JPH05132795A - Partial plating apparatus - Google Patents

Partial plating apparatus

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Publication number
JPH05132795A
JPH05132795A JP3296136A JP29613691A JPH05132795A JP H05132795 A JPH05132795 A JP H05132795A JP 3296136 A JP3296136 A JP 3296136A JP 29613691 A JP29613691 A JP 29613691A JP H05132795 A JPH05132795 A JP H05132795A
Authority
JP
Japan
Prior art keywords
plating
head
recess
net
partial
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3296136A
Other languages
Japanese (ja)
Other versions
JP3067341B2 (en
Inventor
Yoshinobu Miyanoo
善信 宮ノ尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP3296136A priority Critical patent/JP3067341B2/en
Publication of JPH05132795A publication Critical patent/JPH05132795A/en
Application granted granted Critical
Publication of JP3067341B2 publication Critical patent/JP3067341B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To efficiently applying partial plating with uniform thickness to an area requiring plating at low cost and to improve the productivity, as for a partial plating apparatus of a pinch brush system. CONSTITUTION:The plating head part 6 of a partial plating apparatus, in which prescribed plating treatment is executed to an area requiring plating in the member to be plated formed on a hoop material in such a manner that the above hoop material is moved in a state in which it is brought into contact with a net wetted by a plating liq. discharged from a fixed nozzle, is constituted of a plating head 61 having a recessed part 61b connected to a nozzle 61c, a porous elastic sheet 62 fitted to the recessed part 61b and plural plating nozzles 63 formed by individually rolling and coating plural anode rays 63b diverged parallel from an anode 63a from the free edge to a length at which they can be inserted into the recessed part 61b with the net 63c. The plural plating nozzles 63 are disposed in such a manner that they are brought into contact with the surface of the porous elastic sheet 62 fitted to the recessed part 61b of the plating head 61.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はフープ材に形成された被
メッキ部材に部分メッキ処理を施すピンチブラシ方式の
部分メッキ装置の構成に係り,特にメッキ所要域に均一
厚さの部分メッキ処理を効率よく且つ安価に施すことで
生産性の向上を図った部分メッキ装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pinch brush type partial plating apparatus for performing partial plating processing on a member to be plated formed on a hoop material, and particularly to a partial plating processing of uniform thickness in a required plating area. The present invention relates to a partial plating device that improves productivity by applying it efficiently and inexpensively.

【0002】例えばコネクタ端子のような舌片状の接続
端子の製造プロセスでは、帯状フープ材に櫛刃状に連続
して形成した接続端子母材の所要領域に接続特性を向上
させるための電極皮膜を連続した部分メッキ処理方法で
形成する手段が多用されている。
In the process of manufacturing a tongue-shaped connection terminal such as a connector terminal, for example, an electrode film for improving connection characteristics in a required region of a connection terminal base material formed continuously on a strip-shaped hoop material in a comb blade shape. The means for forming a continuous partial plating method is often used.

【0003】かかる部分メッキ処理を施す手段には種々
の方式が実用化されているがその内の一手段に、電位を
持つメッキ液で濡らされたネットに被メッキ部材を接触
させながら移動して該メッキ部材に連続して所要のメッ
キ処理を施す方式(ピンチブラシ方式)がある。
Various methods have been put into practical use as means for performing such partial plating treatment, and one of them has been moved by contacting a member to be plated with a net moistened with a plating solution having a potential. There is a system (pinch brush system) in which a required plating treatment is continuously applied to the plated member.

【0004】[0004]

【従来の技術】図では一例として被メッキ部材がフープ
材に櫛刃状に連続形成されたコネクタ端子であり、その
自由端側の一部に金(Au)メッキ処理を施す場合について
説明する。
2. Description of the Related Art In the drawings, as an example, a case where a member to be plated is a connector terminal continuously formed in a comb shape like a hoop material, and a part of its free end side is plated with gold (Au) will be described.

【0005】図2は被メッキ部材のメッキ所要域を示す
図であり、図3は従来の部分メッキ装置とそのメッキ方
法を説明する概念図、図4は問題点を説明する図であ
る。図2で、フープ材1には連結部1′で繋がり片面側
に彎曲して突出する櫛刃状の端子部材1aが一定したピッ
チ間隔pで例えば連続プレス機械等で打抜き形成されて
いる。
FIG. 2 is a diagram showing a required plating area of a member to be plated, FIG. 3 is a conceptual diagram for explaining a conventional partial plating apparatus and its plating method, and FIG. 4 is a diagram for explaining problems. In FIG. 2, a comb blade-shaped terminal member 1a, which is connected to the hoop material 1 by a connecting portion 1'and is bent and protrudes to one side, is punched and formed at a constant pitch interval p by, for example, a continuous press machine.

