JP2011014753A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JP2011014753A JP2011014753A JP2009158360A JP2009158360A JP2011014753A JP 2011014753 A JP2011014753 A JP 2011014753A JP 2009158360 A JP2009158360 A JP 2009158360A JP 2009158360 A JP2009158360 A JP 2009158360A JP 2011014753 A JP2011014753 A JP 2011014753A
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- Prior art keywords
- fin
- mos transistor
- silicon
- insulating film
- silicon substrate
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- 239000004065 semiconductor Substances 0.000 title claims abstract 9
- 239000000758 substrate Substances 0.000 claims abstract description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 32
- 239000010703 silicon Substances 0.000 claims abstract description 32
- 239000003990 capacitor Substances 0.000 claims abstract description 31
- 239000002184 metal Substances 0.000 claims abstract description 16
- 229910052751 metal Inorganic materials 0.000 claims abstract description 16
- 239000012212 insulator Substances 0.000 claims description 5
- 229910044991 metal oxide Inorganic materials 0.000 abstract 1
- 150000004706 metal oxides Chemical class 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 47
- 239000010410 layer Substances 0.000 description 42
- 238000000034 method Methods 0.000 description 20
- 230000000694 effects Effects 0.000 description 11
- 230000008569 process Effects 0.000 description 11
- 239000012535 impurity Substances 0.000 description 10
- 238000002955 isolation Methods 0.000 description 10
- 238000009792 diffusion process Methods 0.000 description 7
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 240000004050 Pentaglottis sempervirens Species 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000005685 electric field effect Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 150000004767 nitrides Chemical class 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 238000004088 simulation Methods 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 125000001475 halogen functional group Chemical group 0.000 description 4
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000012369 In process control Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- -1 and at this time Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000010965 in-process control Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/417—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions carrying the current to be rectified, amplified or switched
- H01L29/41725—Source or drain electrodes for field effect devices
- H01L29/41791—Source or drain electrodes for field effect devices for transistors with a horizontal current flow in a vertical sidewall, e.g. FinFET, MuGFET
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/785—Field effect transistors with field effect produced by an insulated gate having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
- Thin Film Transistor (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】 フィンの高さをチャンネル長よりも高くしたFinFET構造によって上記の問題を解決する。
【選択図】 図1
Description
σ(VT)=Avt/(LW)0.5・・・(1)
Avt=tOXNsub 0.25 ・・・(2)
で表される。ここでAvtは、MOSTの電気的なゲート酸化膜(tOX)とMOSTのチャンネル領域の濃度Nsubで決まる定数である。またLとWは、それぞれMOSTのチャンネル長とチャンネル幅である。図12は、シリコン基板上のフィン(Fin、FN)の側壁に形成された従来のMOST(いわゆるFinFET)が示されている。(a)は鳥瞰図、(b)は代表的な平面レイアウトを示している。FinFETでは、フィンの高さがチャンネル幅になり、ゲート(FG)で制御されるチャンネル領域は、すなわちFGで囲まれたFNの領域(CH)は、たとえば完全空乏層型nチャンネルMOST(NMOST)なら、Nsub=1016cm−3程度の低濃度のボロンがドープされている薄いp層から成る。tOXはゲート酸化膜である。ドレイン(D)とソース(S)は高濃度のn型層(n+)から成る。
120,FN: シリコンフィン
160: ウエル
200,300: 拡散層電極
400,410,FG: ゲート電極
450: プレート電極
600: 金属配線層
900,905,906,907,908,910,950,FOX,BOX,PT: 絶縁膜
Claims (8)
- シリコン基板上に形成されたシリコンの第1のフィンと前記第1のフィンの少なくとも側面に絶縁膜を介して形成されたゲート電極とを有するMOSトランジスタを具備し、
前記MOSトランジスタのチャンネル幅は、前記第1のフィンの高さ方向で決まるように前記第1のフィンの側面に形成され、
前記シリコン基板に平行な第1方向の前記第1のフィンの幅は、最下層の金属配線層の配線ピッチの半分より小さいことを特長とする半導体装置。 - 前記シリコン基板上に形成された第2のフィン及び前記第2のフィンの少なくとも側面に絶縁膜を介して設けられた電極を有するMOSキャパシタを更に具備し、
前記第1方向の前記第2のフィンの幅は、前記最下層の金属配線層の配線ピッチの半分より小さいことを特長とする請求項1の半導体装置。 - 前記MOSトランジスタと前記MOSキャパシタで1個のダイナミック形メモリセルを構成したことを特長とする請求項2の半導体装置。
- シリコン基板上に形成されたMOSトランジスタと、
前記シリコン基板上に形成されたシリコンのフィン及び前記フィンの少なくとも側面に絶縁膜を介して設けられた電極を有するMOSキャパシタとを具備し、
前記フィンの高さは、その幅よりも大きいことを特長とする半導体装置。 - 前記MOSトランジスタは、完全空乏層型MOSトランジスタであることを特長とする請求項1から4までのいずれか1つの半導体装置。
- シリコン基板上に形成されたシリコンのフィンと前記フィンの少なくとも側面に絶縁膜を介して設けられたゲート電極とを有するMOSトランジスタを具備し、
前記MOSトランジスタのチャンネル幅は、前記フィンの高さ方向で決まるように前記フィンの側面に形成され、
前記MOSトランジスタは、完全空乏層型MOSトランジスタであり、前記フィンの底部と該基板間に絶縁物が存在することを特長とする半導体装置。 - 前記シリコン基板に電圧を印加し、該電圧を変えることによって前記MOSトランジスタの閾値電圧を変えることを特長とする請求項6の半導体装置。
- 前記MOSトランジスタのチャンネル長は、20nm程度以下であることを特長とする請求項1から7までのいずれか一つの半導体装置。
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JP2009158360A JP2011014753A (ja) | 2009-07-03 | 2009-07-03 | 半導体装置 |
