KR101420779B1 - By way of drum rotation portion of the connector pin electroplating unit - Google Patents

Abstract

The present invention relates to a partial electroplating apparatus capable of selectively plating only a desired portion of an object to be plated, such as a connector pin.
For example, a cylindrical fixing body having a plating liquid supply pipe therein and a bearing on an outer circumferential surface thereof; A plating solution injection block formed on the fixed body and having a plating solution receiving portion connected to the plating solution supply pipe and having a plating solution injection hole formed on an outer circumference thereof; A drum mask holder rotated about the fixed body and having a support part; A cover member connected to the upper end of the fixed body to apply a positive current to the plating liquid accommodating portion; And a drum mask rotated together with the drum mask holder, wherein a plating solution nozzle hole is formed on an outer circumferential surface and a positioning pin is formed on an outer circumferential surface of the drum mask.
According to this, it is possible to precisely and quickly and stably perform plating of a desired portion of the plated object to be continuously transferred, and it is also possible to sequentially coat one surface or both surfaces of the plated body, So that the plating operation can be performed variously and efficiently.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an electroplating apparatus,

The present invention relates to an electroplating apparatus for selectively plating a necessary portion of a connector pin, and more particularly, to an electroplating apparatus capable of accurately and rapidly and stably plating only a necessary portion of a continuously-transferred plated body And more particularly to a partial electroplating apparatus using a connector pin.

In general, plating is a technique for forming a film by using a metal having a different metal on a surface of a metal or a non-metal, and can be divided into electroplating, chemical plating, hot dip coating, vacuum plating, Decorative plating, decorative plating, decoration plating, and industrial plating according to the purpose of the present invention.

Electroplating is a surface treatment method in which metal ions are reduced and deposited on the surface using the principle of electrolysis, and the surface to be plated is coated with a plating solution, which is an electrolytic solution, And the anode is connected to the other metal by a direct current, and the molten metal in the solution is coated with the metal film on the surface of the product.

On the other hand, in the case of a pin or a lead which is a connection terminal to be used for a connector used for electrical and electronic connection, nickel (Ni) plating is firstly performed to form a metal layer, and then, Au) is plated.

A synthetic connector is manufactured by extruding a synthetic resin into a plated pin or lead (hereinafter, referred to as a "plated body"), and this connector is mounted on a PCB or the like using surface mount technology (SMT) And fixed by soldering or the like.

At this time, if the plated body is entirely plated with gold, the solder is spread over the entirety of the connection terminals during the soldering operation, thereby causing defective connector.

In addition, if the plated body is plated with gold as a whole, the amount of expensive gold used increases, which increases the production cost and makes it difficult to lower the unit cost of the connection terminal.

Accordingly, there is a need for a method capable of selectively plating only a necessary portion of a plated body. Partial deposition methods, masking methods, brush methods, and jet injection methods are available for such partial plating methods.

Here, the partial deposition method is the simplest method in which only a desired portion is plated by partially immersing a plated body in a plating solution, and it is difficult to precisely deposit the plating portion, thereby limiting the selection of a plating region.

In the masking method, plating is performed by attaching a masking tape or the like to a portion which is not required to be plated of the plated body, which is expensive due to the provision of a separate device such as a masking tape, And the plating solution penetrates into the inside of the masking tape, so that it is difficult to apply to the three-dimensional products due to the difficulty of precise plating and the bending process.

In addition, the brush method is a method in which a plating liquid is applied to a brush and then a brush is brought into contact with a desired portion of the plated material, which is difficult to apply to high-speed plating, and workability is not easy, and depending on the contact between the brush and the plated body, The body can be deformed.

In addition, the jet spraying method is a method of exposing a plating solution to only a portion where plating is required by spraying a plating solution at a high speed through a nozzle, and is used in combination with masking or a corresponding shielding. In order to increase the partial plating effect, Plating may be performed by energizing the plated body.

However, the jet injection method requires a variety of equipment such as a device for jet injection and a pulse power supply device, which increases the cost of the device, and a disadvantage that the cost of an additional device such as a sensor device for controlling the jet injection is increased have.