【0006】そして彎曲外面側の図示斜線域Aが所要の
金(Au)メッキ域を表わしている。かかるフープ材1の端
子部材1aにメッキ処理を施す装置とメッキ方法を示す図
3で、(3-1) は装置主要部としてのメッキヘッド部を示
す斜視外観図,(3-2) は該メッキヘッド部を矢視B方向
から見た断面図,(3-3) はメッキ時の状態を示す図であ
る。
A shaded area A on the curved outer surface side represents a required gold (Au) plating area. FIG. 3 shows an apparatus and a plating method for applying a plating treatment to the terminal member 1a of the hoop material 1, (3-1) is a perspective external view showing a plating head portion as a main part of the apparatus, and (3-2) is a perspective view thereof. FIG. 3C is a sectional view of the plating head section viewed from the direction of arrow B, and (3-3) is a view showing a state during plating.

【0007】図の(3-1),(3-2) で部分メッキ装置の本発
明に関与するメッキヘッド部2は、上面の長手方向に直
交する幅方向が図2で説明した端子部材1aのメッキ所要
面側の彎曲度に合わせた凹の彎曲面21aに形成され且つ
該幅方向中心線上にメッキ液吐出用のスリット状ノズル
21b が形成されているメッキヘッド21と、該メッキヘッ
ド21内部に形成されている空間部21′の上記ノズル21b
の近傍に長手方向に沿って配設した白金(Pt)棒等からな
る陽極22、および上記メッキヘッド21の彎曲面21a を含
む外面をカバーするように該メッキヘッド21に添着した
サラン樹脂繊維からなる織布状のサランネット23とで構
成されている。
In (3-1) and (3-2) of the figure, in the plating head section 2 of the partial plating apparatus relating to the present invention, the width direction orthogonal to the longitudinal direction of the upper surface is the terminal member 1a explained in FIG. Of the slit-shaped nozzle for discharging the plating liquid on the center line in the width direction, which is formed on the concave curved surface 21a according to the curvature of the required plating surface side.
21b, and the nozzle 21b of the space 21 'formed inside the plating head 21.
From the Saran resin fiber attached to the plating head 21 so as to cover the anode 22 made of a platinum (Pt) rod or the like arranged along the longitudinal direction in the vicinity of and the outer surface including the curved surface 21a of the plating head 21. And a saran net 23 in the form of a woven fabric.

【0008】この場合、メッキヘッド21の上記空間部2
1′に図示されないメッキ液供給部から矢印Cのように
例えばシアン金溶液の如きメッキ液3を注入すると上記
陽極22を巻き込んだ状態の該メッキ液3がスリット状の
上記ノズル21b から吐出するが、該メッキヘッド21のノ
ズル21b の上方は耐薬品性のある上記サランネット23で
覆われている。
In this case, the space 2 of the plating head 21
When a plating solution 3 such as a cyan-gold solution is injected as shown by an arrow C from a plating solution supply unit (not shown) at 1 ', the plating solution 3 with the anode 22 wound therein is discharged from the slit-shaped nozzle 21b. The upper part of the nozzle 21b of the plating head 21 is covered with the above-mentioned saran net 23 having chemical resistance.

【0009】従って該ノズル21b から吐出した上記メッ
キ液3はサランネット23を濡らしながら該サランネット
23を伝わって該メッキヘッド21の両側面から流下する。
一方、フープ材1をその端子部材1aが上記メッキヘッド
21の彎曲面21a と一致するように該メッキヘッド21にセ
ッティングすると(3-3) に示す如く該端子部材1aがサラ
ンネット23を介した状態で該メッキヘッド21にセットさ
れるが、該サランネット23は上述した如くメッキ液3で
濡らされている。
Therefore, the plating liquid 3 discharged from the nozzle 21b wets the saran net 23 while the saran net 23 is being wetted.
It flows down 23 and flows down from both sides of the plating head 21.
On the other hand, the hoop material 1 has its terminal member 1a as the plating head.
When the plating head 21 is set so as to match the curved surface 21a of 21, the terminal member 1a is set on the plating head 21 via the salan net 23 as shown in (3-3). The net 23 is wet with the plating solution 3 as described above.

