JP2011005545A - はんだ合金およびこれを用いたはんだ接合体 - Google Patents
はんだ合金およびこれを用いたはんだ接合体 Download PDFInfo
- Publication number
- JP2011005545A JP2011005545A JP2010043981A JP2010043981A JP2011005545A JP 2011005545 A JP2011005545 A JP 2011005545A JP 2010043981 A JP2010043981 A JP 2010043981A JP 2010043981 A JP2010043981 A JP 2010043981A JP 2011005545 A JP2011005545 A JP 2011005545A
- Authority
- JP
- Japan
- Prior art keywords
- solder alloy
- solder
- present
- alloy
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010043981A JP2011005545A (ja) | 2009-05-25 | 2010-03-01 | はんだ合金およびこれを用いたはんだ接合体 |
KR1020100034121A KR101173531B1 (ko) | 2009-05-25 | 2010-04-14 | 땜납 합금 및 이를 이용한 땜납 접합체 |
CN2010101708052A CN101899589A (zh) | 2009-05-25 | 2010-04-29 | 焊锡合金及使用该焊锡合金的焊锡接合体 |
TW99114076A TWI412604B (zh) | 2009-05-25 | 2010-05-03 | 焊錫合金及使用該焊錫合金的焊錫接合體 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009124801 | 2009-05-25 | ||
JP2010043981A JP2011005545A (ja) | 2009-05-25 | 2010-03-01 | はんだ合金およびこれを用いたはんだ接合体 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2011005545A true JP2011005545A (ja) | 2011-01-13 |
Family
ID=43562823
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010043981A Pending JP2011005545A (ja) | 2009-05-25 | 2010-03-01 | はんだ合金およびこれを用いたはんだ接合体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP2011005545A (zh) |
TW (1) | TWI412604B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160006667A (ko) | 2013-05-10 | 2016-01-19 | 후지 덴키 가부시키가이샤 | 반도체 장치 및 반도체 장치의 제조방법 |
TWI630049B (zh) * | 2015-10-25 | 2018-07-21 | 日商亞特比目股份有限公司 | 超音波焊接方法及超音波焊接裝置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210100729A (ko) * | 2018-12-18 | 2021-08-17 | 아토비무 유겐가이샤 | 초음파 납땜장치 및 초음파 납땜방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010072364A (ko) * | 1999-06-11 | 2001-07-31 | 이즈하라 요조 | 무연 땜납 |
JP2008030047A (ja) * | 2006-07-26 | 2008-02-14 | Eishin Kogyo Kk | 無鉛ハンダ |
JP2009072827A (ja) * | 2007-08-24 | 2009-04-09 | Hitachi Metals Ltd | はんだ層形成部材の製造方法 |
-
2010
- 2010-03-01 JP JP2010043981A patent/JP2011005545A/ja active Pending
- 2010-05-03 TW TW99114076A patent/TWI412604B/zh not_active IP Right Cessation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20160006667A (ko) | 2013-05-10 | 2016-01-19 | 후지 덴키 가부시키가이샤 | 반도체 장치 및 반도체 장치의 제조방법 |
US10157877B2 (en) | 2013-05-10 | 2018-12-18 | Fuji Electric Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
TWI630049B (zh) * | 2015-10-25 | 2018-07-21 | 日商亞特比目股份有限公司 | 超音波焊接方法及超音波焊接裝置 |
Also Published As
Publication number | Publication date |
---|---|
TWI412604B (zh) | 2013-10-21 |
TW201042053A (en) | 2010-12-01 |
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