling.

  In addition to the above, the continuous partial plating apparatus of the present invention includes a plating solution supply pipe for supplying a plating solution from the plating tank to the inside of the electrode structure, and a power supply device for supplying power to the electrode nozzle of the electrode structure, A plating solution is sprayed from the electrode nozzle while continuously conveying the belt-like workpiece, and the plating treatment is continuously performed on the plating-required portion of the workpiece.

5. Continuous partial plating method The continuous partial plating method of the present invention is a continuous partial plating method in which only the necessary part of a long workpiece to be processed in the longitudinal direction is plated using the continuous partial plating apparatus,
While continuously transporting the object to be processed by the mask rotating body, a plating solution is ejected from the electrode nozzle of the electrode structure in the power supply state toward the mask rotating body, and the object to be processed is partially plated. 100-500 ml / hr of pure water is sprayed from the cleaning nozzle toward the mask rotating body to which the plating solution has adhered, and the wiping member is brought into contact with the mask rotating body sprayed with pure water to drop excess liquid. It is characterized by.

(First embodiment)
Next, a method for continuously and partially plating a lead-equipped terminal member as a workpiece according to the present invention will be described.

  The side plate of the mask rotator constituting the plating apparatus is made of one or more materials of PPS, PVC, HTPVC, and PEEK, and the side plate of the mask rotator has pins 13 for guiding the processed product. . As shown in FIG. 1, the mask rotating body 3 rotates to the right when the workpiece 11 is conveyed in the right direction. Similarly, the transport roll 8 rotates to the right and the transport roll 9 rotates to the left, so that the workpiece is transported at a set transport speed (for example, 2 m / min).

  When the workpiece passes through the plating area 14 of the mask rotator 3 (portion shown in FIG. 1), the plating solution radiates from the center of the mask rotator 3 via the paths 12 and 13 in FIG. Discharged. The flow rate of the plating solution sprayed from the electrode nozzle (nozzle diameter 0.3 mm) is, for example, 10 m / sec, so that the flow of the sprayed plating solution is in a straight line. Electroplating (partial plating) is performed by energizing the electrode 15 between the discharged plating solution and the workpiece.

By this plating process, the plating solution adheres to the side surface 16 of the mask rotating body 3. If this is left as it is, gold deposits on the surface of the mask rotating body 3 and becomes dirty.
In order to suppress this, in the cleaning nozzle (two-fluid nozzle) 1 fixed by the support component 4, water is sprayed in a mist form with water supplied from the path 6 and air supplied from the path 7. The side plate 16 of the rotating body is cleaned. At this time, the closer the tip of the cleaning nozzle is to the mask rotating body, the more the cleaning efficiency can be improved. However, this distance is preferably 10 to 20 mm, for example.

The spray state is appropriately controlled by the supply amount (pressure) of air. Amount of water, 100 to 500 ml / hr and Suruga, preferably 100~400ml / hr, 100~300ml / hr are more preferred. If the water content is less than 100 ml / hr, a sufficient cleaning effect cannot be expected. On the other hand, if the amount of water is 500 ml / hr or less, the water taken out by adhering to the treated product, or a state equivalent to or less than the evaporated amount of the heated plating solution can be maintained throughout the continuous operation. It does not have an influence such as excessive water being supplied to the original plating solution.
As long as the processed product 11 is conveyed by the mask rotating body 3, the above-described cleaning state is continued and a continuous operation state is maintained.

The cleaned mask rotating body 3 continues to remove excess moisture by the wiping member (brush) 2.
The brush 2 has a rectangular shape with a height of 10 to 50 mm and a thickness of 5 to 15 mm, and a material made of PP having chemical resistance can be selected. By using a brush, excess liquid is dropped, the mask rotating body is always kept clean, and dirt accumulated on the ceramic pins is also removed.
The fed plating solution sprayed from the electrode nozzle is sprayed onto the plating-required portion, then falls and flows, and is collected in the main tank, and the plating solution is recycled.

(Second Embodiment)
Next, a method for continuous partial plating of a wide electronic component mounting tape according to the present invention will be described. The width of the electronic component mounting film tape to be plated is 100 to 300 mm, an opening such as a sprocket hole for transportation or a device hole for semiconductor element placement is opened, and a long and narrow strip-shaped feeder for charging is provided. Is provided. Also, inner leads that are gold plated, outer leads that do not require gold plating, test pads, and the like are gathered.