【0010】従って、上記陽極22に図示されない制御部
から数V程度の電位を付与した状態で接地電位にある上
記フープ材1を図示されない移動機構部によってその長
手方向“(3-3) では紙面厚さ方向”に移動させること
で、該フープ材1とメッキ液3との間の電位差によって
端子部材1aのメッキ所要域すなわち図2で説明したA領
域に所要の金メッキ処理を施すことができる。
Therefore, the hoop material 1 at ground potential is applied to the anode 22 by a moving mechanism (not shown) in the longitudinal direction "(3-3)" while a potential of about several V is applied from a controller (not shown). By moving in the thickness direction ", the required gold plating treatment can be performed on the required plating area of the terminal member 1a, that is, the area A described in FIG. 2, due to the potential difference between the hoop material 1 and the plating solution 3.

【0011】なお、上記端子部材1aの根本側すなわち連
結部1′側に配置されているローラ4は櫛刃状の各端子
部材1aの彎曲したメッキ所要域Aをメッキヘッド21の上
記彎曲面21a に一定した圧力で押圧するためのものであ
り、該フープ材1の長手方向への移動に伴って自在に回
転し得るように構成されている。
The roller 4 arranged at the base side of the terminal member 1a, that is, on the side of the connecting portion 1 ', has the curved surface 21a of the plating head 21 in the curved plating required area A of each comb-shaped terminal member 1a. It is for pressing with a constant pressure, and is configured to be freely rotatable with the movement of the hoop material 1 in the longitudinal direction.

【0012】従って櫛刃状に形成されている複数の端子
部材1aに曲がりや倒れ等が生じている場合でも各端子部
材1aのメッキ所要域を上記ネット23を介して上記彎曲面
21aに密着させることができて効率的なメッキ処理作業
を実現することができる。
Therefore, even when the plurality of comb-shaped terminal members 1a are bent or tilted, the required plating area of each terminal member 1a is curved through the net 23 to the curved surface.
21a can be brought into close contact and efficient plating processing work can be realized.

【0013】[0013]

【発明が解決しようとする課題】しかしかかる構成にな
る部分メッキ装置では、陽極に近い1箇所のノズル21b
から吐出するメッキ液3でサランネット23を濡らすこと
で端子部材1aのメッキ所要域Aに該メッキ液3を供給す
るようにしている。
However, in the partial plating apparatus having such a configuration, the nozzle 21b at one location near the anode is provided.
The salan net 23 is wetted with the plating liquid 3 discharged from the above to supply the plating liquid 3 to the required plating area A of the terminal member 1a.

【0014】このことは、ノズル21b から離れるにつれ
てメッキ液3の供給量が低下すると同時に陽極からの隔
たりが大きくなることからサランネット23の濡れ度合い
が低下し且つ電流密度が低くなることを意味しており、
図4の(イ)で示す如く端子部材1aのメッキ所要域A内
ではaのように上記ノズル21b に近い中心部程メッキ厚
さが厚くなる。
This means that as the distance from the nozzle 21b increases, the supply amount of the plating solution 3 decreases, and at the same time, the distance from the anode increases, so that the wetting degree of the saran net 23 decreases and the current density decreases. And
As shown in FIG. 4A, in the required plating area A of the terminal member 1a, the plating thickness becomes thicker in the central portion closer to the nozzle 21b as indicated by a.

【0015】またメッキヘッド21の上面は上述した如く
凹の彎曲面21a に形成されているが、このことは該彎曲
面21a にメッキ液3が溜まり易いことを示している。従
って、隣接する端子部材1a間の隙間から該端子部材1aの
裏面側に回り込んだメッキ液3によって図4の(ロ)に
示すbのようにメッキ不要域である端子部材1aの裏面側
にもメッキされることになる。
The upper surface of the plating head 21 is formed into the concave curved surface 21a as described above, which means that the plating solution 3 is likely to collect on the curved surface 21a. Therefore, as shown by b in FIG. 4 (b), the plating liquid 3 that has flowed from the gap between the adjacent terminal members 1a to the back surface side of the terminal member 1a is applied to the back surface side of the terminal member 1a which is a plating unnecessary area. Will also be plated.

