JP2004315916A - Reel type electroplating equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide reel type electroplating equipment which easily supplies electricity even if one surface is coated with a masking material and performs plating at a low cost by recycling the masking material when performing one side plating by electroplating of a reel type. <P>SOLUTION: The reel type electroplating equipment is provided with power supply rolls 6 and 12 between a delivery machine 3 and a adhering roll 8 and/or between a stripping roll 20 and a winder 4, and the transport path of the masking material 2 is formed into a circulating looped transport path. A washing device 16 and a drying means 17 for the masking material are disposed between a first guide roll 14 and second guide roll 15 of the looped transport path. The equipment transports the looped masking material circularly to repetitively use the masking material. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an electrolytic plating apparatus, and more particularly to a reel-type electrolytic plating apparatus used for manufacturing a tape BGA for mounting chips.
[0002]
[Prior art]
Conventionally, in the production of a TAB tape, two-color plating is performed in which only the inner leads are masked and the outer leads are plated with electric solder (for example, see Patent Document 1). However, the masking material used for the two-color plating is one-time use which is discarded after plating.
[0003]
On the other hand, the tape base material of the tape BGA has been subjected to surface treatment on the primary mounting side and the secondary mounting side at the same time by electrolytic NiAu plating using a reel system. However, in the case of the tape BGA, a surface treatment suitable for each of the front and back surfaces of the tape base material is required, and a two-color plating process using a reel type electrolytic plating using a masking material is required.
However, the tape base material of the tape BGA has a problem in that power cannot be supplied to the tape base material when a masking material is attached to one surface thereof.
[0004]
FIG. 2 is an explanatory diagram showing a state when electrolytic plating is performed on the base material of the tape BGA. To apply electrolytic plating to the electrode pad 19 in the state as shown in FIG. 2, that is, by punching the insulating film tape 18, power must be supplied to the power supply lead 20.
However, since the masking material 21 is stuck on the power supply lead 20, power cannot be supplied as it is. Since the structure of the plating device that supplies power to the substrate in such a state becomes considerably complicated, it is extremely difficult to perform two-color plating using a reel type electrolytic plating with a composite material of an insulator and copper foil. It is something.
Incidentally, in the case of a metal coil material which can be supplied with power from the other surface even if one surface is covered with a masking material, two-color plating by reel-type electrolytic plating is widely performed.
[0005]
Therefore, in the composite material of the insulator and the copper foil, two-color plating by electroless plating is performed in a reel system.
FIGS. 3A to 3F are simple explanatory diagrams of a process of two-color plating by electroless plating. As shown in FIG. 3, first, one surface (the copper foil 22 surface) of the base material is coated with a liquid or film-like masking material 21, and the uncoated surface is subjected to a plating pretreatment. The electroless plating film (1) 23 is deposited, and then the masking material 21 is peeled off (FIGS. 3A to 3C).
The same method is repeated on the other surface to deposit an electroless plating film (2) 24 (FIGS. 3D to 3F).
[0006]
However, electroless plating is a plating method in which liquid management is more difficult and cost is higher than electrolytic plating.
Further, the masking material used in the current reel-type two-color plating by electroless plating is discarded after being peeled off, which increases the cost. Further, in the case of masking with a liquid resist, there is a problem that the number of steps increases in addition to the material cost, so that the cost is further increased.
[0007]
[Patent Document 1]
JP 2001-298058 A
[Problems to be solved by the invention]
The present invention has been made in view of such a problem, and the problem is that when one-side plating is performed by reel-type electrolytic plating, power is easily supplied even if one side is covered with a masking material. It is an object of the present invention to provide a reel-type electrolytic plating apparatus capable of performing plating at a low cost by reusing a masking material.
[0009]
[Means for Solving the Problems]
The present invention provides a reel-type electrolytic plating apparatus for applying a masking material to one surface of a tape substrate by applying pressure, applying electrolytic plating to the other surface, and then removing the masking material.
1) A power supply roll is provided between the feeding machine and the attaching roll, and / or between the peeling roll and the winding machine,
2) The transport path of the masking material is a loop-shaped transport path that circulates around a sticking roll, a plating device, a peeling roll, a first guide roll, and a second guide roll.
3) A cleaning device for the masking material and a drying device are provided between the first guide roll and the second guide roll in the loop-shaped transport path,
A reel-type electrolytic plating apparatus characterized in that a loop-shaped masking material is conveyed while being circulated in the loop-shaped conveyance path and repeatedly used.
[0010]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail.
FIG. 1 is a schematic view showing one embodiment of a reel-type electrolytic plating apparatus according to the present invention. As shown in FIG. 1, one embodiment of the reel-type electrolytic plating apparatus includes a feeder 3, power supply rolls 6, 7, 12, and 13, bonding rolls 8 and 9, a plating apparatus 5, and peeling rolls 10 and 11. It comprises a take-up machine 4, a first guide roll 14, a second guide roll 15, a cleaning device 16, and a drying device 17.
[0011]