The side plate of the mask rotator constituting the plating apparatus is made of a glass epoxy composite material having a surface covered with a silicon rubber film. The side plate of the mask rotating body has pins 13 for guiding the processed product. In FIG. 5, transport rollers 31 and 32 continuously transport the tape in the X direction. The set conveying speed of the tape T is not particularly limited, but is usually 2 m / min, preferably 0.1 to 10 m / min, and more preferably 0.5 to 5 m / min. If it is the tape conveyance speed of this range, the precision and productivity of plating will not be deteriorated. The tape T is conveyed in contact with the mask rotating body surface of the continuous partial plating apparatus in a state where the tape T stands vertically as shown in FIG.
In the continuous partial plating apparatus, the plating solution is continuously supplied from the continuous plating solution supply means while being pressurized to a predetermined pressure at the electrode structure (plating solution supply port).
The plating solution is sprayed from the electrode nozzle, passes through the window of the masking material, hits the pattern portion of the tape, and is subjected to a partial plating process. The flow rate of the plating solution sprayed from the electrode nozzle is difficult to define, but is preferably 5 m / sec to 20 m / sec. If it is this range, the liquid flow of a spraying plating solution will become a straight line, and a plating solution can be made to contact the plating pattern part of a tape.
In the actual plating process, the optimum flow rate of the plating solution is determined while reviewing the relationship with the diameter of the electrode nozzle, the type / viscosity of the plating solution, the material / size of the tape, and the like. In the present invention, since the plating solution is ejected all at once from a large number of electrode nozzles concentrated on a large area, a tape having a wide width receives a considerable impact by the ejection force. However, since the rotating body for tape pressure contact is disposed in the vicinity of the mask rotating body, the tape can be pulled to the electrode structure side, and the tape is kept in close contact with the mask rotating body.
When the tape passes through the plating region, partial gold plating is applied to the tape being continuously conveyed with a plating solution sprayed from the electrode nozzle of the electrode structure in the power supply state.

By this plating process, the plating solution adheres to the side surface of the mask rotating body. If this is left as it is, gold deposits on the surface of the mask rotating body and becomes dirty.
In order to suppress this, the cleaning nozzle (two-fluid nozzle) 1 fixed by the support component sprays water in the form of a mist to clean the side plate of the mask rotating body. In the case of TAB drum plating (tape width 220 mm), a cleaning nozzle having a wide angle of 100 to 120 degrees is used, and the nozzle is preferably installed at a position where the distance between the tip and the mask is 80 to 120 mm. The tip is preferably directed in a direction in which the spray contact point of the drum becomes a tangent, since the effect of peeling off the deposit is great.
In this range, the closer the tip of the cleaning nozzle is to the mask rotating body, the more the cleaning efficiency can be improved. However, if it is less than 80 mm, the spray may not contact the surface of the mask rotating body. In some cases, the spraying pressure is insufficient and the cleaning effect cannot be obtained.
The spray state is appropriately controlled by the supply amount (pressure) of air. Amount of water, 100 to 500 ml / hr and Suruga, preferably 100~400ml / hr, 100~300ml / hr are more preferred. If the water content is less than 100 ml / hr, a sufficient cleaning effect cannot be expected. On the other hand, if the amount of water is 500 ml / hr or less, the water taken out by adhering to the treated product, or a state equivalent to or less than the evaporated amount of the heated plating solution can be maintained throughout the continuous operation. It does not have an influence such as excessive water being supplied to the original plating solution.
As long as the processed product (tape) 11 is transported by the mask rotating body 3, the cleaning state is continued and the continuous operation state is maintained.

The cleaned mask rotating body continues to remove excess moisture by the brush 2 of the wiping member. The brush 2 is preferably a rectangular shape having a height of 150 to 250 mm and a thickness of 10 to 30 mm, and a material made of PP having chemical resistance.
By bringing the brush into contact with the mask rotating body 3, excess liquid is dropped, the mask rotating body is always kept clean, and dirt accumulated on the ceramic pins is also removed.
The plating solution that passes through the window of the masking material and hits the tape flows down and is collected in the tank. The plating solution that has not passed through the window of the masking material is also collected in the same manner and removed from the dust, and then reused.

  Examples of the present invention and comparative examples are shown below, but the present invention is not construed as being limited to these examples.

[Example 1]
A lower divided member (diameter 120 mm, thickness 65 mm) and an upper divided member (outer diameter 120 mm, inner diameter 80 mm, height 65 mm) were prepared using a stainless steel metal material. The lower divided member was provided with 110 circular electrode nozzle holes having a diameter of 1.5 mm at equal intervals. The arrangement angle of the electrode nozzle was set to 110 degrees. The electrode nozzle hole portions of these divided members were subjected to platinum metal plating with a thickness of 3 μm using a platinum metal compound.
Next, two split members were connected to each other with a combination bolt, and a split electrode structure having a cavity inside and a cylindrical side surface was obtained.
Also, a mask rotating body (outer diameter 150 mm, inner diameter 140 mm, height 40 mm) was manufactured using a PPS plate, and incorporated into the outer periphery of the split electrode structure.
And the washing | cleaning nozzle 1 and the wiping off member 2 were attached, and the continuous partial plating apparatus like FIG. 1 was comprised. As a cleaning nozzle, a two-fluid nozzle (product name: BIMJ2004PP + TPP-IN) of Ikeuchi Co., Ltd. was used. The component 4 was fixed toward the center of the mask rotating body at a position close to the transport roll. The distance between the mask rotating body and the nozzle tip was 18 mm. The elevation angle was 0 degree.
The wiping member 2 is a rectangular brush (height 30 mm, width 15 mm) approximately equal to the width of the mask rotating body, and a chemical-resistant PP brush was selected.
Pre-nickel-plated terminal member with lead (total length Lv is 2 mm, lead portion (1KY) length Lu is 1 mm, barrier portion (1MN) length Lm is 0.5 mm, protrusion length Lw is 1.5 mm, terminal portion ( 1TY) length Ld was set to 0.5 mm), and the conveyance speed was set to 2 m / min. A plating solution was sprayed from the electrode nozzle hole at a flow rate of 10 m / sec to perform partial plating on the terminal portion (1TY). 100 ml / hr pure water was continuously sprayed by a two-fluid nozzle.
After operating the continuous partial plating apparatus for 336 hours, the apparatus was stopped, the mask rotating body was removed, and the external surface of the mask rotating body was observed, but no noticeable dirt was found. Also, the surface of the ceramic pin was observed, but no noticeable dirt was found.