【0016】更に、該メッキヘッド21の上記凹の彎曲面
21a は対象とする被メッキ部材のメッキ所要域に合わせ
て形成する必要がある。従って結果的に、メッキ所要域
全面に均等厚さのメッキ処理を施すことができないと言
う問題があり、またメッキ不要域までメッキ処理される
ことがあったり対象とするメッキ部材に合わせてメッキ
ヘッドを準備する必要がある等のために生産性の向上を
期待することができないと言う問題があった。
Further, the concave curved surface of the plating head 21.
21a must be formed according to the required plating area of the target plated member. Therefore, as a result, there is a problem that it is not possible to perform a plating treatment with a uniform thickness over the entire required plating area. In addition, a plating treatment may be performed up to the unnecessary plating area, or the plating head may be adjusted according to the target plating member. There was a problem that productivity could not be expected to improve due to the need to prepare.

【0017】[0017]

【課題を解決するための手段】上記課題は、フープ材に
櫛刃状に形成された被メッキ部材の片面メッキ所要域
を、固定されたメッキヘッド部の該フープ材長手方向に
沿うスリット状ノズルから吐出する該フープ材より高い
電位を持つメッキ液で濡らされたネットに接触させた状
態で、該フープ材の長手方向に移動させて上記メッキ所
要域に所定のメッキ処理を施す部分メッキ装置であっ
て、被メッキ部材のメッキ所要域と接触するメッキヘッ
ド部が、上面に所定高さの周壁を持つ凹部が形成され且
つ該凹部の上記長手方向に沿う中心線上にスリット状の
ノズルが形成されているメッキヘッドと、該メッキヘッ
ドの上記凹部に嵌入装着される周壁高さより低い厚さの
多孔質弾性板、および制御部に繋がる陽極から上記凹部
のノズルと直交する幅の範囲内でノズルと平行する方向
に平行して分岐させた複数の陽極線をその自由端から上
記凹部に嵌入し得る長さまでをネットで個々に巻成被覆
して形成した複数のメッキノズルとで構成され、該複数
のメッキノズルが、メッキヘッドの上記凹部に位置する
多孔質弾性板の表面に接触するように配設されて構成さ
れている部分メッキ装置によって達成される。
SUMMARY OF THE INVENTION The above object is to provide a slit-shaped nozzle along a longitudinal direction of the hoop material of a fixed plating head in a required area on one side of a member to be plated formed in a comb shape on the hoop material. In a partial plating device that moves in the longitudinal direction of the hoop material while in contact with a net moistened with a plating solution having a higher potential than the hoop material discharged from The plating head portion, which is in contact with the required plating area of the member to be plated, has a concave portion having a peripheral wall of a predetermined height formed on the upper surface, and a slit-shaped nozzle is formed on the center line of the concave portion along the longitudinal direction. Plating head, a porous elastic plate having a thickness lower than the height of the peripheral wall to be fitted and mounted in the recess of the plating head, and a width of the anode connected to the control unit and orthogonal to the nozzle of the recess. With a plurality of plating nozzles formed by individually winding-coating a plurality of anode wires branched in a direction parallel to the nozzle within the range from the free end to a length that can be fitted in the recess with a net. This is achieved by a partial plating apparatus configured so that the plurality of plating nozzles are arranged so as to contact the surface of the porous elastic plate located in the recess of the plating head.

【0018】[0018]

【作用】メッキヘッドの上面に位置する彎曲面が被メッ
キ部材のメッキ所要域の彎曲度に倣って変位し得るよう
に該メッキヘッドを構成すると共に陽極を面積的に拡げ
て配置すると、図4で説明したメッキ所要域内における
メッキ厚さのバラツキとメッキ不要域へのメッキ付着を
共に抑制することができると共に対象とする被メッキ部
材毎にメッキヘッドを代える煩わしさをなくすことがで
きる。
When the plating head is constructed so that the curved surface located on the upper surface of the plating head can be displaced in accordance with the curvature of the required plating area of the member to be plated and the anode is arranged in a wide area, It is possible to suppress both the variation in the plating thickness within the required plating area and the adhesion of the plating to the unnecessary plating area described above, and to eliminate the trouble of changing the plating head for each target member to be plated.

【0019】そこで本発明では、周壁で囲まれたノズル
開口部に多孔質弾性板を装着した後該弾性板表面のフー
プ材移動方向と沿う方向に図3で説明したサランネット
で被覆され且つ一端を自由端とする複数の陽極線を平行
配置して構成したメッキヘッド部を従来のメッキヘッド
部に代えて部分メッキ装置を構成している。
Therefore, in the present invention, after the porous elastic plate is attached to the nozzle opening surrounded by the peripheral wall, the surface of the elastic plate is covered with the saran net explained in FIG. The partial plating apparatus is configured by replacing the conventional plating head section with the plating head section configured by arranging a plurality of anode wires having free ends in parallel.