On the other hand, this partial plating apparatus has already been proposed in Korean Patent Laid-Open Publication No. 2003-0021514, "Lead frame plating apparatus ", and the configuration of the lead frame plating apparatus includes an outer case; A mask provided on an upper portion of the outer case and having pattern holes corresponding to a position to be plated of the lead frame; An inner case having a supply pipe for supplying a plating solution; A plate corresponding to the pattern holes of the mask and communicating with the inner case; A nozzle unit protruding toward the mask side and having a conductive nozzle; And a press section for pressing the lead frame positioned on the upper surface of the mask toward the mask.

However, the above-mentioned partial plating apparatus has a problem in that it is difficult to precisely coat a desired portion of the lead frame as the lead frame, which is the plated lead, is moved while being pressed on the mask by being pressed on the mask, There is a problem that the plating quality of the lead frame deteriorates.

Accordingly, the present invention has been made in order to solve the above-mentioned problems, and it is an object of the present invention to provide a plating apparatus capable of preventing the flow of a plated body to be plated, guiding the plated part accurately, improving plating quality, And it relates to a partial electroplating apparatus for a connector pin using a drum rotation method in which plating can easily be performed on one side or both sides or both sides of a plated body.

According to a preferred embodiment of the present invention, there is provided a method for partially plating a strip-shaped plated body, which is continuously conveyed by a feed roller while being guided by a guide roller, and to which a cathode current is applied, In the electroplating apparatus,

A cylindrical fixed body fixed to the upper surface of the base, having a plating liquid supply pipe provided therein and having a bearing on its upper peripheral surface;

A plurality of plating liquid injecting holes formed on the outer circumferential surface of the plating liquid injecting hole and extending outwardly from the plating liquid receiving portion are formed at regular intervals along the circumferential direction, A block;

A drum mask holder fixed to a bearing provided on an upper portion of the fixed body and rotated about a fixed body and having a support portion;

A cover member disposed on an upper surface of the drum mask holder and connected to an upper end of the fixing body to apply a positive current to the plating solution accommodating portion; And

A plating solution nozzle hole is formed on an outer circumferential surface of the plating solution nozzle so as to coincide with the plating solution injection hole, and a pin hole of the plating member is inserted in a lower portion of the outer circumference of the plating solution nozzle hole, And a drum mask having a crystal pin formed therein.

Preferably, a guide portion having a seating surface is formed on the lower end of the outer peripheral surface of the drum mask so as to support the plating body.

More preferably, the contact member is provided in a drum mask on which the plated body is contacted.

More preferably, a fitting groove is formed in the upper and lower sides of the plating liquid spray hole of the drum mask, and a contact member is provided in the fitting groove, the contact member being protruded so as to have the same height as that of the surface of the plating liquid spray hole .

More preferably, the adhesion member is associated with silicon.

More preferably, the drum mask is selectively coupled to a part or whole of the inner circumferential surface to constitute a blocking plate so as to block the plating liquid injection hole.

The present invention can accurately and rapidly perform a plating process on a desired portion of a plated object continuously transferred using an electroplating apparatus, thereby improving efficiency of a plating operation and reducing unnecessary waste of a plating liquid, And it is also possible to sequentially coat one surface or both surfaces of the plated body to be plated according to need, and it is possible to coat the both surfaces of the plated body differently from each other with different configurations of the plating apparatus, And the like.

1 is a perspective view illustrating an installation state of an electroplating apparatus according to an embodiment of the present invention.
2 is an exploded perspective view illustrating the configuration of an electroplating apparatus according to an embodiment of the present invention.
Fig. 3 shows a cross-sectional view of a principal portion illustrating the configuration of an electroplating apparatus according to an embodiment of the present invention.
4 is an enlarged cross-sectional view showing a main portion illustrating a configuration of an electroplating apparatus according to another embodiment of the present invention.
5 is an enlarged cross-sectional view showing a main portion illustrating a configuration of an electroplating apparatus according to still another embodiment of the present invention.
6 is a schematic diagram illustrating a process of transferring a plated body according to an embodiment of the present invention.
7A and 7B are cross-sectional views illustrating a plating layer formed on both surfaces of a plated body through a transfer process of a plated body according to another embodiment of the present invention.
8A and 8B are cross-sectional views illustrating a plating layer formed on both surfaces of a plated body through a transfer process of a plated body according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

It will be understood by those of ordinary skill in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

In addition, the sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience of explanation, and the terms defined specifically in consideration of the configuration and operation of the present invention may vary depending on the intention or custom of the user, operator And the definitions of these terms should be based on the contents throughout this specification.

