JPH0570987A - Partial plating method and plating device thereof - Google Patents

Abstract

PURPOSE:To improve productivity by applying a plating treatment only to the required region concerning to the partial plating of the members arrayed and molded to a hoop material. CONSTITUTION:This partial plating method consists in ejecting a plating liquid 4 having an anode potential from a nozzle 5 fixed within a rotary drum 12 having holes 12a arrayed on its peripheral wall toward the above-mentioned hole region and plates the prescribed regions of the works 1a existing within the hole parts among the plural works 1a arrayed and formed on the hoop material 1 moving together with the drum 12 in tight contact with a part on the outside peripheral surface of the drum 12. A plating head 21 having a means 24 for pressing only the regions exclusive of the required areas to be plated of the works 1a exposed in these hole 12a parts is disposed in the position corresponding to the respective holes 12a on the inside peripheral wall surface of the rotary drum 12 to as to eject the plating liquid 4 in the state of adding the anode potential to the hoop material 1 to the anode electrodes 23a, 23b provided on the wall surfaces forming the non-pressing parts to the works 1a of the head 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a partial plating method and a partial plating apparatus in which productivity is improved by partially plating only a required region of a part formed of a hoop material.

[0002] For example, in a manufacturing process of a connection terminal used for a switching element of various signal input devices, electrodes for improving connection characteristics are continuously formed in a required region of the connection terminal formed continuously on a band-shaped hoop material. Although it may be formed by a plating process, it is often the case that the plating-free region beyond the required region is plated, and therefore improvement in productivity cannot be expected, and its solution is desired.

[0003]

2. Description of the Related Art In the figure, an object to be plated is a disc spring used for a switching element of a keyboard for a signal input device, which is continuously formed on a hoop material. Only a plating required area on the disc spring is plated with gold (Au). A case where the processing is performed will be described as an example.

FIG. 2 is a diagram showing a required plating area of an object to be plated. (2-1) is a plan view and (2-2) is the (2-1).
Is a cross section taken along line a-a '. 3 is a conceptual diagram for explaining a conventional plating apparatus and partial plating method, and FIG. 4 is a diagram for explaining problems.

In FIG. 2, a plurality of circular plates 1a curved spherically in the thickness direction are punched and formed at a constant pitch interval p, for example, by a continuous press machine or the like on the hoop material 1 in FIG. Is connected to the strip-shaped material 1c remaining on both sides in the width direction of the hoop material 1 along the longitudinal direction by tie bars 1b provided at two positions in the diameter direction.

In the region of the band-shaped material 1c, guide holes 1d serving as a feed guide when the circular plate 1a is continuously formed are formed at equal pitches (p / 2 in the figure). And the portion of the circular plate 1a after being cut in a later step is a portion configured as a disc spring utilizing the rebounding force at the time of displacement of the spherical curved portion, but the disc spring is pressed at the center or In order to use it as a switching element for performing electrical switching by releasing it, at least the central area A and the peripheral area B indicated by hatching on the concave surface side must be plated.

Therefore, the areas A and B represent the required plating areas. FIG. 3 shows an apparatus and a plating method for plating the hoop material 1, (3-1) is an external view of the apparatus, and (3-2) is a cross-sectional view of the main part of the apparatus taken along line bb '. Is.

In FIG. 3, the plating apparatus 2 has a chemical resistance such as a Teflon resin which is hooked at the guide holes 1d provided on both sides in the width direction of the hoop material 1 described in FIG. 2 to rotate at a predetermined rotation speed. Rotating drum (hereinafter referred to as "drum") 3 made of a conductive resin, a fixed nozzle 5 located inside the rotating drum 3 for ejecting a plating solution 4 toward the outer wall of the drum 3, and the hoop material 1 on the outer wall surface of the drum 3. The backup belt 6 to be brought into close contact is configured as a main constituent member.

The fixed nozzle 5 is shown in FIG.
When viewed from the direction, the plan view is fan-shaped, and a groove-shaped blow-out port 5a is provided over substantially the entire length of the periphery thereof.
It is configured to be connected to the anode side having a potential difference of about 3V.

A rubber mask 3a for adhering the hoop material 1 to the outer peripheral surface of the drum 3 is attached to the drum 3, and at least the circular plate 1a portion of the hoop material 1 described with reference to FIG. 2 can be covered. The circular plate with the hole 3b of the size
The holes are perforated at intervals equal to the pitch p between 1a.

The above-mentioned backup belt 6 located outside the drum 3 is tensioned by four idles 6a arranged so as to be able to press on the outer wall surface of the drum 3 in a region of about half a circumference.