【0020】この場合には、ノズルから吐出するメッキ
液は多孔質弾性板で拡散された状態で複数の陽極線を被
覆している各サランネットを濡らしながら上記周壁上辺
から流出することになるが、サランネットで被覆された
陽極線はその一端が自由端になっているため多孔質弾性
板を押圧しながら該サランネット上に接触する被メッキ
部材の形状に倣って変位し得ることとなる。
In this case, the plating solution discharged from the nozzle flows out from the upper side of the peripheral wall while wetting the saran nets covering the plurality of anode wires while being diffused by the porous elastic plate. Since the one end of the anode wire covered with the saran net is a free end, the anode wire can be displaced while pressing the porous elastic plate, following the shape of the member to be plated in contact with the saran net.

【0021】更に、平行配置した複数の陽極線は面積的
な拡がりを持つ陽極を形成すると共に該各陽極線とメッ
キ部材との間の隔たりを常時一定にすることができる。
従って、メッキ所要域全面に均等厚さのメッキ処理を施
すことができると共にメッキ部材裏面側へのメッキ処理
の抑制とメッキヘッドの汎用化による生産性の向上を実
現することができる。
Further, a plurality of anode wires arranged in parallel can form an anode having an area spread, and the distance between each anode wire and the plating member can be made constant at all times.
Therefore, it is possible to perform the plating process with a uniform thickness over the entire required plating area, and to suppress the plating process on the back side of the plating member and improve the productivity by generalizing the plating head.

【0022】[0022]

【実施例】図1は本発明になる部分メッキ装置構成例を
説明する図であり、(1-1) はメッキヘッド部を示す斜視
外観図,(1-2) は該メッキヘッド部を矢視B方向から見
た断面図,(1-3) はメッキ時の状態を示している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a diagram for explaining a configuration example of a partial plating apparatus according to the present invention, (1-1) is a perspective external view showing a plating head portion, and (1-2) is an arrow showing the plating head portion. A cross-sectional view seen from the direction B, (1-3) shows the state during plating.

【0023】なお図では図2で説明した端子部材1aを被
メッキ部材としているので、図2および図3と同じ対象
部材には同一の記号を付して表わしている。図の(1-1),
(1-2) で部分メッキ装置5の本発明に関与するメッキヘ
ッド部6は、上面に周壁61a を持つ凹部61b が形成され
且つ該凹部61b の長手方向中心線上にスリット状のノズ
ル61cが形成されているメッキヘッド61と、該メッキヘ
ッド61の凹部61b に嵌め込まれて装着されているスポン
ジゴム板62、および図示されない制御部に繋がる陽極63
a から上記凹部61b の幅の範囲内で平行するように分岐
した複数個(図では5個)の陽極線63b の自由端から上
記凹部61b の長さの範囲内を図3で説明したサランネッ
ト63c で個々に巻成被覆して構成した複数のメッキノズ
ル63とで構成されている。
Since the terminal member 1a described in FIG. 2 is the member to be plated in the drawing, the same reference numerals are given to the same target members as in FIGS. 2 and 3. (1-1) in the figure,
In (1-2), the plating head portion 6 of the partial plating apparatus 5 relating to the present invention is provided with a recess 61b having a peripheral wall 61a on the upper surface and a slit-shaped nozzle 61c formed on the longitudinal centerline of the recess 61b. A plating head 61, a sponge rubber plate 62 fitted and mounted in the recess 61b of the plating head 61, and an anode 63 connected to a control unit (not shown).
The saran net described in FIG. 3 is from the free end of a plurality of anode wires 63b branched in parallel to each other within the width of the recess 61b (five in the figure) to the recess 61b. 63c and a plurality of plating nozzles 63 formed by individually winding coating.