1 is a perspective view illustrating an installation state of an electroplating apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view showing a configuration of an electroplating apparatus according to an embodiment of the present invention, Sectional view illustrating a configuration of an electroplating apparatus according to an embodiment of the present invention. Referring to these drawings, an electroplating apparatus according to an embodiment of the present invention will be described as follows.

The fixed body 100 is formed as a fixed body in a cylindrical shape and fixed upright on the upper surface of the base 120. A plating liquid supply pipe 110 is vertically upwardly formed in the center of the fixed body 100, The plating liquid is continuously supplied from a plating liquid tank composed of a pressurized circulation pump, piping, and the like.

The apparatus also includes a device for recovering the used plating solution and a means for moving the plating solution recovered by the apparatus back to the plating solution tank so that the plating solution can be circulated continuously.

The plating liquid injection block 200 fixed together with the fixed body 100 is formed in a disc shape having a diameter larger than the diameter of the fixing body 100 at the center of the fixed body 100. The plating liquid injection block 200, A plating liquid accommodating portion 210 having a predetermined space is formed in the interior of the fixing body 100 so as to be connected to the plating liquid supply pipe 110 and to receive the plating liquid supplied from the plating liquid supply pipe 110.

A plurality of plating liquid spray holes 220 are formed on the outer circumferential surface of the plating liquid spraying block 200 at equal intervals along the outer circumferential surface thereof so as to form a single line on the same line, so that a plating liquid having a constant pressure is supplied to the plating liquid supply pipe The plating solution is injected into the plating solution accommodating portion 210 through the plating solution injecting hole 220 and the plating solution injecting hole 220.

The diameter of the plating liquid spray hole 220 may vary with the size of the plated body 600 and the area required for plating, but it is preferable to form the diameter within the range of 0.15 mm to 1.25 mm, and the plating liquid spray hole 220 Is less than 0.15 mm, the flow path resistance inside the plating liquid spraying hole 220 is increased and the set value of the pressure must be increased accordingly. Therefore, there is a disadvantage in that it is difficult to manufacture and the technique and the cost increases. ) Is 1.25 mm or more, the linearity of the plating liquid to be sprayed is lowered, so that accurate spraying is difficult, and the plating precision is lowered.

The number of the plating liquid spray holes 220 along with the diameter of the plating liquid spray holes 220 may vary depending on the size and structure of the plating liquid spray block 200, but is preferably 100 to 200, The efficiency of spraying and the efficiency of plating are inferior. When the number of particles is more than 200, there is a problem in terms of manufacturing.

The gap between the plating liquid spray holes 220 may vary depending on the size and structure of the plating liquid spray block 200. However, it is preferable that the gap is set to 0.15 mm to 3.5 mm. When the interval between the plating liquid spray holes 220 is less than 0.5 mm There is a disadvantage in that the accuracy of spraying the plating liquid drops when the interval between the plating liquid spray holes 220 is 3.5 mm or more.

The plating liquid spray holes 220 may be formed in one line on the line to be plated or two or more lines spaced apart from each other in the line to be plated according to the portion to be plated, Line, plating may be performed on one of the plated bodies 600 for the function of the connecting pin, and plating for the surface mounting technique (SMT) may be performed on the other.

Unlike the fixed body 100 and the plating liquid injection block 200, the drum mask holder 300, which is a rotating body, is configured to rotate about the fixed body 100. For this purpose, the fixed body 100, A bearing 130 is installed on the upper portion of the drum 130 and the drum mask holder 300 is fixed to the bearing 130 in a forced fit manner.

A disk-shaped support 310 is formed on the bottom of the drum mask holder 300 and the support 310 is rotated about the fixed body 100 together with the drum mask holder 300.

