JP2011005556A - 半導体装置及びその作製方法 - Google Patents

半導体装置及びその作製方法 Download PDF

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Publication number
JP2011005556A
JP2011005556A JP2009148670A JP2009148670A JP2011005556A JP 2011005556 A JP2011005556 A JP 2011005556A JP 2009148670 A JP2009148670 A JP 2009148670A JP 2009148670 A JP2009148670 A JP 2009148670A JP 2011005556 A JP2011005556 A JP 2011005556A
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Japan
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layer
wiring
substrate
semiconductor element
semiconductor device
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JP2009148670A
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Japanese (ja)
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JP2011005556A5 (enExample
Inventor
Konami Izumi
小波 泉
Yumiko Saito
祐美子 齋藤
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2009148670A priority Critical patent/JP2011005556A/ja
Publication of JP2011005556A publication Critical patent/JP2011005556A/ja
Publication of JP2011005556A5 publication Critical patent/JP2011005556A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00222—Integrating an electronic processing unit with a micromechanical structure
    • B81C1/00246—Monolithic integration, i.e. micromechanical structure and electronic processing unit are integrated on the same substrate

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  • Micromachines (AREA)
JP2009148670A 2009-06-23 2009-06-23 半導体装置及びその作製方法 Withdrawn JP2011005556A (ja)

Priority Applications (1)

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JP2009148670A JP2011005556A (ja) 2009-06-23 2009-06-23 半導体装置及びその作製方法

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JP2009148670A JP2011005556A (ja) 2009-06-23 2009-06-23 半導体装置及びその作製方法

Related Child Applications (1)

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JP2014063736A Division JP5918292B2 (ja) 2014-03-26 2014-03-26 半導体装置

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JP2011005556A true JP2011005556A (ja) 2011-01-13
JP2011005556A5 JP2011005556A5 (enExample) 2012-05-10

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015145056A (ja) * 2014-02-04 2015-08-13 セイコーエプソン株式会社 ロボットハンド、ロボット、及びロボットハンドの製造方法
JP2015145057A (ja) * 2014-02-04 2015-08-13 セイコーエプソン株式会社 ロボットハンド、ロボット、及びロボットハンドの製造方法
KR101569889B1 (ko) 2013-12-23 2015-11-17 한국기계연구원 신축성을 가지는 유연 전자소자의 접속방법 및 이에 의해 제조된 유연 전자소자
KR101578109B1 (ko) 2009-08-12 2015-12-17 (주)에이엘에스 전자소자용 리드 프레임 이를 이용한 전자소자용 패키지 및 이들의 제조방법
JP2017505721A (ja) * 2014-01-09 2017-02-23 モーション・エンジン・インコーポレーテッド 集積ｍｅｍｓシステム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007021713A (ja) * 2005-06-17 2007-02-01 Semiconductor Energy Lab Co Ltd 半導体装置、およびその作製方法
JP2007152546A (ja) * 2005-11-11 2007-06-21 Semiconductor Energy Lab Co Ltd 微小構造体及び微小電気機械式装置の作製方法
JP2008546207A (ja) * 2005-06-07 2008-12-18 エプコス アクチエンゲゼルシャフト 電気的素子および製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008546207A (ja) * 2005-06-07 2008-12-18 エプコス アクチエンゲゼルシャフト 電気的素子および製造方法
JP2007021713A (ja) * 2005-06-17 2007-02-01 Semiconductor Energy Lab Co Ltd 半導体装置、およびその作製方法
JP2007152546A (ja) * 2005-11-11 2007-06-21 Semiconductor Energy Lab Co Ltd 微小構造体及び微小電気機械式装置の作製方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101578109B1 (ko) 2009-08-12 2015-12-17 (주)에이엘에스 전자소자용 리드 프레임 이를 이용한 전자소자용 패키지 및 이들의 제조방법
KR101569889B1 (ko) 2013-12-23 2015-11-17 한국기계연구원 신축성을 가지는 유연 전자소자의 접속방법 및 이에 의해 제조된 유연 전자소자
JP2017505721A (ja) * 2014-01-09 2017-02-23 モーション・エンジン・インコーポレーテッド 集積ｍｅｍｓシステム
JP2015145056A (ja) * 2014-02-04 2015-08-13 セイコーエプソン株式会社 ロボットハンド、ロボット、及びロボットハンドの製造方法
JP2015145057A (ja) * 2014-02-04 2015-08-13 セイコーエプソン株式会社 ロボットハンド、ロボット、及びロボットハンドの製造方法

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