【0024】なお上記陽極63a から陽極線63b に分岐す
る領域は絶縁物からなるカバー63dで覆われて被メッキ
部材が陽極線63b と接触しないように構成されている。
そして、メッキヘッド61の周壁61a の上面 61a′は該各
メッキノズル63を上記スポンジゴム板62上に載置したと
きの陽極線63b より僅かに高い位置に設定されており、
各メッキノズル63の外径最上位線を結ぶ面は上記周壁61
a の上面 61a′より高い位置に位置するようになってい
る。
The region branched from the anode 63a to the anode wire 63b is covered with a cover 63d made of an insulating material so that the member to be plated does not come into contact with the anode wire 63b.
The upper surface 61a 'of the peripheral wall 61a of the plating head 61 is set at a position slightly higher than the anode wire 63b when the plating nozzles 63 are placed on the sponge rubber plate 62,
The surface connecting the outermost diameter lines of the plating nozzles 63 is the peripheral wall 61 described above.
It is located higher than the upper surface 61a 'of a.

【0025】なおメッキヘッド61の凹部61b に嵌め込ま
れたスポンジゴム板62の上面と接触するように上記複数
のメッキノズル63をそれぞれの自由端と共に載置すると
(1-1) で示す状態となるが、この場合の各メッキノズル
63はそれぞれの中心部に埋設されている陽極線63b の一
端でのみ陽極63a と繋がっているので上方からの押圧で
個々別々にスポンジゴム板62の上面を押下して降下し得
ることになる。
When the plurality of plating nozzles 63 are placed together with their respective free ends so as to come into contact with the upper surface of the sponge rubber plate 62 fitted in the recess 61b of the plating head 61.
It will be in the state shown in (1-1), but each plating nozzle in this case
Since 63 is connected to the anode 63a only at one end of the anode wire 63b buried in each central portion, the upper surface of the sponge rubber plate 62 can be pressed down individually by pressing from above.

【0026】そこで、メッキヘッド61のノズル61c の下
部に設けられている空間部 61c′に図3同様に図示され
ないメッキ液供給部から矢印Cのようにシアン金溶液の
如きメッキ液3を注入すると、ノズル61c から吐出する
該メッキ液3が上記スポンジゴム板62に矢印Dのように
拡散して吸収された後該メッキヘッド61の周壁61a の上
面 61a′から流出するが、同時にサランネット63c で被
覆された各メッキノズル63も陽極線63b と共に該メッキ
液3で濡らされることとなる。
Therefore, when a plating solution 3 such as a cyan gold solution is injected as shown by an arrow C into a space 61c 'provided under the nozzle 61c of the plating head 61 from a plating solution supply unit (not shown) as in FIG. The plating liquid 3 discharged from the nozzle 61c is diffused and absorbed by the sponge rubber plate 62 as shown by an arrow D, and then flows out from the upper surface 61a 'of the peripheral wall 61a of the plating head 61. Each of the coated plating nozzles 63 is also wetted with the plating solution 3 together with the anode wire 63b.

【0027】ここで前記フープ材1を各端子部材1aと共
に各メッキノズル63の上面に押圧すると、(1-3) で示す
如く複数の各メッキノズル63が端子部材1aの彎曲度に追
従してスポンジゴム板62を押下しながら変位するが、隣
接する該各ノズル63の間の空間領域Eはメッキ液溜まり
としてメッキ液3が充満しているので該端子部材1aのメ
ッキ所要面全面がメッキ液で覆われると同時にが該端子
部材1aの裏面側へのメッキ液の回り込みは抑制されるの
で該裏面側がメッキ液で覆われることがない。
When the hoop material 1 is pressed against the upper surface of each plating nozzle 63 together with each terminal member 1a, the plural plating nozzles 63 follow the curvature of the terminal member 1a as shown in (1-3). Although the sponge rubber plate 62 is displaced while being pushed down, the space E between the adjacent nozzles 63 is filled with the plating solution 3 as a pool of the plating solution, so that the entire surface of the terminal member 1a required for plating is plated. At the same time as it is covered with, the wraparound of the plating solution to the back surface side of the terminal member 1a is suppressed, so that the back surface side is not covered with the plating solution.

【0028】従って、上記各陽極線63b に図示されない
制御部から陽極63a を介して数V程度の電位を付与した
後、接地電位にある前記フープ材1を(1-3) のように各
メッキノズル63の上面に押圧した状態で図示されない移
動機構部によってその長手方向すなわち(1-3) では紙面
厚さ方向に移動させることで、該フープ材1ひいては端
子部材1aとメッキ液3との間の電位差によって該端子部
材1aのメッキ所要域(図2のA領域)にのみ所要の金メ
ッキ処理を施すことができる。
Therefore, after a potential of about several V is applied to each anode wire 63b from a control unit (not shown) through the anode 63a, the hoop material 1 at ground potential is plated as shown in (1-3). By moving it in the longitudinal direction, that is, in the thickness direction of the paper in (1-3) by a moving mechanism part (not shown) while pressing it against the upper surface of the nozzle 63, the hoop material 1 and hence the terminal member 1a and the plating solution 3 are moved. The required gold plating treatment can be applied only to the required plating area (area A in FIG. 2) of the terminal member 1a due to the potential difference.