The fixing chain cover member 400 is fixed to the upper end of the fixing body 100 in a state of being positioned on the upper surface of the drum mask holder 300 and is fixed together with the fixing body 100 irrespective of the rotation of the drum mask holder 300 And a positive current is applied to the cover member 400 by being connected to a current supply device (not shown in the figure) on one side of the upper surface of the cover member 400, and the cover member 400 Is applied to the plating liquid injection block 200 as a conductive body through the fixing body 100 of the same conductive chain, the plating liquid stored in the plating liquid storage part 210 of the plating liquid spraying block 200 is supplied with the positive electrode current It is to have.

The upper surface of the drum mask 500 is inserted into the drum mask holder 300 and inserted into the upper surface of the support 310 and the fixing bolt 311, The drum mask 500 can be rotated about the fixed body 100 together with the drum mask holder 300.

This is because it is necessary to replace the drum mask 500 due to deformation or damage of the drum mask 500 or a plurality of plating liquid nozzle holes 510 having a predetermined interval according to the plating area of the plating object 600, It is necessary to select and replace the drum mask 500 having a different number of lines as required, since the line may be formed by one line or two or more lines on the same line along the periphery.

Therefore, in order to replace the drum mask 500 when the drum mask 500 and the drum mask holder 300 are integrally formed, the fixing body 100 and the drum mask holder 300 fixed by the bearing 130 So that the replacement operation is complicated and inconvenient.

Therefore, the drum mask holder 300 and the drum mask 500 are separately formed and the drum mask 500 is formed with the fastening holes 540 so as to be fixed by the fixing bolts 311, So that it is possible to facilitate the replacement of the battery.

A plating solution nozzle hole 510 is formed on the outer circumferential surface of the drum mask 500 so as to be in a straight line with the plating solution injection hole 220 formed in the plating solution injection block 200, So that the plating liquid sprayed from the plating liquid nozzle hole 510 of the drum mask 500 can be sprayed to the outside of the drum mask 500.

A plurality of the same unit bodies are connected to each other at regular intervals to form a strip shape. The plating unit 600, which is connected to the current supply unit and to which a cathode current is applied, (610) are continuously formed.

The positioning pin 522 is formed under the outer circumferential surface of the drum mask 500 so that the pin hole 610 of the plated body 600 which is in contact with the outer circumferential surface of the drum mask 500 is inserted into the positioning pin 522 The drum mask 500 can be rotated together with the conveyance of the body 600 to be plated.

At this time, the positioning pins 522 may be the same as the spacing of the peeling liquid nozzle holes 510, but may be arranged at intervals larger than the spacing of the peeling liquid nozzle holes 510.

Accordingly, the positioning pin 522 plays a role of holding the position of the plated body 600 and also rotating the drum mask 500. [0051]

A guide part 520 having a seating surface 521 is formed at the lower end of the outer circumferential surface of the drum mask 500 so that the bottom surface of the plating member 600 fitted to the fin hole 610 of the positioning pin 522 The plated body 600 moves in a state of being supported by the guide part 520 while being seated on the seating surface 521 so that stable movement of the plated body 600 and flow of the plated body 600 are prevented The accuracy of the plating can be further increased.

4 is an enlarged cross-sectional view of a main part of an electroplating apparatus according to another embodiment of the present invention. When the object to be plated 600 is conveyed while rotating the drum mask 500 in contact with the outer peripheral surface of the drum mask 500 The adhesion member 700 is provided on the drum mask 500 to increase the adhesion between the drum 600 and the drum mask 500 so that the plating accuracy can be doubled.

When the plating member 600 contacts the outer circumferential surface of the drum mask 500, when the adhesion force is weak, the plating solution penetrates to a portion where the plating solution is unnecessary, thereby causing waste of the plating solution, It is necessary to firmly adhere the outer circumferential surface of the drum mask 500.

