CN1697597A - Surface treatment appts.of substrate material - Google Patents
Surface treatment appts.of substrate material Download PDFInfo
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- CN1697597A CN1697597A CN 200410048251 CN200410048251A CN1697597A CN 1697597 A CN1697597 A CN 1697597A CN 200410048251 CN200410048251 CN 200410048251 CN 200410048251 A CN200410048251 A CN 200410048251A CN 1697597 A CN1697597 A CN 1697597A
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Abstract
A surface processor for substrate material which firstly cancels troubles on the conveyance of a substrate material such as sticking, adhesion, winding, falling or the like whereby the smooth and stabilized conveyance of the substrate material is realized and secondly suppresses the generation of a turbulent flow of processing liquid on the substrate material whereby processing accuracy can be maintained. The surface processor 5 is employed in the manufacturing process of a substrate for circuit of a flexible printed wiring substrate or the like and is provided with transfer rollers 9, 10 for conveying the substrate material A, a spray nozzle for injecting processing liquid B against the substrate material A, and an interposed member 8 arranged between the transfer rollers 9, 10. In this case, recesses and projections 13, 14, 26 are formed on the outer surfaces of the transfer rollers 9, 10 and the interposed member 8 whereby contacting areas of the transfer rollers 9, 10 and the interposed member 8 with the substrate material A are reduced. Multitude of grooves 15, 16, 27 formed in fore-and-rear conveying direction C are typical as the recesses and projections 13, 14, 26.
Description
Technical field
The present invention relates to the surface processing device of the former material of substrate.That is, relate to use in the manufacturing process of circuit as thin as a wafer with substrate of soft printed circuit board etc., the former material of conveying substrate carries out the surface-treated processing unit to its inject process liquid on one side on one side.
Background technology
High performance, multifunction, miniaturization and along with electronic equipment, the substrate that its circuit is used, also towards high precision int, precise treatment, change as thin as a wafer, variation progress, the circuit of formation also is that densification, the miniaturization with micron unit is very remarkable to for example soft printed circuit board.
For the manufacturing process of this substrate, in each operation, use surface processing device respectively, spray various treatment fluids respectively for the former material of substrate conveying, carry out various soups for the former material of substrate and handle and carrying out washing treatment.
For example, spray the treatment fluid of imaging liquid → corrosive liquid → stripper and cleaning solution etc. successively, therefore, carry out the surface treatment of video picture → corrosion → stripping etc. successively, make the substrate that has formed circuit for the former material of substrate.Again for example, carry out electroless copper → video picture → injection of cathode copper plating → stripper and the injection of the treatment fluids such as injection of cleaning solution successively, carry out surface treatment successively, make the substrate that has formed circuit for the former material of substrate.
Fig. 8 (a) is this end view of example in the past of explanation.This surface processing device 1 for display, corrosion device, stripping off device, wash mill etc., with the former material A of conveying roller 3 conveying substrates of conveyer 2, simultaneously from nozzle 4 inject process liquid B, therefore, the soup of stipulating is handled and carrying out washing treatment, makes the substrate that has formed circuit.
As the conveying roller 3 of conveyer 2, use straight roller with representing, the throughput direction C in front and back when its straight roller disposes up and down has a plurality of configurations, therefore, the former material A contact of folder position substrate rotation, horizontal feed.And nozzle 4 places with the former material A of substrate conveying subtend, from inject process liquid B up and down.
As so surface processing device 1 of the former material A of substrate of example in the past, for example can enumerate in following patent documentation 1 and the patent documentation 2 disclosed.
No. 3479636 communique of (patent documentation 1) Japanese patent of invention
(patent documentation 2) Japanese patent of invention discloses the 2002-009420 communique
Summary of the invention
, there is following problem in the surface processing device 1 of the former material A of substrate of example in the past for such.That is,
A. the former material A of substrate that uses of this kind circuit, as mentioned above, change as thin as a wafer, softnessization significantly.When the former material of particularly soft printed circuit board was changed as thin as a wafer, weak strength and soft was imbued with flexibility.For example, the wall thickness that insulating barrier (core) part also occurs is about 10 μ m, and the wall thickness of circuit (Copper Foil) part is about 10 μ m.
B. the former material A of such substrate easy static electrification under drying regime, and wetting during inject process liquid B, therefore have tack and caking property.
C. the former material A of such substrate is subjected to the injection pressure of treatment fluid B and the influence of weight easily.
D. clamp and contact rotation owing to being transferred roller 3, also acting on plus-pressure.
Therefore, because a, b, c, d constitute, on one side the former material A of such substrate conveying roller 3 horizontal feed of surface processing device 1 Yi Bian during from jet blower 4 inject process liquid B, the trouble D in the various conveyings has taken place, become problem.
That is, the trouble D in the conveying that usually adhere to, reel, involve in, adsorb, stick up tail, wrinkling, crooked, bending, fractures, hangs up, falls down etc. is difficult to stable the conveying, wishes to realize carrying sleekly in a hurry.
For example, the former material A of the substrate that is transferred attach tightly and twisting cohesion at the outer peripheral face of the conveying roller 3 that has just passed through from its leading section, or take place from 3 accidents that fall down of conveying roller.
The surface processing device of the former material of substrate of the present invention, in view of above-mentioned actual conditions, in order to solve above-mentioned problem in the past, the inventor carries out with keen determination result of study and finishes.
For conveying roller and intermediate portion part, it is characterized in that forming the concavo-convex of groove etc. to reduce contact area.And then, for the conveying roller of upside, it is characterized in that making fine groove, or groove do not stagger with overlapping, the prominent shape end of intermediate member is embedded in the groove of conveying roller, and then, on the conveying roller of upside in abutting connection with setting up peeling member etc.
Therefore, the object of the present invention is to provide, can eliminate the trouble in the conveying, realize the former material of substrate in the stable conveying of slyness, the turbulent flow that can suppress the treatment fluid on the former material of substrate again takes place, and keeps the surface processing device of the former material of substrate of processing accuracy.
For solving above-mentioned problem, technological means of the present invention is as described below.
The surface processing device of the former material of substrate of the present invention's the 1st scheme is to use in the manufacturing process of circuit with substrate, and inject process liquid carries out surface treatment on the former material of substrate.It has the conveying roller of carrying the former material of this substrate, spray the nozzle of this treatment fluid on the former material of substrate and be configured in intermediate member between this conveying roller.
And this conveying roller is characterized in that forming at outer surface concavo-convex, diminishes with the contact area of the former material of this substrate.
The surface processing device of the former material of substrate of the present invention's the 2nd scheme is characterized in that in the 1st scheme of the present invention, its outer surface of this intermediate member forms concavo-convex, diminishes with the contact area of the former material of this substrate.
The surface processing device of the substrate of the present invention's the 3rd scheme, it is characterized in that in the 2nd scheme of the present invention, this conveying roller is made of straight roller shape, and when disposing up and down, throughput direction in front and back disposes a plurality of, this conveying roller is clamped the former material of this substrate and is contacted rotation, realizes horizontal feed thus.
This intermediate member is characterized in that introducing on the height a little up and down at the horizontal feed face of this conveying roller and is disposing, with the former material contact guidance of substrate to throughput direction.In addition, the former material subtend of this substrate of this nozzle and conveying is placed, from spraying this treatment fluid up and down.