Therefore, the drum 3 is arranged so that the required plating surface, that is, the concave surface side faces the outer wall surface side of the drum 3 in a state where the drum 3 is rotated at a constant speed in the R direction in the drawing by a drive mechanism (not shown). When the hoop material 1 is set on the drum 3 with the circular plate 1a and the hole 3b aligned with each other, the hoop material 1 is fitted with the guide pin 3c provided at a predetermined position on the outer wall surface of the drum 3 and the guide hole 1d. Since it is pulled by the drum 3, it is caught between the outer wall surface of the drum 3 and the backup belt 6 and consequently moves together with the drum 3.

Therefore, the hole 3b of the drum 3 sequentially passes in front of the fixed nozzle 5, and the concave surface of the circular plate 1a of the hoop material 1 is exposed at the opening of the hole 3b. ing.

Then, a plating solution 4 such as a cyan gold solution is ejected from the ejection opening 5a of the nozzle 5 which is expanded in a fan shape, so that the hoop material 1 is exposed by the potential difference between the nozzle 5 and the hoop material 1. The surface can be gold plated as required.

Particularly, in the hoop material 1 in this case, the area exposed in the hole 3b, that is, the back surface of the circular plate 1a is pressed by the backup belt 6, and the area other than the area is covered with the rubber mask 3a and the backup belt. Since it is sandwiched by 6 and 6, the size of the opening of the rubber mask 3a can be brought close to the required plating area without the plating liquid 4 wrapping around the back surface side of the hoop material 1 or the area masked by the rubber mask 3a. Efficient plating processing can be performed.

In FIG. 4 for explaining the problem, (4-1) is a diagram showing a state during plating, and (4-2) is a plated hoop material. The circular plate 1a of the hoop material 1 is exposed at the opening of the hole 3b of the drum 3 when the plating state is viewed from the inner surface of the drum, that is, the nozzle side (4-1). The surface of is exposed.

Therefore, when the plating solution is ejected from the plating solution ejection hole of the nozzle (not shown) located on the front side of the drawing, the exposed whole surface of the circular plate 1a is plated, resulting in (4-2) The area indicated by hatching will be plated.

Particularly in this case, the plating area C is plated up to the unnecessary plating area between the areas A and B described with reference to FIG. 2, so that the productivity cannot be improved in terms of price.

[0019]

However, the conventional partial plating method and its plating apparatus have a problem that unnecessary areas are plated and productivity cannot be expected to be improved.

[0020]

SUMMARY OF THE INVENTION The above-mentioned object is to direct a plating liquid having an anodic potential toward the hole area from a fixed nozzle located inside a rotary drum having holes formed at equal intervals in a peripheral wall. An object to be plated located in the hole of a plurality of objects to be plated which are ejected and are in close contact with a part of the outer surface of the peripheral wall of the rotating drum and are aligned with the hoop material moving together with the rotating drum. A partial plating method for performing a required plating treatment on a predetermined area, wherein the object to be plated exposed in the hole is provided at a position corresponding to each of the holes on the inner surface of the peripheral wall of the rotary drum in an area excluding the required plating area. A plating head having means for pressing and covering only is provided, and the plating head has a nose with an anode potential applied to the hoop material applied to an anode electrode provided on a wall surface forming a non-pressing area for the object to be plated. By jetting a plating solution is achieved by partial plating method for performing the plating process from.

Further, a plating liquid having an anode potential is ejected toward the hole region from a fixed nozzle located inside the rotary drum having holes formed at equal intervals on the peripheral wall, and the peripheral wall of the rotary drum is ejected. A predetermined plating process is performed on a predetermined area of the object to be plated located in the hole in the plurality of objects to be plated formed in alignment with the hoop material that moves in close contact with a part of the outer surface and moves with the rotary drum. In the partial plating device for applying, the rotating drum has a means for covering the object to be plated exposed in the hole at a position corresponding to each hole on the inner surface of the peripheral wall by pressing only in an area excluding a required plating area. A partial metal structure comprising a plating head and means for applying an anode potential to the hoop material to an anode electrode provided on a wall surface of the plating head that forms a non-pressing area for an object to be plated. It is achieved by the device.

[0022]

[Function] When the material to be plated is pressed against the surface of the plating head that partially opens with the anode potential to eject the plating liquid,
Only the portion corresponding to the opening can be partially plated.

In the present invention, a plating head that opens at a required plating position with an anodic potential is arranged in the hole of the drum, and the plating solution is jetted with the circular plate region of the hoop material positioned on the plating head. I am trying.