[Example 2]
The terminal member with leads was subjected to continuous partial plating in the same manner as in Example 1 except that 500 ml / hr of pure water was continuously sprayed with a two-fluid nozzle.
After operating the continuous partial plating apparatus for 336 hours, the apparatus was stopped, the mask rotating body was removed, and the external surface of the mask rotating body was observed, but no noticeable dirt was found. Also, the surface of the ceramic pin was observed, but no noticeable dirt was found.
For this reason, it has been found that continuous partial plating can be performed even if the workpiece conveyance speed is increased to about 15 m / min.

[Comparative Example 1]
A continuous partial plating apparatus was configured in the same manner as in Example 1 except that the two-fluid nozzle 1 and the brush 2 were not attached. A workpiece was set in the same manner as in Example 1, and a plating solution was sprayed from the electrode nozzle hole to perform partial plating on the terminal portion (1TY).
When partial plating was continued for 30 hours in this state, the conveyance of the workpiece gradually became unstable.
Therefore, the apparatus was stopped, the mask rotating body was removed, and the external surface of the mask rotating body was observed. Gold resulting from the adhesion of the plating solution adhered to the mask rotating body, particularly around the window as dirt. Further, dirt was also attached to the surface of the ceramic pin. Therefore, in the subsequent continuous partial plating, the apparatus was operated for 24 hours and then cleaned.

1 Cleaning nozzle 2 Wiping member 3 Mask rotating body

Claims (9)

A continuous partial plating apparatus for carrying out a plating treatment only on a plating-required portion while conveying a long workpiece to be continuous in the longitudinal direction,
An electrode structure that ejects a plating solution radially from a large number of electrode nozzle holes formed in a side plate that becomes an anode electrode, and the object to be processed that itself becomes a cathode electrode is conveyed outside the electrode structure. The mask rotating body that rotates while preventing the plating solution from coming into contact with the plating unnecessary portion of the object to be processed is arranged concentrically,
Furthermore, a cleaning nozzle that sprays 100 to 500 ml / hr of pure water toward the mask rotating body to which excess plating solution has adhered, and a wiping member that drops excess liquid from the surface of the mask rotating body are attached to the non-plating region. The continuous partial plating apparatus characterized by having performed.   2. The mask rotating body according to claim 1, wherein a side plate of the mask rotating body is one or more made of polyphenylene sulfide (PPS), polyvinyl chloride (PVC), polyether ether ketone (PEEK), or glass epoxy composite. Continuous partial plating equipment.   The continuous partial plating apparatus according to claim 1, wherein the cleaning nozzle is a two-fluid nozzle.   4. The continuous partial plating apparatus according to claim 1, wherein the cleaning nozzle is installed at a position close to a conveyance roll in a non-plating region.   The continuous partial plating apparatus according to claim 1, wherein the wiping member is a brush having a fiber assembly made of synthetic resin. Using the continuous partial plating apparatus according to any one of claims 1 to 5, a continuous partial plating method for plating only a necessary part of a long workpiece to be processed in the longitudinal direction,
While continuously transporting the object to be processed by the mask rotating body, a plating solution is ejected from the electrode nozzle of the electrode structure in the power supply state toward the mask rotating body, and the object to be processed is partially plated. 100-500 ml / hr of pure water is sprayed from the cleaning nozzle toward the mask rotating body to which the plating solution has adhered, and the wiping member is brought into contact with the mask rotating body sprayed with pure water to drop excess liquid. A continuous partial plating method characterized by:   The continuous partial plating method according to claim 6, wherein the object to be processed is a lead terminal member or a wide electronic component mounting tape.   The continuous partial plating method according to claim 7, wherein the lead terminal member is entirely plated with nickel in advance.   The continuous partial plating method according to claim 7, wherein the electronic component mounting tape is a polyimide film in which a plurality of copper foil leads are formed.

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