The surface processing device of the former material of substrate of the present invention's the 4th scheme is characterized in that in the 3rd scheme of the present invention, this conveying roller and this intermediate member form concavo-convex respectively with groove.And, this groove about Width devices spaced apart configuration, and form a plurality of along the throughput direction of front and back.
The surface processing device of the former material of substrate of the present invention's the 5th scheme is characterized in that the groove of this conveying roller of upside is made of narrow fine groove in the 4th scheme of the present invention.The groove of this conveying roller of downside is made of wide wide groove.
The surface processing device of the former material of substrate of the present invention's the 6th scheme is characterized in that in the 4th scheme of the present invention, is configured near this conveying roller of the upside the front and back of this nozzle, and this groove is made of narrow fine groove.Each groove of this conveying roller of upside beyond it and this conveying roller of downside is made of wide wide groove.
The surface processing device of the former material of substrate of the present invention's the 7th scheme, it is characterized in that in the 4th scheme of the present invention, this conveying roller of upside, this groove when Width is with equidistant formation, in the front and back of throughput direction each other with the not coincidence system spacing ground configuration of staggering of this groove
The surface processing device of the former material of substrate of the present invention's the 8th scheme is characterized in that in the 4th scheme of the present invention, and this intermediate member has a plurality of extended prominent shapes end towards throughput direction.And this prominent shape end is embedded into this groove of this corresponding conveying roller from front and back interlock ground, and sliding contact.
The surface processing device of the former material of substrate of the present invention's the 9th scheme is characterized in that in the 4th scheme of the present invention, and above-mentioned this conveying roller is in abutting connection with setting up a plurality of peeling members.
And this peeling member is positioned at the downstream of this conveying roller, and ground axle suspension can be shaken simultaneously by the throughput direction of front and back in the upper end, and the bottom is embedded into this groove of this conveying roller from upside interlock ground, and sliding contact.
The surface processing device of the former material of substrate of the present invention's the 10th scheme is characterized in that in the scheme of the present invention the 5th, 6,7,8 or 9, in the manufacturing process of soft printed circuit board, uses in soup treatment process and washing procedure.And, the former material of this substrate as thin as a wafer and weak strength, softness be imbued with pliability.This nozzle ejection is as imaging liquid, corrosive liquid, stripper or the cleaning solution of this treatment fluid.
The effect of the surface processing device of the former material of substrate of the present invention is described below.
(1) this surface processing device be at soft printed circuit board, other circuit with in the manufacturing process of substrate, be used in soup treatment process and washing procedure, its device has conveying roller, nozzle and intermediate member etc.
(2) the former material of conveying roller chucking substrate contacts rotation, carries out horizontal feed thus.Nozzle is from spraying the treatment fluid of imaging liquid, corrosive liquid, stripper, cleaning solution etc. up and down to the former material of substrate.Intermediate member is configured in respectively between conveying roller, the former material of contact guidance substrate.
(3) at this, conveying substrate former edge in surface processing device limit carries out surface treatment to its inject process liquid.Treatment fluid along about Width flow through behind the outer surface of the former material of substrate from runs down both sides.
(4) still, a. circuit is with substrate former material, change as thin as a wafer, softnessization significantly, weak strength, softness.And the such former material of substrate of b. is wetting in static or treatment fluid, have tack and caking property, and then c. is subjected to the injection pressure of treatment fluid and the influence of weight easily, and d. is clipped in and also is subjected to the plus-pressure effect on the conveying roller.
(5) so, for this surface processing device,, between conveying roller in the configuration intermediate member, on the outer surface of conveying roller and intermediate member, form the concavo-convex of groove etc. along throughput direction as its countermeasure 1, tail off with the contact area of the former material of substrate.
Therefore, although under the condition of a, b, c, d, the former material of substrate can not attach yet, adhere to, be wound on conveying roller and the intermediate member, and then, also can not fall down, the trouble that can prevent to involve in, adsorb, stick up tail, wrinkling, crooked, bending, fractures, hangs up etc. can stably be carried.
In addition, the configuration of intermediate member and then bring into play following advantage.That is, treatment fluid rests between up and down intermediate member, particularly forms liquid reservoir on the intermediate member of downside, carries as thin as a wafer and the soft former material of substrate in the liquid of the liquid reservoir of such treatment fluid.Therefore,, make the former material of substrate lose tack and close-burning while,,, can realize stable conveying from these aspects even carrying capacity a little also can be carried out certain conveying by in the liquid reservoir of such treatment fluid, carrying.
(6) and then, as countermeasure 2,, on intermediate member, set up concavo-convex processus pectinealis shape end for this surface processing device, in the groove of the conveying roller of correspondence, embed, sliding contact from front and back interlock ground.Therefore, also can prevent the generation of trouble, really the former material of conveying substrate stably from this respect.
(7) and then, as countermeasure 3, in the downstream of the conveying roller of upside in abutting connection with setting up the concavo-convex pectination peeling member that can rock back and forth, from upside interlock ground is embedded into the groove of conveying roller, sliding contact.The former material of the substrate of therefore, also can attach, adhere to, reeling is peeled off.Also can prevent the generation of trouble from this respect, stably realize ideally carrying.
(8) still, for this surface processing device, as mentioned above, the throughput direction in front and back forms a plurality of grooves.Therefore, for this surface processing device, be that the groove that is configured near the conveying roller of the upside the front and back of the conveying roller of upside or nozzle is to be made of the narrow fine groove of width as countermeasure 1 to it.As countermeasure 2, above-mentioned conveying roller, at its groove not overlappingly in the throughput direction configuration of staggering.
That is, the treatment fluid that has sprayed, as mentioned above, the Width that is predefined in about the outer surface of the former material of substrate flows, and to form a large amount of turbulent flows along the throughput direction of groove in front and back be unfavorable.Therefore, by adopting the few fine groove of flow, the groove that staggers, Min. ground suppress turbulent flow to be taken place.
(9) in contrast, be ejected into the treatment fluid of the outer surface of the former material of substrate from downside and since after the surface treatment immediately gravity fall down, take place so needn't worry turbulent flow.Therefore, the conveying roller of downside adopts wide groove as groove, in addition, also need not stagger in nonoverlapping mode.
The surface processing device of the former material of substrate that the present invention relates to as mentioned above, is characterized in that for conveying roller and intermediate member, the concavo-convex minimizing contact area of formation groove etc.And then, for each conveying roller of upside, it is characterized in that making fine groove or groove do not staggered overlappingly and the prominent shape end of intermediate member is embedded in the groove of conveying roller, so at the conveying roller of upside in abutting connection with setting up peeling member etc.
Therefore, the following effect of the surface processing device of substrate of the present invention performance.
The 1st, eliminate the trouble on carrying, can realize the slick and sly stable conveying of the former material of substrate.Promptly, the surface processing device of the former material of substrate of the present invention, the intermediate member of the former material of configuration contact guidance substrate between the conveying roller of the former material of contact conveying substrate, simultaneously, form the concavo-convex of groove etc. at the outer surface of conveying roller and intermediate member, reduce contact area with the former material of substrate.
And then on intermediate member, set up prominent shape end, be embedded into the groove of corresponding conveying roller from front and back, with its sliding contact or on the conveying roller of upside in abutting connection with setting up peeling member, be embedded in the groove of conveying roller, with its sliding contact.