The contact member 700 may be provided on the upper and lower sides of the plating solution nozzle hole 510 of the drum mask 500 so as not to block the plating solution nozzle hole 510 of the drum mask 500, When a plating liquid nozzle hole 510 is formed in two lines, it is possible to form the fitting groove 530 having a predetermined depth in the shape of a circle along the plating liquid nozzle hole 510 and above and below the plating liquid nozzle hole 510 An annular fitting member 700 is provided in the fitting groove 530 after the fitting groove 530 is formed in an annular shape along the outer peripheral surface of the drum mask 500.

As an example of the installation method, the tightening member 700 may be fixed to the fitting groove 530 using an interference fit or an adhesive, but injection molding may preferably be performed using an insert injection method.

The contact member 700 provided in the fitting groove 530 is configured to protrude finer than the surface of the plating liquid nozzle hole 510 to form a step with the surface of the plating liquid nozzle hole 510.

And the protruding heights of the contact members 700 sandwiched by the respective fitting grooves 530 must be equal to each other so that the member to be plated 600 adheres to the contact member 700 to prevent the plating solution from spreading, ) Can be precisely plated.

The contact member 700 may be formed in one body and annularly formed on the outer circumferential surface of the drum mask 500 so that the contact member 700 is coincident with the plating solution nozzle hole 510 of the drum mask 500 (Not shown in the drawing), and the through hole is preferably formed larger than the plating liquid nozzle hole 510. [

The material of the contact member 700 is preferably made of a material having adhesion with the material to be plated 600, more preferably made of a silicon material.

5 is an enlarged cross-sectional view of a main part of an electroplating apparatus according to another embodiment of the present invention. A blocking plate 800, which can be attached to and detached from the inner circumferential surface of the drum mask 500, can be selectively installed in a part or whole section The plating liquid injected from the plating liquid injection hole 220 of the plating liquid injection block 200 can not pass through the plating liquid nozzle hole 510 of the drum mask 500 by the blocking plate 800, 600) in the selected section or the entire section.

When the blocking plate 800 is configured to be attachable to and detachable from the inner circumferential surface of the drum mask 500, the attachment and detachment means may be a coupling method using the protrusion 810, or an adhesive material may be applied to the inner circumferential surface of the drum mask 500 The blocking plate 800 may be attached to or detached from the inner circumferential surface of the drum mask 500 using a fastening means such as a screw.

The height of the blocking plate 800 is adjustable so that when the plating liquid nozzle hole 510 is formed in a plurality of lines in the drum mask 500, any one of the plurality of lines can be selectively blocked .

The plated body 600 has a strip shape and is continuously conveyed by the conveying roller 920 so that the plated body 600 passes through the outer peripheral surface of the drum mask 500 during its conveying process. A desired portion of the object to be plated 600 is plated by the plating liquid injected from the nozzle hole 510.

Referring to FIG. 6, a process of plating a part of the object to be plated 600 with gold according to an embodiment of the present invention will be described below.

The strip-shaped plated member 600 is conveyed while being in contact with the outer peripheral surface of the drum mask 500 of the electroplating apparatus while being guided by the conveying roller 920 and the guide roller 910.

In this case, the pin holes 610 of the plated body 600 are respectively fitted to the positioning pins 522 formed on the outer peripheral surface of the drum mask 500, so that the drum mask 500 is fixed And is rotated about the body 100.

The anode current flows through the plating liquid injection block 200 connected to the cover member 400 to which the anode current flows and the anode current flows through the plating liquid injecting block 200 of the plating liquid injection block 200 The anode current flows through the plating solution nozzle hole 510 of the drum mask 500 through the plating solution injection hole 220 through the plating solution injection hole 220 and the plating solution injection hole 220 through the plating solution injection hole 220, The part is plated with gold.

When one electroplating apparatus is used in the process of transferring the plated body 600, only one side of the plated body 600 can be plated. If it is necessary to coat both sides of the plated body 600, And the plated body 600 is supported by the guide rollers 910 to pass through the two plating apparatuses so that both surfaces of the plated body 600 can be plated.

The plating liquid injection hole 220 is formed in one line in the plating liquid injection block 200 and the drum mask 500 is also connected to the plating liquid injection hole 220, The plating liquid can be plated on one part of the plated body 600 by forming the plating liquid nozzle hole 510 in a line so as to be in line with the plating liquid.