【0029】なお上記端子部材1aの根本側に配置されて
いるローラ4は図3で説明したものである。かかる構成
になるメッキヘッド部6を具えた部分メッキ装置5で
は、複数のメッキノズル63がメッキ部材の彎曲度に倣っ
て変位するため如何なる彎曲度を持つ被メッキ部材に対
しても適用し得ると共に、メッキ部材に近接して位置す
る陽極線が面積的な拡がりをもって配置されているため
均一した厚さのメッキ処理が所要域のみに施せる部分メ
ッキ装置を容易に実現することができる。
The roller 4 arranged on the base side of the terminal member 1a is the one described with reference to FIG. In the partial plating apparatus 5 having the plating head portion 6 having such a configuration, since the plurality of plating nozzles 63 are displaced in accordance with the curvature of the plating member, it can be applied to a member to be plated having any curvature. Since the anode wire located close to the plating member is arranged with an area spread, it is possible to easily realize a partial plating apparatus capable of performing a plating treatment with a uniform thickness only in a required area.

【0030】[0030]

【発明の効果】上述の如く本発明により、メッキ所要域
に均一厚さの部分メッキ処理を効率よく且つ安価に施す
ことで生産性の向上を図った部分メッキ装置を提供する
ことができる。
As described above, according to the present invention, it is possible to provide a partial plating apparatus which improves the productivity by efficiently and inexpensively performing the partial plating treatment with a uniform thickness on the required plating area.

【0031】なお上記実施例ではフープ材に櫛刃状に彎
曲して形成されている端子母材の外面にメッキ処理を施
す場合を例としているが、彎曲した内面側にメッキ処理
を施す場合でもまたは直状端子母材の片面にメッキ処理
を施す場合でも同等の効果を得ることができる。
In the above embodiment, the case where the outer surface of the terminal base material, which is formed by bending the hoop material into a comb-like shape, is plated, is used as an example. However, even when the curved inner surface is plated. Alternatively, the same effect can be obtained even when one surface of the straight terminal base material is plated.

【0032】更にメッキ所要域内におけるメッキ厚さを
部分的に異ならせる場合には、上記メッキノズルの内の
対応するメッキノズルの陽極線を含めた長さを異ならせ
ることで容易に実現できるメリットもある。
Further, in the case where the plating thickness in the required plating area is partially different, there is also an advantage that it can be easily realized by changing the length of the corresponding plating nozzle including the anode wire of the corresponding plating nozzle. is there.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明になる部分メッキ装置構成例を説明す
る図。
FIG. 1 is a diagram illustrating a configuration example of a partial plating apparatus according to the present invention.

【図2】 被メッキ部材のメッキ所要域を示す図。FIG. 2 is a diagram showing a required plating area of a member to be plated.

【図3】 従来の部分メッキ装置とそのメッキ方法を説
明する概念図。
FIG. 3 is a conceptual diagram illustrating a conventional partial plating apparatus and a plating method therefor.

【図4】 問題点を説明する図。FIG. 4 is a diagram illustrating a problem.

【符号の説明】[Explanation of symbols]

1 フープ材 1a 被メッキ
部材(端子部材) 3 メッキ液 4 ローラ 5 部分メッキ装置 6 メッキヘッド部 61 メッキヘッド 61a周壁 61a′ 上面 61b 凹部 61c ノズル 61c′ 空間部 62 多孔質弾性板(スポンジゴム板) 63 メッキノズル 63a 陽極 63b 陽極線 63c ネット
(サランネット) 63d カバー
1 Hoop material 1a Plated member (terminal member) 3 Plating liquid 4 Roller 5 Partial plating device 6 Plating head 61 Plating head 61a Peripheral wall 61a 'Upper surface 61b Recess 61c Nozzle 61c' Space 62 Porous elastic plate (sponge rubber plate) 63 Plating nozzle 63a Anode 63b Anode wire 63c Net (Saran net) 63d Cover