Thus, can realize the stable conveying of the former material of substrate.That is, be that a. changes as thin as a wafer, softnessization remarkable at the former material of substrate, b. has tack and caking property in static or treatment fluid, and then, c. also be subjected to the injection pressure of treatment fluid and the influence of weight, d. also is subjected under the condition of conveying roller plus-pressure effect easily, also can not have troublesomely and carries.
Can eliminate adhering to, reel, involve in, adsorb, stick up tail, wrinkling, crooked, bending, fractureing, hang up of the former material of substrate really, and then the trouble that falls down etc.
In addition, the configuration of intermediate member and then the following effect of performance.That is, treatment fluid rests between up and down intermediate member, particularly forms liquid reservoir on the intermediate member of downside, in the liquid of the liquid reservoir of the treatment fluid that forms like this, carries as thin as a wafer and soft tack and the former material of close-burning substrate of having.
And, carry by liquid at such liquid reservoir, make the former material of substrate lose tack and close-burning while, even carrying capacity a little also can be carried out certain conveying,, can realize stable conveying from these aspects.
The 2nd, the turbulent flow that suppresses the treatment fluid on the former material of substrate takes place, and keeps processing accuracy.
That is, the surface processing device of the former material of substrate of the present invention adopts the groove along throughput direction, but for each conveying roller of upside, groove is made fine groove, staggers at the throughput direction groove.
Thus, be injected in treatment fluid on the former material of substrate and flow before and after the groove and become Min., suppress the generation of turbulent flow.Thus, can prevent that reason owing to turbulent flow from the processing spot of decorative pattern in length and breadth etc. taking place, and can guarantee that soup is handled and the accuracy of carrying out washing treatment on substrate.
Like this, this routine in the past existing problem can both be resolved, and the effect that the present invention brought into play is extremely significant.
Description of drawings
Fig. 1 is end view surface processing device, that be used to illustrate the best mode that carries out an invention of the former material of substrate of the present invention.
Fig. 2 (a)～Fig. 2 (c) is used to the best mode of implementing this invention is described that wherein, Fig. 2 (a) is an end view of wanting portion; Fig. 2 (b) is the enlarged drawing of conveying roller etc. of the upside of Fig. 2 (a); Fig. 2 (c) is the enlarged drawing of conveying roller etc. of the downside of Fig. 2 (a).
Fig. 3 (a) and Fig. 3 (b) are used to illustrate the best mode of implementing this invention, and wherein Fig. 3 (a) is the vertical view of wanting portion of the conveying roller etc. of upside; Fig. 3 (b) is the vertical view of wanting portion of conveying roller of downside etc.
Fig. 4 (a) and Fig. 4 (b) are used to illustrate the best mode of implementing this invention, wherein the front view of wanting portion of Fig. 4 (a) expression conveying roller up and down; The front view of wanting portion of the another one example of Fig. 4 (b) expression conveying roller up and down.
Fig. 5 (a)～Fig. 5 (c) is the mode that the best of this invention is implemented in explanation, and wherein Fig. 5 (a) is the vertical view of each conveying roller of expression upside; Fig. 5 (b) is the front view of wanting portion that is used to illustrate peeling member; Fig. 5 (c) is the end view of wanting portion that is used to illustrate this peeling member.
Fig. 6 is the end view of the integral body of surface processing device.
Fig. 7 is the front view of the integral body of surface processing device.
Fig. 8 (a) be in the past the example end view, Fig. 8 (b) be substrate (the former material of substrate) medelling vertical view.
Embodiment
Below, shown with reference to the accompanying drawings enforcement best mode of the present invention explains the surface processing device of substrate material of the present invention.Fig. 1, Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b), Fig. 4 (a) and Fig. 4 (b), Fig. 5 (a)～Fig. 5 (c) etc. are the figure that is used to illustrate best mode of the present invention.
Fig. 1 is the vertical view of wanting portion of the enlarged drawing of the enlarged drawing of conveying roller of the upside that end view, Fig. 2 (a) are the end views of wanting portion, Fig. 2 (b) is Fig. 2 (a) etc., conveying roller of downside that Fig. 2 (c) is Fig. 2 (a) etc., conveying roller that Fig. 3 (a) is upside etc., and Fig. 3 (b) is the vertical view of wanting portion of conveying roller of downside etc.
Fig. 4 (a) is the front view of wanting portion that lower roller is gone up in expression, and Fig. 4 (b) is the front view of wanting portion that other examples of lower roller are gone up in expression.Fig. 5 (a) is the vertical view of each conveying roller of expression upside, and Fig. 5 (b) is the front view of wanting portion that is used to illustrate peeling member.Fig. 5 (c) is the end view of wanting portion that is used to illustrate this peeling member.
Fig. 6 is all end views of surface processing device.Fig. 7 is all front views of surface processing device.Fig. 8 (b) be substrate (the former material of substrate) medelling vertical view.
The surface processing device 5 of the former material A of this substrate uses in the manufacturing process of the substrate F that circuit E uses.At this, at first, substrate F is described roughly with reference to Fig. 8 (b).
The substrate F that circuit E uses as being electrically connected with being widely used, is formed for being connected the circuit E figure between each parts in the outer surface of insulating barrier and inside in AV instrument, personal computer, mobile phone, digital camera and other various electronic equipments.
And the substrate F that uses as such circuit E has various substrates such as single face substrate, two sides substrate, multilager base plate (comprising nearest construction from part), can be divided into category of rigid and the membranaceous soft class of hard.
Ring as such substrate F, the semiconductor device that has IC, LSI element, effector spare, driver part, a capacitor etc. is assembled into module substrate (the plug-in unit substrate that semiconductor is one-piece type) with circuit E or imbeds the glass substrate of semiconductor device with circuit E on glass basis, and promptly plasma shows glass substrate or CSP, the PBGA etc. that glass substrate that PDP uses or liquid crystal LCD use.Certainly, said substrate F in this specification except comprising printed circuit board in the past, also extensively comprises above-mentioned.
The substrate F that such circuit E uses, be accompanied by high performance, multifunction, the miniaturization and of electronic equipment, towards high precision int, miniaturization, change as thin as a wafer, softnessization, and then aspect development such as multiple stratification, variation, outer surface (promptly, the surface and below, a side or the both sides of the inside) form circuit E, and then densification, the miniaturization of the circuit E that forms in inside also are very remarkable.
Substrate F, for example the length and width cut lengths of printed circuit board for example are about 500mm * 500mm.Wall thickness, insulating barrier (core) part changes into about 1.0mm～60 μ m as thin as a wafer from 1.6mm in the past, recently, changes into as thin as a wafer about 10 μ m from 50 μ m.
The wall thickness of circuit E part (Copper Foil part) is also changed as thin as a wafer at 75 μ m～35 μ m, and recently, the utmost point is thinned to about 16 μ m～10 μ m.Even during multilager base plate, total wall thickness is also changed about 1.0mm～0.4mm as thin as a wafer.Interval between circuit E width and circuit E is also fine to change into about 30 μ m～15 μ m, recently, the tendency of miniaturization to about the 10 μ m is arranged.
Below, for the manufacture method of the substrate F of the surface processing device 5 that uses the former material A of this substrate, with reference to Fig. 8 (b), and then Fig. 6, Fig. 7 etc. describe.