Therefore, unnecessary areas are not plated, and highly productive plating operations can be continuously performed.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view for explaining an example of a partial plating method and a plating apparatus therefor according to the present invention. In the figure, the same objects as those in FIG. 3 are designated by the same symbols.

In the drawings, the structure of the plating apparatus will be described first in order to facilitate understanding. In FIG. 1, the partial plating apparatus 11 includes a rotary drum (hereinafter referred to as a drum) 12 made of a chemical resistant resin or the like which hooks the hoop material 1 described in FIG. 2 with its guide hole 1d and rotates at a predetermined rotation speed, A fixed nozzle 5 located inside thereof for ejecting the plating solution 4 toward the outer wall of the drum 12 and a backup belt 6 for closely contacting the hoop material 1 with a part of the outer wall of the drum 12 are mainly constituted. However, the rotation of the drum 12 is performed by a driving mechanism (not shown) arranged at a position away from the central axis of rotation.

A rubber mask 3a for adhering the hoop material 1 to the outer peripheral surface of the drum 12 is attached to the drum 12, and the drum 12 has a size of at least covering the circular plate 1a of the hoop material 1 described with reference to FIG. As in the case of FIG. 3, the holes 12a are formed at intervals equal to the pitch p between the circular plates 1a, and the backup belt 6 located outside the drum 12 is on the outer wall surface of the drum 12. It is also similar to FIG. 3 that four idles 6a are arranged so that they can be pressed in a region of about a half turn.

Therefore, as described with reference to FIG. 3, when the drum 12 rotates while the hoop material 1 is set, the holes 12a of the drum 12 sequentially pass in front of the fixed nozzle 5, each of which is At the opening of the hole 12a, the circular plate 1a of the hoop material 1 which is curved in a spherical shape is exposed as shown in a partially enlarged view (1-1).

In particular, the ceiling wall 12 of the drum 12 in this case
On the upper surface of b, there are a plurality of locations (8 locations in the figure) corresponding to the holes 12a on the circumference centered on the rotation center of the drum 12.
An anode brush 14 that is engaged with a conductor shaft 13 that penetrates the ceiling wall 12b while maintaining insulation is provided on the drum 12 and
The upper end of the fixed shaft 16 penetrating the ceiling wall 12b of the drum 12 through the bearing 15 on the center line of rotation has an apex angle almost equal to that of the nozzle 5 described above and contacts the anode brush 14 around the circular portion. A fan-shaped anode contactor 17 of a possible size is fixed in alignment with the nozzle 5.

This means that only the anode brush 14 positioned in the ejection direction of the plating solution of the inner nozzles 5 of the plurality of anode brushes 14 arranged in a circular shape on the ceiling wall of the drum 12 comes into contact with the anode contactor 17. Means that.

Therefore, when the drum 12 is rotated,
The anode brush 14 that revolves together with the drum 12 comes into contact with the anode contactor 17 only during a time period in which the nozzle 5 is positioned in the jetting direction of the plating solution.

On the other hand, a cylindrical plating head 21 having a through hole 21a extending along the central axis is provided at a portion of each of the holes 12a on the inner surface of the drum 12 at a portion of a stay 22a extending in the diametrical direction. It is installed in.

Particularly, in this case, the plating head 21 is d ~
As shown in (1-2) in the d'section, the through hole 21a is formed at the center.
A main body 22 made of a chemical resistant resin having a cylindrical projection 22b on one surface of a disk portion having a hole for forming the above, and the stay 22a formed in the diameter direction of the disk portion, and the main body 22 described above. Circles made of silicon rubber attached to the other surface side of the main body 21 with pipe-shaped anodes 23a, 23b mounted on the inner and outer circumferences of the cylindrical protrusion 22b and a hole forming the through hole 21a at the center. It is composed of a plate-shaped head pressing plate 24.

The end face of the plating head 21 on the side where the anodes 23a, 23b are mounted is formed so that its periphery and the periphery of the through hole 21a have chamfered slopes, for example. Further, the outer diameter of the head pressing plate 24 is formed to a size excluding the area B of the circular plate 1a described in FIG. 2, and the end surface of the head pressing plate 24 has the plating head 21 and the inner wall surface of the drum 12. The concave surface of the circular plate 1a of the hoop material 1 located on the outer wall surface of the drum 12 is set to a position where it can be slightly pressed when set at a predetermined position.

In this case, the anodes 23a and 23b are connected to the same potential by the lead wire 25 made of platinum, and then connected to the anode brush 14 via the corresponding conductor shaft 13. ..