The plating liquid injection hole 220 is formed in two lines in the plating liquid injection block 200 and the drum mask 500 is also formed in the plating liquid injection block 200. In this case, The plating liquid can be simultaneously plated on both sides of the plated body 600 by forming the plating liquid nozzle holes 510 in two lines so as to be in line with the through holes 220.

When only one surface of the object to be plated 600 needs to be plated in a state where the electroplating apparatus is set to two, one of the electroplating apparatuses is used as it is and the drum mask 500 of the remaining electroplating apparatus is provided with the above- If the plate 800 is installed, only a desired portion of the object to be plated 600 may be simply plated without changing the setting of the electroplating apparatus.

In the case where both sides of the plated body 600 are to be plated differently, one side of the plated body 600 is plated through one electroplating device, and then the direction is changed by the guide rollers 910, If the plating liquid spray holes 220 and the plating liquid nozzle holes 510 are formed differently for each electroplating device as in the embodiment of FIGS. 7A and 7B, 600 may have different plating layers on both sides thereof.

When one plated layer is formed on one surface of the plated body 600 and two plated layers are formed on the opposite surface, a plating solution injection hole 220 is formed in one electroplating device as in the embodiment of FIGS. 8A and 8B, And the plating liquid nozzle hole 510 constitute one line located on the same line, and the other electroplating apparatus forms two lines in which the plating liquid spray hole 220 and the plating liquid nozzle hole 510 are located on the same line A different number of plating layers may be formed on both sides of the body 600 to be plated.

Although the present invention has been described in connection with certain exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. Therefore, the scope of the present invention should not be limited by the described embodiments, but should be defined by the appended claims and equivalents thereof.

100: fixed body 110: plating liquid supply pipe
120: base 130: bearing
200: plating liquid ejection block 210: plating liquid receiving portion
220: plating solution spray hole 300: drum mask holder
310: Support part 311: Fixing bolt
400: cover member 500: drum mask
510: plating solution nozzle hole 520: guide part
521: seat surface 522: positioning pin
530: fitting groove 540: fastening hole
600: Plated body 610: Finned hole
700: tight contact member 800: shield plate
910: Guide roller 920: Feed roller

Claims (6)

An electroplating apparatus for partially plating a strip-shaped object to be plated which is continuously conveyed by a conveying roller and to which a negative current is applied and which has a pin hole at the bottom,
A cylindrical fixing body fixed to the upper surface of the base, having a plating liquid supply pipe inside and a bearing mounted on the upper side;
The plating liquid injecting hole is formed on the outer circumferential surface of the plating liquid injecting hole. The plating liquid injecting hole is formed on the outer circumferential surface of the plating liquid injecting hole. block;
A drum mask holder in which an inner circumferential surface is fixed to a bearing provided on an upper portion of the fixed body and is rotated about a fixed body;
A cover member disposed on an upper surface of the drum mask holder and connected to an upper end of the fixing body to apply a positive current to the plating solution accommodating portion; And
A plating solution nozzle hole is formed on an outer circumferential surface of the drum mask holder so as to surround the plating solution injection block and a plating solution nozzle hole is formed on an outer circumferential surface of the drum mask holder so that a positioning pin is formed on an outer peripheral surface of the drum, And a mask,
Wherein a guide portion having a seating surface is formed at a lower end of an outer circumferential surface of the drum mask to support a plated body.
The method according to claim 1,
Wherein the upper surface of the drum mask, which is formed in a lower portion of the drum mask holder and is fitted to the drum mask holder, is detachably coupled to the support portion and the fixing bolt. Device.
delete The method according to claim 1,
Wherein a contact member is provided on an outer circumferential surface of the drum mask in which the member to be plated is contacted.
5. The method of claim 4,
And a contact member is formed in the fitting groove so that the contact member protrudes from the surface of the plating liquid spray hole so as to have the same height as the surface of the plating solution spray hole. A part electroplating device of a connector pin using a drum rotation method.
The method according to claim 1,
Wherein the shield plate is selectively coupled to a part of the inner circumferential surface or the entire section of the drum mask to block the plating liquid spray hole.

Images