The manufacture method of the 1st example at first, is described.In the manufacture method of the 1st example, substrate F, for example printed circuit board is made according to following steps.
At first, the outer surface of the insulating barrier (core) of the resins in film form system of, ceramic fabric at glass or polyimides etc. has attached Copper Foil by hot pressing etc., obtains the former material A of substrate of copper-clad laminate.
Then, for such substrate former material A that has prepared, the copper foil surface that has attached is carried out after surface coarsening handles (soft etch), cut into the workpiece of minor face.Surface coarsening is handled, undertaken by mechanical lapping in the past, but undertaken by the injection of treatment fluid B mostly recently.
And occasion is to use the hole processing of the usefulness of boring a hole such as laser mostly.Perforation is to be made of the fine through hole between two outer surfaces of the former material A of substrate (substrate F), for 1, forms the hole of hundreds of above very small diameter mostly, and its diameter is 0.5mm～0.2mm mostly.Perforation be used between the circuit E of two outer surfaces (Copper Foil) or the circuit E (Copper Foil) of multilager base plate between interlayer conduction connect or be contained in the installation usefulness of the semiconductor device of circuit E.
Recently, to need to replace the perforation of hole processing, also developing and is forming small embossment shape, the salient point of the contact of circular cone shape slightly,, can realize and the technology of the identical functions of boring a hole by salient point for multilager base plate etc.In addition, salient point is according to circuit E, in video picture operation, corrosion process, stripping process manufacturing.
Then, the photonasty resist is applied membranaceously or pastes outer surface at the Copper Foil of the former material A of substrate (above, the surface and below, a side or the both sides of the inside) on.Then, the circuit E photo that is designed to circuit E in advance as the negative film of circuit E is exposed, thus, residual being exposed of photonasty resist of outer surface and the circuit E that solidifies forms part, other unwanted parts are removed by the injection dissolving of the imaging liquid of treatment fluid B.
Then, the circuit E that the Copper Foil of the former material A of such substrate is covered the sclerosis of photonasty resist forms part and left behind, dissolve by video picture and to remove the unwanted part that the photonasty resist exposes, the injection of the corrosive liquid (copper chloride, iron chloride, other corrosive liquid) by treatment fluid B is dissolved and is removed and erode.
Then, remaining circuit E forms the photonasty resist of part, the injection of the stripper by treatment fluid B is peeled off and is removed, and the Copper Foil that forms part with remaining circuit E forms the circuit E that stipulates conductor fig on the outer surface of the former material A of substrate, make substrate F thus.
In addition, in above-mentioned video picture operation, corrosion process, stripping operation, during the reprocessing that compiles after each reprocessing usefulness or stripping operation is used, set up injection as the water lotion of treatment fluid B, nertralizer liquid, other the washing procedure of cleaning solution, therefore, the treatment fluid B of imaging liquid attached to the outer surface of the former material A of substrate, corrosive liquid, stripper etc. is removed in washing.
The manufacture method of the 1st example is made of so wet Process.The manufacture method of the 1st example comes to this.
Below, the manufacture method of the 2nd example is described.As the substrate F manufacture method of printed circuit board for example, the wet Process of above-mentioned the 1st example is a typical example, but the semi-additive process of the 2nd example is also often used.
For this semi-additive process, at first, on the outer surface of the former material A of the substrate that is pre-formed perforation, carry out electroless copper.→ then, the photonasty resist applied membranaceously or pastes back on this electroless copper → circuit E photo as circuit E film is exposed.→ photonasty resist exposure then, remaining exposure and the part of having solidified, other parts just circuit E form part and remove by spraying as the imaging liquid dissolving of treatment fluid B.
Then, → form part for circuit E, promptly remove the visuals of the coating of photonasty resist by the video picture dissolving, promptly the part exposed of electroless copper is carried out electrolytic copper plating → formation circuit E.→ in addition, by spray as the stripper of treatment fluid B peel off remove remaining curing circuit E form photonasty resist beyond the part, → electroless plating the copper that exposes is removed by spraying as the corrosive liquid of treatment fluid B quick burn into fusion.→ in addition,, set up washing procedure according to above-mentioned position as the reprocessing usefulness of each operation, with cleaning solution as treatment fluid B.
For the semi-additive process of the 2nd example, form circuit E with electrolytic copper plating, make substrate F.The manufacture method of the 2nd example comes to this.
, the manufacture method of the substrate F that other circuit E of printed wiring base stage uses is more and more diversified recently, ins all sorts of ways even also developing to make beyond the 1st above-mentioned example, the 2nd example.Certainly, the present invention also is applicable to the manufacture method of so various substrate F.
Below, explain the surface processing device 5 of the former material A of substrate of the present invention with reference to Fig. 1, Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b), Fig. 4 (a) and Fig. 4 (b), Fig. 5 (a)～Fig. 5 (c), Fig. 6, Fig. 7 etc.
At above-mentioned surface processing device 5, be in the manufacturing process of above-mentioned substrate F, to use, for the former material A of substrate conveying inject process liquid B, former material A carries out surface treatment with substrate.
Promptly, surface processing device 5, each operation in the manufacture method of substrate F, in for example video picture operation, corrosion process or stripping operation or the washing procedure etc., use as display, corrosion device or stripping off device or wash mill, for the former material A of substrate conveying, spray the treatment fluid B of imaging liquid, corrosive liquid, stripper or cleaning solution etc. respectively, carry out the surface treatment of the soup processing, carrying out washing treatment etc. of the former material A of substrate.
And any one all is jointly for such each surface processing device 5, has conveyer 7, nozzle 4, intermediate member 8 etc. in process chamber 6.That is, have the former material A of horizontal feed substrate conveyer 7 and, the nozzle 4 of inject process liquid B on the former material A of substrate conveying and, the intermediate member 8 of configuration respectively between the conveying roller 9,10 up and down at conveyer 7.
And this surface processing device 5 particularly in the manufacturing process of the substrate F as thin as a wafer such as printed circuit board of softness, uses in soup treatment process and washing procedure, the former material A of this substrate as thin as a wafer and intensity low and soft, be imbued with pliability.
Below with reference to Fig. 1, Fig. 2 (a)～Fig. 2 (c), Fig. 6, Fig. 7 etc. the conveyer 7 of this surface processing device 5 is described.
This conveyer 7 is configured in the process chamber 6, has the conveying roller 9,10 that is made of straight roller, conveying roller 9,10, and about being configured in, and, on the throughput direction C of front and back, disposing a plurality ofly, clip the former material A of substrate and contact rotation and carry out horizontal feed thus.
For such conveyer 7 explanation in further detail.Conveyer 7 have level upside 9 groups of conveying rollers and, 10 groups of the conveying rollers of the downside of same level, two conveying rollers 9,10 up and down all are that the straight roller by elongated cylindrical constitutes.And, towards the Width of the left and right sides time,, keep the interval H of some front and back disposing many (before and after in Fig. 6, having omitted H) at interval respectively on roll shaft 11,12 along the throughput direction of front and back.
And, conveying roller 9,10 up and down, 4 treatment fluid B staggered relatively spray the wide clearance space J of usefulness except more upper or the next and nozzle, and the former material A of substrate that clamps object conveyor is disposing up and down in couples.In addition, in the way of 10 groups of the conveying rollers of 9 groups of the conveying rollers of upside and downside, when forming clearance space J off and on respectively, staggering up and down at throughput direction C forms the position.