Therefore, the plating head 21 is mounted at a predetermined position on the inner wall surface of the drum 12 as shown by the arrow e, and the anodes 23a and 23b are mounted.
Is connected to the anode brush 14 via the conductor shaft 13, the plating head 21 is attached to the anode 20 as shown by an arrow d, and a gap between the corresponding conductor shaft 13 of the anode brush 14 is indicated by a broken line. As shown in the drawing, connecting with the lead wire 22 makes it possible to configure the required plating apparatus 11.

In the partial plating device 11 having such a configuration,
The nozzle 5 is moved while the hoop material 1 is moved by the method described with reference to FIG.
By ejecting a plating solution 4 such as a cyan-gold solution from the anode electrodes 23a, 23 disposed on the plating head 21.
The circular plate 1a of the hoop material 1 can be plated by the potential difference between b and the hoop material 1.
The plating surface of 1a is pressed by the plating head 21 except for the plating required area, so that the plating solution 4 does not come into contact, and as a result, plating can be performed by limiting only the plating required area. The device can be realized.

In the above embodiment, since the object to be plated is a circular plate and the required plating area is the central portion and the peripheral portion, a cylindrical plating head having a through hole in the central portion is used. When plating is applied to a plurality of scattered spots, it is possible to replace the cylindrical plating head with a plating head having a similar configuration to the one described above that has through-holes at positions corresponding to the required plating positions. ..

[0039]

As described above, according to the present invention, it is possible to provide the partial plating method and the apparatus for improving the productivity by partially plating only the required region of the hoop material.

[Brief description of drawings]

FIG. 1 is a diagram illustrating an example of a partial plating method and a plating apparatus therefor according to the present invention.

FIG. 2 is a diagram showing an area required for a plating process of an object to be plated.

FIG. 3 is a conceptual diagram illustrating a conventional plating apparatus and partial plating method.

FIG. 4 is a diagram illustrating a problem.

[Explanation of symbols]

1 hoop material 1a circular plate 1d guide hole 3a rubber mask 4 plating solution 5 nozzle 6 backup belt 6a idler 11 partial plating device 12 rotating drum 12a hole 12b ceiling wall 13 conductor shaft 14 anode brush 16 fixed shaft 17 anode contact 21 plating head 21a Through hole 22 Body 22a Stay 22b Cylindrical protrusion 23a, 23b Anode electrode 24 Head pressing plate 25 Lead wire

Claims (2)

[Claims] 1. The holes (12) formed in the peripheral wall at equal pitches.
A fixed nozzle (5) located inside the rotating drum (12) having a) ejects a plating solution (4) having an anodic potential toward the hole area, and the outer surface of the peripheral wall of the rotating drum (12) is ejected. Hoop material that moves in close contact with part of the rotating drum (12)
(1) is a partial plating method for performing a required plating treatment on a predetermined region of the object to be plated (1a) located in the hole of the plurality of objects to be plated (1a) formed in line At the position corresponding to each of the holes (12a) on the inner surface of the peripheral wall of the rotating drum (12), the object to be plated (1a) exposed in the hole (12a) is pressed only in an area excluding the required plating area. A plating head (21) having a means (24) for covering is arranged, and the anode electrodes (23a, 23b) provided on the wall surface forming a non-pressing area of the plating head (21) against the object to be plated (1a). ) To the above hoop material
A partial plating method characterized in that a plating solution (4) is ejected from a nozzle (5) while an anode potential is applied to (1) to perform a plating treatment. 2. The holes (12) formed in the peripheral wall at equal pitches.
A fixed nozzle (5) located inside the rotating drum (12) having a) ejects a plating solution (4) having an anodic potential toward the hole area, and the outer surface of the peripheral wall of the rotating drum (12) is ejected. Hoop material that moves in close contact with part of the rotating drum (12)
A partial plating apparatus for performing a required plating process on a predetermined region of the object to be plated (1a) located in the hole of the plurality of objects to be plated (1a) formed in line with (1). The rotary drum (12) covers the inner surface of the peripheral wall by pressing the object to be plated (1a) exposed in the hole (12a) at a position corresponding to each hole (12a) only in the area excluding the required plating area. Means to do (24)
The plating head (21) provided with, and the hoop material (1) on the anode electrodes (23a, 23b) provided on the wall surface of the plating head (21) that forms a non-pressing region for the object to be plated (1a). )
A partial plating apparatus characterized in that it is provided with means (14, 17) for applying an anode potential to the.