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 フープ材に櫛刃状に形成された被メッキ
部材の片面メッキ所要域を、固定されたメッキヘッド部
の該フープ材長手方向に沿うスリット状ノズルから吐出
する該フープ材より高い電位を持つメッキ液で濡らされ
たネットに接触させた状態で、該フープ材の長手方向に
移動させて上記メッキ所要域に所定のメッキ処理を施す
部分メッキ装置であって、 被メッキ部材(1a)のメッキ所要域と接触するメッキヘッ
ド部(6) が、上面に所定高さの周壁(61a) を持つ凹部(6
1b) が形成され且つ該凹部(61a) の上記長手方向に沿う
中心線上にスリット状のノズル(61c) が形成されている
メッキヘッド(61)と、該メッキヘッド(61)の上記凹部(6
1b) に嵌入装着される周壁高さより低い厚さの多孔質弾
性板(62)、および制御部に繋がる陽極(63a) から上記凹
部(61b)のノズル(61c) と直交する幅の範囲内でノズル
(61c) と平行する方向に平行して分岐させた複数の陽極
線(63b) をその自由端から上記凹部(61b) に嵌入し得る
長さまでをネット(63c) で個々に巻成被覆して形成した
複数のメッキノズル(63)とで構成され、 該複数のメッキノズル(63)が、メッキヘッド(61)の上記
凹部(61b) に位置する多孔質弾性板(62)の表面に接触す
るように配設されて構成されていることを特徴とした部
分メッキ装置。
1. A required area for one-sided plating of a member to be plated formed in a comb shape on the hoop material is higher than the hoop material discharged from a slit-shaped nozzle of the fixed plating head portion along the longitudinal direction of the hoop material. A partial plating apparatus for performing a predetermined plating treatment on the required plating area by moving the hoop material in the longitudinal direction in a state of being in contact with a net wet with a plating liquid having an electric potential. ), The plating head part (6) that comes in contact with the required plating area has a recess (6) having a peripheral wall (61a) of a predetermined height on the upper surface.
1b) and a slit-shaped nozzle (61c) is formed on the center line of the recess (61a) along the longitudinal direction, and the recess (6) of the plating head (61).
Within the range of the width perpendicular to the nozzle (61c) of the recess (61b) from the porous elastic plate (62) having a thickness lower than the height of the peripheral wall to be fitted and mounted in 1b), and the anode (63a) connected to the control unit. nozzle
A plurality of anode wires (63b) branched parallel to the direction parallel to (61c) are individually wound and covered with a net (63c) from the free end to a length that allows them to fit in the recesses (61b). It is composed of a plurality of formed plating nozzles (63), and the plurality of plating nozzles (63) come into contact with the surface of the porous elastic plate (62) located in the recess (61b) of the plating head (61). A partial plating device characterized in that it is arranged as described above.
【請求項2】 請求項1記載のメッキヘッドの凹部に嵌
入装着される多孔質弾性板がスポンジゴム板で構成され
ていることを特徴とした部分メッキ装置。
2. A partial plating apparatus characterized in that the porous elastic plate fitted and mounted in the recess of the plating head according to claim 1 is made of a sponge rubber plate.
【請求項3】 請求項1記載の陽極線を巻成被覆するネ
ットが、サラン樹脂繊維からなる織布状のサランネット
であることを特徴とした部分メッキ装置。
3. A partial plating apparatus, wherein the net for winding-coating the anode wire according to claim 1 is a woven cloth-like saran net made of saran resin fiber.
JP3296136A 1991-11-13 1991-11-13 Partial plating equipment Expired - Fee Related JP3067341B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3296136A JP3067341B2 (en) 1991-11-13 1991-11-13 Partial plating equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3296136A JP3067341B2 (en) 1991-11-13 1991-11-13 Partial plating equipment

Publications (2)

Publication Number Publication Date
JPH05132795A true JPH05132795A (en) 1993-05-28
JP3067341B2 JP3067341B2 (en) 2000-07-17

Family

ID=17829621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3296136A Expired - Fee Related JP3067341B2 (en) 1991-11-13 1991-11-13 Partial plating equipment

Country Status (1)

Country Link
JP (1) JP3067341B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079242A (en) * 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd Partial plating method and apparatus therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009079242A (en) * 2007-09-25 2009-04-16 Panasonic Electric Works Co Ltd Partial plating method and apparatus therefor

Also Published As

Publication number Publication date
JP3067341B2 (en) 2000-07-17

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