Conveying roller 9,10 from the former material A of the substrate that is crimped on object conveyor up and down, rotates the conveying roller 10 of downside respectively at least, make the former material A of substrate in process chamber 6 along throughput direction C from the upstream side horizontal feed to the downstream.
Concavo-convex 13,14 for the conveying roller 9,10 of this surface processing device 5 describes with reference to Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b), Fig. 4 (a) and Fig. 4 (b) etc.
Conveying roller 9,10 up and down forms concavo-convex 13,14 simultaneously at outer surface, therefore the contact area with the former material A of substrate reduces.These are concavo-convex 13,14, for example be to form with groove 15,16, this groove 15,16 about Width G on devices spaced apart, form a plurality of along the throughput direction C of front and back.
For so concavo-convex 13,14, explanation in further detail.At first, concavo-convex 13,14 as the outer surface of conveying roller 9,10, groove 15,16th, representational, still, this external application additive method makes contact area with the former material A of substrate than comprehensive engagement, and the various means of minimizing, shape also are possible.For example, also may form a plurality of holes, carry out the asperities processing of annular knurl processing etc.
The groove 15,16 of typical example for per 1 conveying roller 9 or 10, is formed with a plurality ofly on its outer surface, and these grooves separate uniformly-spaced distance on Width G, and forms towards the throughput direction of front and back.That is, alternately form the convex portion at the interval of 15,16 of the concave portion of groove 15,16 and grooves at Width G at the outer peripheral face of conveying roller 9,10.
Only be that convex portion contacts conveying with the former material A of the substrate of object conveyor, so the amount of the concave portion of groove 15,16, with the contact area minimizing of the former material A of substrate.
In legend, shown in the front view of the vertical view of Fig. 3 (a) and Fig. 4 (a), Fig. 4 (b), the groove 15 of the conveying roller 9 of upside is made of narrow fine groove, shown in the front view of the vertical view of Fig. 3 (b) and Fig. 4 (a), Fig. 4 (b), the groove 16 of the conveying roller 10 of downside is made of wide wide groove.
In addition, the groove 15 that is configured near the conveying roller 9 of the upside the front and back of nozzle 4 is made of narrow fine groove, and the groove 15,16 of each of the conveying roller 9 of remaining upside and conveying roller 10 is made of wide wide groove.
That is, the groove 16 as the conveying roller 10 of downside all adopts the big wide groove of width dimensions at left and right sides Width G.In contrast, for the conveying roller 9 of upside, at least near the front and back of nozzle 4, be the groove 15 of process chamber 6 central portions, all adopt the little narrow groove of width dimensions at left and right sides Width G, but as near near the groove 15 with outlet process chamber 6 inlets, may not be narrow groove, wide groove be also passable.
In addition, be not limited thereto, the groove 16 for the conveying roller 10 of the groove 15 of the conveying roller 9 of upside and downside can adopt same widths, also can all adopt narrow groove or wide groove.At this moment, the advantage that has cost to reduce.
In addition, shown in the vertical view of Fig. 5 (a), in legend, in the groove 15 of Width G, the throughput direction C of spacing in front and back of groove 15 staggered each other with the conveying roller 9 of equidistant formation upside.
That is, for 9 groups of the conveying rollers of upside, with the groove 15 of equidistant formation, be not to overlap point-blank at throughput direction C each other respectively at each conveying roller 9, about Width G stagger a little and disposing.
In addition, for 10 groups of the conveying rollers of downside, also according to 9 groups of the conveying rollers of upside in the same manner respectively with the groove 15 of equidistant formation, be not to overlap point-blank at throughput direction C each other at each conveying roller 10, about Width G stagger a little and disposing.The advantage of this moment, identical with 9 groups of the conveying rollers of upside, be described in the back.
Below, describe for the formation method of the groove 15,16 of the conveying roller 9,10 of this surface processing device 5.
At first, for the example shown in Fig. 3 (a), Fig. 3 (b) and Fig. 4 (a), for roll shaft 11,12, outer chimeric, the fixing quarter in advance established the conveying roller 9,10 that forms groove 15,16.That is, in the axis hole of the conveying roller 9,10 of with groove 15,16, intercalation respectively, fixed axis 11,12.
In contrast, for the example shown in Fig. 4 (b),, use a plurality of roller members 17 of short cylinder and the axle collar 18 that groove 15 forms usefulness at interval for the conveying roller 9 of upside.And for roll shaft 11,12, by replacing the roller member 17 and the axle collar 18 in outer chimeric tape spool hole successively, the aggregate of available roller member 17 forms conveying roller 9, and the axle collar 18 parts become groove 15.
That is,, form the conveying roller 9 of with groove 15 by roll shaft 11 is replaced intercalation on each roller member and the axle collar 18 in tape spool hole.
In addition, when this Fig. 4 (b), also can be fixed on 17 of roll shaft 11 and roller members, but also be rotatably mounted, if the latter, 9 of the conveying rollers of upside become free roller.
In addition, the conveying roller 10 of downside also can utilize the such roller member 17 and the axle collar 18 to form, but the conveying roller 10 of downside is a driven roller, so make fixing stationary roll between roll shaft 12 and roller member 17 etc.
In contrast, when the conveying roller 9 of upside was made free roller, the installation accuracy with conveying roller 9 of upside had the advantage of surplus.That is, when the conveying roller 9 of upside is made driven voller, free roller, relatively, for the position relation of the conveying roller 10 of the stationary roll of downside etc., do not require tightly when making stationary roll, have the low advantage of cost with conveying roller 9 with upside.
Below, for the peeling member 19 of this surface processing device 5, describe with reference to Fig. 5 (b), Fig. 5 (c).
For the surface processing device 5 that is illustrated in these accompanying drawings, adjacency is set up a plurality of peeling members 19 on the conveying roller 9 of upside.Peeling member 19 is positioned at the downstream of conveying roller 9, and its upper end can be shaken ground axle suspension and on the throughput direction C of front and back, and its bottom embeds the groove 15 of conveying roller 9 from upside interlock ground, with this groove sliding contact.
For such peeling member 19, explanation in further detail.Near the front and back of each conveying rollers 9 of 9 groups of the conveying rollers of all upsides or nozzle 4, promptly on each conveying roller 9 of process chamber 6 central authorities respectively in abutting connection with setting up peeling member 19.
Peeling member 19 is positioned at the throughput direction C downstream of the conveying roller 9 of relative direction, become roughly vertical carefully bar-shaped, about Width G on be set side by side with a plurality of.On the axle 21 of Width G about each upper end of each peeling member 19 is bearing in by 20 on carriage, can rock back and forth at throughput direction C.
The bottom of each peeling member 19 is embedded in the groove 15 of the conveying roller 9 of upper/lower positions correspondence from upside, and with its sliding contact, therefore, at conveying roller 9, promptly interlock near the top, downstream of groove 15.Then, the bottom of each peeling member 19, along about Width G and groove 15 same widths and spacing be set up in parallel.