The base material 1 wound on the feeder 3 is unwound in the traveling direction A, is supplied with power by passing through the feeding rolls 6 and 7, and passes through the attaching rolls 8 and 9, thereby plating the base material 1. The masking material 2 is stuck on the surface not to be processed.
The masking material 2 used here has a loop shape. The loop-shaped masking material 2 is, for example, formed by forming a silicone-based adhesive layer on one surface of a resin such as polyimide which is not affected by a plating solution. Adhesion does not decrease even when peeled. Therefore, the masking material can be repeatedly used, but the material, thickness, and the like used for the masking material can be arbitrarily selected, and the present invention is not limited thereto.
[0012]
Then, plating is performed on one side of the tape substrate 1 in the plating apparatus 5. At this time, power is supplied to the power supply rolls 12 and 13 in addition to the power supply rolls 6 and 7. After plating on one side of the tape substrate 1 in the plating apparatus 5, the masking material 2 is peeled by passing through the peeling rolls 10 and 11, and passes through the power supply rolls 12 and 13, and the tape substrate 1 is wound. It is wound by the take-up machine 4.
[0013]
The masking material 2 peeled from the tape substrate 1 by the peeling rolls 10 and 11 passes through the first guide roll 14 and is cleaned by the cleaning device 16. Then, the masking material 2 is dried by the drying device 17, passes through the second guide roll 15, and passes through the attaching rolls 8 and 9, so that the loop-shaped masking material 2 is attached again to the non-plated surface of the tape substrate 1. Can be B indicates the direction of travel of the masking material.
[0014]
Here, as the masking material cleaning device 16, for example, there is a brush cleaning device for removing foreign substances attached to the masking material by scanning the surface with a rotating brush in circulating water. The drying device 17 includes, for example, a hot-air drying device in which the temperature inside the drying device is kept constant at 50 ° C., and the washing water is blown at a wind speed that does not affect the damage of the masking material and the deflection of the conveyance path. However, the present invention is not limited by the selection of the cleaning method and the drying method.
[0015]
When the desired plating thickness on one side is very large, for example, a unit between the power supply 6, 7 and the power supply 12, 13 is set as one unit, and a plurality of these units are connected to be provided to obtain a desired plating thickness. Can be deposited.
Furthermore, one embodiment of the present invention shown in FIG. 1 is an electrolytic plating process on only one side, and when it is desired to perform continuous plating on both sides, the above unit is turned upside down in FIG. It is preferable that a device in which the first guide roll 14, the cleaning device 16, the drying device 17, and the second guide roll 15 are provided above the plating device 5 be connected and installed in front of the winding machine 4.
[0016]
Further, in the present invention, since the cleaning device and the drying device for the masking material 2 are provided, foreign matter is prevented from being mixed between the base material and the masking material, and the adhesion of the adhesive layer is not deteriorated. A decrease in yield can be prevented.
[0017]
【The invention's effect】
As described above, according to the present invention, since the transport path of the masking material is loop-shaped, the masking material can be used repeatedly, and the cost can be reduced. Further, since the cleaning device and the drying device for the masking material are provided, it is possible to prevent foreign substances from being mixed between the tape base material and the masking material, to prevent the adhesion from being deteriorated, and to prevent the yield from lowering. Further, since the power supply roll is provided in front of the plating apparatus, power can be supplied to the tape BGA. Therefore, two-color plating by reel-type electrolytic plating becomes possible, and a reel-type electrolytic plating apparatus capable of providing inexpensive electrolytic plating with a more stable film formation than electroless plating is provided.
[Brief description of the drawings]
FIG. 1 is a schematic view showing one embodiment of a reel-type electrolytic plating apparatus according to the present invention.
FIG. 2 is an explanatory view showing a state when electrolytic plating is performed on a base material of a tape BGA.
FIGS. 3A to 3F are simple explanatory diagrams of a process of two-color plating by electroless plating.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Tape base material 2 ... Masking material 3 ... Sending out machine 4 ... Winding machine 5 ... Plating apparatus 6, 7 ... Power supply roll 8 ... Pasting rolls 10, 11 ... Peeling rolls 12, 13 ... Power supply roll 14 ... First guide roll 15 ... Second guide roll 16 ... Cleaning device 17 ... Drying device 18 ... Insulating film Tape 19 Electrode pad 20 Power supply lead 21 Masking material 22 Copper foil 23 Electroless plating film (1)
24 ... Electroless plating film (2)
A: traveling direction of base material B: traveling direction of masking material

Claims (1)

After applying a masking material to one surface of the tape base material by pressure and applying electrolytic plating to the other surface, in a reel-type electrolytic plating apparatus for peeling off the masking material,
1) A power supply roll is provided between the feeding machine and the attaching roll, and / or between the peeling roll and the winding machine,
2) The transport path of the masking material is a loop-shaped transport path that circulates around a sticking roll, a plating device, a peeling roll, a first guide roll, and a second guide roll.
3) A cleaning device for the masking material and a drying device are provided between the first guide roll and the second guide roll in the loop-shaped transport path,
A reel-type electrolytic plating apparatus wherein a loop-shaped masking material is circulated and conveyed in the loop-shaped conveyance path, and is repeatedly used.

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