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JP2009158360A JP2011014753A (ja) | 2009-07-03 | 2009-07-03 | 半導体装置 |
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JP2011014753A true JP2011014753A (ja) | 2011-01-20 |
Family
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JP2009158360A Pending JP2011014753A (ja) | 2009-07-03 | 2009-07-03 | 半導体装置 |
Country Status (1)
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012216802A (ja) * | 2011-03-25 | 2012-11-08 | Semiconductor Energy Lab Co Ltd | 電界効果トランジスタおよびそれを用いたメモリおよび半導体回路 |
KR20130073829A (ko) * | 2011-12-23 | 2013-07-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 소자, 반도체 소자의 제작 방법 및 반도체 소자를 이용한 반도체 장치 |
WO2014051760A1 (en) * | 2012-09-28 | 2014-04-03 | Intel Corporation | Extended drain non-planar mosfets for electrostatic discharge (esd) protection |
US8841185B2 (en) | 2012-08-13 | 2014-09-23 | International Business Machines Corporation | High density bulk fin capacitor |
US9184053B2 (en) | 2012-01-10 | 2015-11-10 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the same |
US9373678B2 (en) | 2014-06-17 | 2016-06-21 | Globalfoundries Inc. | Non-planar capacitors with finely tuned capacitance values and methods of forming the non-planar capacitors |
WO2020189408A1 (ja) * | 2019-03-15 | 2020-09-24 | 株式会社ソシオネクスト | 半導体集積回路装置 |
US11670675B2 (en) | 2020-12-04 | 2023-06-06 | United Semiconductor Japan Co., Ltd. | Semiconductor device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1168069A (ja) * | 1997-04-04 | 1999-03-09 | Nippon Steel Corp | 半導体装置及びその製造方法 |
JP2005294789A (ja) * | 2004-03-10 | 2005-10-20 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2006128494A (ja) * | 2004-10-29 | 2006-05-18 | Toshiba Corp | 半導体集積回路装置及びその製造方法 |
-
2009
- 2009-07-03 JP JP2009158360A patent/JP2011014753A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1168069A (ja) * | 1997-04-04 | 1999-03-09 | Nippon Steel Corp | 半導体装置及びその製造方法 |
JP2005294789A (ja) * | 2004-03-10 | 2005-10-20 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2006128494A (ja) * | 2004-10-29 | 2006-05-18 | Toshiba Corp | 半導体集積回路装置及びその製造方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012216802A (ja) * | 2011-03-25 | 2012-11-08 | Semiconductor Energy Lab Co Ltd | 電界効果トランジスタおよびそれを用いたメモリおよび半導体回路 |
US9859443B2 (en) | 2011-03-25 | 2018-01-02 | Semiconductor Energy Laboratory Co., Ltd. | Field-effect transistor, and memory and semiconductor circuit including the same |
US9548395B2 (en) | 2011-03-25 | 2017-01-17 | Semiconductor Energy Laboratory Co., Ltd. | Field-effect transistor including oxide semiconductor, and memory and semiconductor circuit including the same |
US9236428B2 (en) | 2011-12-23 | 2016-01-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element, method for manufacturing the semiconductor element, and semiconductor device including the semiconductor element |
US8860021B2 (en) | 2011-12-23 | 2014-10-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor element, method for manufacturing the semiconductor element, and semiconductor device including the semiconductor element |
KR102102718B1 (ko) * | 2011-12-23 | 2020-04-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 소자, 반도체 소자의 제작 방법 및 반도체 소자를 이용한 반도체 장치 |
KR20130073829A (ko) * | 2011-12-23 | 2013-07-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 소자, 반도체 소자의 제작 방법 및 반도체 소자를 이용한 반도체 장치 |
JP2013232689A (ja) * | 2011-12-23 | 2013-11-14 | Semiconductor Energy Lab Co Ltd | 半導体素子 |
US9184053B2 (en) | 2012-01-10 | 2015-11-10 | Renesas Electronics Corporation | Semiconductor device and method of manufacturing the same |
US8841185B2 (en) | 2012-08-13 | 2014-09-23 | International Business Machines Corporation | High density bulk fin capacitor |
US9502883B2 (en) | 2012-09-28 | 2016-11-22 | Intel Corporation | Extended drain non-planar MOSFETs for electrostatic discharge (ESD) protection |
WO2014051760A1 (en) * | 2012-09-28 | 2014-04-03 | Intel Corporation | Extended drain non-planar mosfets for electrostatic discharge (esd) protection |
US10103542B2 (en) | 2012-09-28 | 2018-10-16 | Intel Corporation | Extended drain non-planar MOSFETs for electrostatic discharge (ESD) protection |
US9087719B2 (en) | 2012-09-28 | 2015-07-21 | Intel Corporation | Extended drain non-planar MOSFETs for electrostatic discharge (ESD) protection |
US9373678B2 (en) | 2014-06-17 | 2016-06-21 | Globalfoundries Inc. | Non-planar capacitors with finely tuned capacitance values and methods of forming the non-planar capacitors |
WO2020189408A1 (ja) * | 2019-03-15 | 2020-09-24 | 株式会社ソシオネクスト | 半導体集積回路装置 |
US11670675B2 (en) | 2020-12-04 | 2023-06-06 | United Semiconductor Japan Co., Ltd. | Semiconductor device |
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