In illustrated example, for H at interval, omit the diagram of intermediate member 8 in abutting connection with the front and back of the conveying roller 9 of the peeling member 19 of setting up upside, but the example of configuration intermediate member 8, do not dispose intermediate member 8 example all possible.That is, for the conveying roller 9 of upside, peeling member 19 also can use simultaneously with the intermediate member 8 of identical function, in addition, also can not use intermediate member 8 and use separately.
Following nozzle 4 with reference to this surface processing devices 5 of explanation such as Fig. 1, Fig. 6, Fig. 7.
For such nozzle 4 and then explain.Nozzle 4, with the conveying roller 9,10 of conveyer 7 with the former material A of flat-hand position substrate conveying directly over or under on, configuration with interval up and down is towards the clearance space J that is configured in above-mentioned conveying roller 9,10.
Therefore, treatment fluid B is sent to each nozzle 4 by pump 23 and pipe arrangement 24 from liquid bath 22, is injected on the former material A of substrate.Then, along the outer surface of the former material A of substrate towards left to or right flow carry out surface treatment after, flow down from the left and right sides of the former material A of substrate, return in the liquid groove 22, recycle then.
Below, with reference to the intermediate member 8 of these surface processing devices 5 of explanation such as Fig. 1, Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b).
For such intermediate member 8, and then explain.Intermediate member 8 made put tabular or deposited tabularly or comb bar-shapedly, the front and back that removably are configured in 9 of each conveying rollers respectively are the front and back of 10 of H and each conveying rollers at interval on the H at interval.And then between the clearance space J of 10 of conveying rollers and between the clearance space J of 10 of conveying rollers, the jet space in that central authorities leave treatment fluid B is configured in before and after it.
And, intermediate member 8 along about the Width G long plate shape of do growing up or long bar-shaped, from the conveyor surface of the former material A of substrate, for example the position relation of leaving up and down with the wall thickness degree of the former material A of substrate is being configured up and down.
That is, the following ratio of the intermediate member 8 of upside is configured in equally that high a little position is configured below the periphery of conveying roller 9 of upside, therefore from top contact, maintenance, the former material A of guiding substrate conveying surface.With respect to this, low a little position was configured above the top ratio of the intermediate member 8 of downside was configured in the periphery of conveying roller 10 of upside equally, therefore from following contact, maintenance, the former material A of guiding substrate conveying the inside.
In addition, the location hold mode in process chamber 6 of such intermediate member 8 can have various.For illustrative example, can adopt up and down holding member 25 longitudinally, but also can about laterally keep, when adopting the latter, because each intermediate member 8 is connected and fixed all whole roughly pectinations that become with the ora terminalis of horizontal stroke.
Below, with reference to concavo-convex 26 of the intermediate member 8 of this surface processing device 5 of explanation such as Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b).
And then describe so concavo-convex 26 in detail.Concavo-convex 26 for groove 27 grades of the outer surface that is formed on this intermediate member 8 is to form according to concavo-convex 13,14 of above-mentioned said groove 15,16 grades as conveying roller 9,10 basically.At this its main points only are described.
Below the intermediate member 8 of upside and formation concavo-convex 26 above the intermediate member 8 of downside, this concavo-convex feasible contact area with the former material A of substrate reduces than comprehensive engagement, the groove 27 of concavo-convex 26 typical example be about Width G on separate uniformly-spaced, and throughput direction C towards front and back forms point-blank.Therefore, owing to the protuberance that only is 27 of grooves contacts with the former material A of substrate, so the groove 27 part amounts of concave portion are the contacts area of minimizing and the former material A of substrate.
In addition, according to the occasion of above-mentioned conveying roller 9,10, as the groove 27 of the intermediate member 8 of upside, can adopt narrow fine groove, groove 27 as the intermediate member 8 of downside can adopt wide groove, but is not limited thereto, for intermediate member 8 up and down, also can adopt the groove 27 of same widths, also can adopt narrow groove or wide groove simultaneously, and then, also can partly separately use wide groove and narrow groove.
Below, the prominent shape end 28 of the intermediate member 8 of this surface processing device 5 is described with reference to Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b).
For so prominent shape end 28, and then explain.Near below the intermediate member 8 of upside end, front and back and near the intermediate member of downside 8 top ends, front and back respectively along throughput direction C, protrude thin bar-shaped or shaft-like a plurality of prominent shape end 28 before and after becoming.
That is, when the plane is seen, each prominent shape end 28 along about Width G, be set up in parallel with groove 15,16 same widths and spacing.The prominent shape end 28 of the intermediate member 8 of upside, groove 15 same widths with the conveying roller 9 of upside are set up in parallel into concavo-convex with spacing, the prominent shape end 28 of the intermediate member 8 of downside, concavo-convex with the plane that groove 16 same widths and the spacing row of the conveying roller 10 of downside are set as amplitude broad.
Each prominent shape end 28, such front and back, for the groove 15,16 of the conveying roller 9,10 of front and back adjacency, along throughput direction C embed, sliding contact, therefore, sting and containing conveying roller 9,10 grooves 15,16, the i.e. top (top and bottom) of groove 15,16.
In addition, the intermediate member 8 for interval, the front and back H that is configured in conveying roller 9,10 is forming so prominent shape end 28 in front and back.With respect to this, in abutting connection with being configured in the intermediate member 8 of the clearance space J of conveying roller 9,10, a side of end, front and back does not form prominent shape end 28, even perhaps formation becomes free state also not to groove 15,16 embeddings, sliding contact, interlock.For the intermediate member 8 of the conveying roller 9,10 of the entrance and exit side of process chamber 6 also with above-mentioned same.
The surface processing device 5 of the former material A of substrate of the present invention constitutes as described abovely, and it thes contents are as follows.
(1) surface processing device 5 of the former material A of this substrate at soft printed circuit board, other circuit E with in the manufacturing process of substrate F, in the surface treatment procedure of various soup treatment process and washing procedure etc., use as display, corrosion device, stripping off device or wash mill.
And, in process chamber 6, have conveying roller 9,10, nozzle 4, intermediate member 8 etc.
(2) conveying roller 9,10 is made up of straight roller, is that the throughput direction C in front and back disposes a plurality ofly when disposing up and down, and the former material A of chucking substrate contacts rotation, carries out horizontal feed thus.
(3) therefore, surface processing device 5, at the former material A of substrate conveying inject process liquid B, former material A carries out surface treatment to substrate.(with reference to Fig. 1, Fig. 6, Fig. 7).
That is, the former material A of substrate is by at the conveying roller 9,10 of contact rotation up and down and the intermediate member 8 of contact guidance up and down, on throughput direction C by horizontal feed.Meanwhile, from the treatment fluid B that nozzle 4 sprays, the Width G about the outer surface upper edge of the former material A of substrate flows, and carries out surface treatment.Then, treatment fluid B flows down, reclaims from the left and right sides of the former material A of substrate.
(4), the former material A of substrate that the soft printed circuit board of a., other circuit E use changes as thin as a wafer, the progress of softnessization is remarkable, as thin as a wafer and weak strength, softness are imbued with pliability.The polyimide resin particularly soft of the core of soft printed circuit board and crooked easily.
B. the former material A of substrate of softness so as thin as a wafer easy static electrification under drying regime is wetted during inject process liquid B, therefore has tack, caking property.
C. the former material A of substrate of softness so as thin as a wafer is subjected to the expulsion pressure of treatment fluid B and the influence of the weight of the treatment fluid B that sprays from upside etc., because of pressure and weight crooked easily.
D. owing to being clamped by conveying roller 9,10 up and down and contacting conveying, crooked easily so also be subjected to the plus-pressure effect.
(5) therefore, in this surface processing device 5,, adopt countermeasure 1, countermeasure 2, countermeasure 3 in view of these a, b, c, d.
At first, as the most basic countermeasure 1, in this surface processing device 5, at conveying roller 9, the intermediate member 8 of 10 configuration guiding usefulness, simultaneously, at conveying roller 9,10 and the outer surface of joining parts 8 form concavo-convexly 13,14, therefore, reduce with the contact area of the former material A of substrate conveying.Concavo-convex 13,14 form with groove 15,16 with representing, about Width G devices spaced apart ground and form a plurality of grooves 15,16 (with reference to Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b), Fig. 4 (a) and Fig. 4 (b)) along the throughput direction C of front and back.
The existence of the intermediate member 8 of contact guidance and, show to cut down attach and the minimizing of the contact area of bonding object becomes main points of the present invention, although under the condition of above-mentioned a, b, c, d, the former material A of substrate is for conveying roller 9,10 and then intermediate member 8, can not attach fully or curl, do not fall down yet, stably carry as requested from 9,10 of conveying rollers.
That is, though a. be imbued with flexibility as thin as a wafer, have tack, the former material A of close-burning substrate, be not subject to processing the influence and the stressed effect of injection pressure and the weight of liquid B, can stably carry.At this moment, the intermediate member 8 of downside has the function that prevents the effect of falling down especially, contact area have especially less prevent to attach, adhere to, function that twisting cohesion is used.
Like this, by adopting countermeasure 1, when using this surface processing device 5, can prevent in advance that the former material A of substrate from adhering to, twisting cohesion, involve in, adsorb, stick up various troubles (with reference to Fig. 8 (a)) such as tail, wrinkle, bending, warpage, intensity reduce, hang up and then fall down, stably carry.
In addition, the configuration of intermediate member 8 and then the following advantage of performance.That is, be injected in the treatment fluid B of the former material A of substrate from nozzle 4, former material A is transferred with substrate, attached to 8 stops of intermediate member up and down, forms storage liquid.Particularly rest on the intermediate member 8 of downside, form storage liquid.
Conveying is imbued with flexibility as thin as a wafer and has tack, the former material A of close-burning substrate in the storage liquid of the treatment fluid B that is formed on 8 of intermediate members like this, but by conveying at such storage liquid, carrying capacity a little make the former material A of substrate lose tack, close-burning while, even also can be finished conveying really.Therefore, from these aspects, also can realize the stable conveying of the former material A of substrate.
(6) and then, in addition as countermeasure 2, in this surface processing device 5, on intermediate member 8, set up a plurality of prominent shapes end 28, is extending individually towards throughput direction C this prominent shape end 28.And this prominent shape end 28 for the groove 15,16 of the conveying roller 9,10 of correspondence, embeds from front and back interlock ground, sliding contact (with reference to Fig. 2 (a)～Fig. 2 (c), Fig. 3 (a) and Fig. 3 (b)).
Therefore, the former material A of substrate from this respect, can prevent that also above-mentioned various trouble from taking place, more stable the conveying.
Promptly, for surface processing device 5, because this countermeasure 2, the prominent shape end 28 of the concavo-convex pectination of formation intermediate member 8 is for conveying roller 9,10 groove 15,16, stop up interlock with gap before and after the plane, thus the former material A of substrate to the attaching of conveying roller 9,10, adhere to, twisting cohesion and from conveying roller 9,10 are fallen down etc., just can stop by prominent shape end 28 before taking place.
(7) and then, as countermeasure 3, in such surface processing device 5, can consider on the conveying roller 9 of upside in abutting connection with setting up a plurality of peeling members 19.This peeling member 19, be positioned at the downstream of conveying roller 9, when its upper end can joltily be supported by axle on the throughput direction of front and back, its bottom was for the groove 15 of conveying roller 9, from the embedding of upside interlock ground, sliding contact (with reference to Fig. 5 (b), Fig. 5 (c)).
The former material A of substrate from this aspect, can prevent the generation of above-mentioned various trouble D, is transferred ideally and stably.
Promptly, for such surface processing device 5, with this countermeasure 3, the bottom that constitutes the peeling member 19 of concavo-convex pectination is snapped to the groove 15 of conveying roller 9 from upside, so top ends of the former material A of substrate, even from downside to attach, adhere to, twisting cohesion on conveying roller 9, also can peel off immediately with peeling member 19 from upside.Therefore, can prevent in advance the former material A of substrate attaching, adhere to, twisting cohesion.
(8), for this surface processing device 5, as mentioned above, in order to reduce contact area, along the throughput direction C of the front and back example that to form a plurality of grooves 15 are its representatives.
Therefore, for surface processing device 5, adopt countermeasure 1, the countermeasure 2 corresponding with it.At first, as countermeasure 1, each groove 15 that is configured in the conveying roller 9 of upside or is configured near the conveying roller 9 of the upside nozzle 4 front and back of upside constitutes (with reference to Fig. 3 (a), Fig. 4 (a), Fig. 4 (b)) by narrow fine groove.
And then as countermeasure 2, the conveying roller 9 of upside makes groove 15 to form on Width G equally spacedly, simultaneously, and in the not configuration (with reference to Fig. 5 (a)) of conveying roller 9 mutual grooves 15 of the throughput direction C of front and back adjoining position with overlapping with staggering.
By adopting such countermeasure 1, countermeasure 2, this surface processing device 5, although on the throughput direction C of front and back, form groove 15, also can be with the Min. that is suppressed to of turbulent flow.
That is, can estimate the treatment fluid B that ejects from nozzle 4, as mentioned above, on the Width G about the outer surface of the former material A of substrate, flow, carry out surface treatment thus, then, flow down, reclaim from the left and right sides of the former material A of substrate.Therefore, the treatment fluid B of outer surface that is injected in the former material A of substrate is along the groove 15 of front and back throughput direction C, flows point-blank in a large number in front and back, that is, it is unfavorable that turbulent flow takes place forwards, backwards.
Therefore, for this surface processing device 5, as countermeasure 1 to it, for conveying roller 9 of upside etc., adopt such liquid flow restriction at a spot of fine groove as groove 15, simultaneously as countermeasure 2,, do not allow on throughput direction C, linearly overlap at each conveying roller 9 of upside groove 15 that staggers each other.Therefore, with such countermeasure 1,2, stop treatment fluid B to flow in a large number point-blank really at the throughput direction C of front and back.
For this surface processing device 5, although adopt groove 15 along front and back, also will from upside be injected in the former material A of substrate outer surface (above) treatment fluid B flow in front and back along groove 15 and be suppressed at Min., suppressed the generation of turbulent flow forwards, backwards.Therefore, prevented that also turbulent generation is for the surface-treated bad influence.
In addition,, increased contact area with the former material A of substrate than wide groove thus though adopt narrow groove as groove 15, the problem of degree only, as groove 15 keep the attaching that prevents the former material A of substrate, adhere to, function such as twisting cohesion.
(9) with respect to this, for the outer surface (following) of the former material A of substrate since the treatment fluid B that sprays from downside after surface treatment immediately because of gravity falls down, take place so needn't worry above-mentioned turbulent flow.
Therefore, for the conveying roller 10 of downside,,,, can adopt the wideer wide groove of contact area as groove 16 above-mentioned local different with the conveying roller 9 of upside.In addition, need be in the stagger spacing of groove 16 of throughput direction C yet, this staggers is not allow groove 16 overlap each other for the conveying roller 10 in front and back.
Claims (10)
1. the surface processing device of the former material of substrate, in the manufacturing process of circuit, use with substrate, inject process liquid carries out surface treatment on the former material of substrate, it is characterized in that having the conveying roller of carrying the former material of this substrate and, on the former material of substrate, spray this treatment fluid nozzle and, be configured in the intermediate member between this conveying roller
On the outer surface of this conveying roller, be formed with concavo-convexly, the contact area with the former material of this substrate is diminished.
2. the surface processing device of the former material of substrate according to claim 1 is characterized in that being formed with on the outer surface of this intermediate member concavo-convex, and the contact area with the former material of this substrate is diminished.
3. the surface processing device of the former material of substrate according to claim 2, it is characterized in that this conveying roller is made of straight roller, and dispose a plurality ofly in configuration up and down on the throughput direction in front and back, this conveying roller is clamped the former material of this substrate and is contacted rotation and carry out horizontal feed thus
This intermediate member is introduced on the height a little up and down at the horizontal feed face of this conveying roller and to be disposed, with the former material contact guidance of substrate to throughput direction,
The former material subtend of this nozzle and this substrate that is transferred is placed, from inject process liquid up and down.
4. the surface processing device of the former material of substrate according to claim 3, it is concavo-convex to it is characterized in that this conveying roller and this intermediate member form with groove respectively, this groove about cross direction devices spaced apart configuration, and be formed with a plurality of along the throughput direction of front and back.
5. the surface processing device of the former material of substrate according to claim 4 is characterized in that the groove of this conveying roller of upside is made of narrow fine groove, and the groove of this conveying roller of downside is made of wide wide groove.
6. the surface processing device of the former material of substrate according to claim 4, it is characterized in that being configured near this conveying roller of the upside the front and back of this nozzle, its groove is made of narrow fine groove, and each groove of this conveying roller of the upside beyond it and this conveying roller of downside is made of wide wide groove.
7. the surface processing device of the former material of substrate according to claim 4, it is characterized in that this conveying roller at upside, its groove is when Width is with equidistant formation, and the mode that does not overlap with this groove each other in the front and back of throughput direction staggers this groove and disposes.
8. the surface processing device of the former material of substrate according to claim 4, it is characterized in that this intermediate member has a plurality of extended prominent shape ends separately towards throughput direction, should be embedded into this groove of this corresponding conveying roller from front and back interlock ground prominent shape end, with this groove sliding contact.
9. the surface processing device of the former material of substrate according to claim 4 is characterized in that above-mentioned this conveying roller in abutting connection with having set up a plurality of peeling members,
This peeling member is positioned at the downstream of this conveying roller, and can joltily being supported by axle, and its bottom is embedded into this groove of this conveying roller from upside interlock ground, with this groove sliding contact on the throughput direction of front and back in its upper end.
10. according to the surface processing device of claim 5,6,7, the former material of 8 or 9 described substrates, soup treatment process in the manufacturing process of soft printed circuit board and washing procedure use,
The former material of this substrate as thin as a wafer and weak strength, softness, is imbued with pliability, and this nozzle sprays imaging liquid, corrosive liquid, stripper or cleaning solution as this treatment fluid.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP139708/04 | 2004-05-10 | ||
| JP2004139708A JP2005322779A (en) | 2004-05-10 | 2004-05-10 | Surface processor for substrate material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1697597A true CN1697597A (en) | 2005-11-16 |
Family
ID=35350067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200410048251 Pending CN1697597A (en) | 2004-05-10 | 2004-06-14 | Surface treatment appts.of substrate material |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2005322779A (en) |
| CN (1) | CN1697597A (en) |
| TW (1) | TW200536618A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1970411B (en) * | 2005-11-23 | 2010-09-01 | 大众汽车有限公司 | Supporting roller wheel, supporting roller wheel device and transportation device |
| CN102161261A (en) * | 2010-12-18 | 2011-08-24 | 江苏锐毕利实业有限公司 | Multi-station jet-printing system of flexible printed circuit board |
| CN105252818A (en) * | 2015-09-15 | 2016-01-20 | 无锡鼎茂机械制造有限公司 | Plastic film material guiding mechanism used for bag making machine |
| CN108495461A (en) * | 2018-02-10 | 2018-09-04 | 东莞市联洲知识产权运营管理有限公司 | A kind of wiring board hot press of rotation translation ejecting type |
| CN109648999A (en) * | 2018-12-13 | 2019-04-19 | 杭州国瑞印务有限公司 | A kind of print system of admission ticket |
| CN112607300A (en) * | 2020-12-22 | 2021-04-06 | 惠州市富丽电子有限公司 | Separation dislocation collecting device for splayed conveying belt |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5260370B2 (en) * | 2009-03-19 | 2013-08-14 | 住友精密工業株式会社 | Substrate processing equipment |
| CN107333395B (en) * | 2017-08-17 | 2023-05-05 | 广东省华锐高新材料股份有限公司 | Aluminum substrate cleaning and paving production line |
| KR102031743B1 (en) * | 2019-03-26 | 2019-10-15 | 비욘드솔루션 주식회사 | Bridge assembly for transmitting substrate |
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| JP7056972B2 (en) * | 2020-06-04 | 2022-04-19 | 株式会社ケミトロン | Board processing equipment |
| TWI776780B (en) * | 2022-02-11 | 2022-09-01 | 金協鑫科技股份有限公司 | Surface treatment equipment |
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2004
- 2004-05-10 JP JP2004139708A patent/JP2005322779A/en active Pending
- 2004-05-28 TW TW93115206A patent/TW200536618A/en unknown
- 2004-06-14 CN CN 200410048251 patent/CN1697597A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1970411B (en) * | 2005-11-23 | 2010-09-01 | 大众汽车有限公司 | Supporting roller wheel, supporting roller wheel device and transportation device |
| CN102161261A (en) * | 2010-12-18 | 2011-08-24 | 江苏锐毕利实业有限公司 | Multi-station jet-printing system of flexible printed circuit board |
| CN105252818A (en) * | 2015-09-15 | 2016-01-20 | 无锡鼎茂机械制造有限公司 | Plastic film material guiding mechanism used for bag making machine |
| CN108495461A (en) * | 2018-02-10 | 2018-09-04 | 东莞市联洲知识产权运营管理有限公司 | A kind of wiring board hot press of rotation translation ejecting type |
| CN108495461B (en) * | 2018-02-10 | 2019-10-25 | 嘉兴市上村电子有限公司 | A kind of wiring board hot press of rotation translation ejecting type |
| CN109648999A (en) * | 2018-12-13 | 2019-04-19 | 杭州国瑞印务有限公司 | A kind of print system of admission ticket |
| CN112607300A (en) * | 2020-12-22 | 2021-04-06 | 惠州市富丽电子有限公司 | Separation dislocation collecting device for splayed conveying belt |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200536618A (en) | 2005-11-16 |
| JP2005322779A (en) | 2005-11-17 |
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