TW201042053A - Solder alloy and solder joint body using the solder alloy - Google Patents

Abstract

The object of this invention is to provide a novel solder alloy. The solder alloy keeps a property of a Sn-Ag-Al solder alloy which can joint oxide, such as glass or ceramics, or material that is difficult to joint, such as Mo having poor wettability, and the change of the solder alloy with time can be restrained. The solder alloy of this invention represented by weight ratio includes: 0.9% to 10.0% of Ag, 0.01% to 0.50% of Al and 0.04% to 3.00% of Sb; a ratio of Al/Sb satisfies a relation of no more than 0.25 (except 0), and the balance includes Sn and inevitable impurities. The solder alloy can further include any of or both of no more than 1.0% of Y and more than 1.0% of Ge.

Description

201042053 6. Technical Field of the Invention The present invention relates to a solder alloy and a solder joint using the solder alloy. The solder alloy is suitable for bonding an oxide such as glass or ceramic. Or a member having an oxidized surface such as aluminum (A1) or Mo having poor wettability. [Prior Art] In the conventional bonding technique of an oxide such as glass, it is 380. (The mainstream of the method used in the joint and sealing is the use of lead solder or glass frit. However, due to environmental problems, there is no use error, so alternative technology must be established. The present inventors have proposed a solder alloy containing Ag and A1 as a main component and a solder alloy for oxide bonding used for bonding of glass or the like (W02007/7840). In order to suppress a void at the time of solder melting, a solder alloy in which γ and Ge are added to a solder alloy for oxide bonding in WO2007/7840 (U.S. Patent No. 2008/0241552) is proposed. The Sn-Ag_A bismuth-based solder alloy disclosed in the publication of WO2007/7840 and US Pat. No. 2008/0241552 does not contain an oxide (dross) element such as Zn, and therefore has a solder joint. The effect of the handling is easy. The research by the inventors and the like confirms that there is a new problem: if W(10) (and the welding alloy proposed in the bulletin et al. The lining of the outer surface of the lining is gradually changed to 201042053 as white turbidlty. And 'If you study in detail, you can confirm the following phenomenon: the solder alloy is changed in the scale (4) and the hole in the tissue is 2 holes). The modification of such a solder alloy may deteriorate the joint reliability. [Summary] The purpose of the present invention is to provide a new type of Ο Ο 合 _ _ _ _ Or 3^ difference of M. The % of the Sn_Ag_A1 solder alloy which is difficult to bond materials, and can suppress the change of the solder alloy with time. ^Inventor's fine-formed surplus material tin changes with the day (four) _ 8 wide = It can be seen that the present invention can be greatly improved by using an alloy of bb in an appropriate amount in a solder alloy. The present invention is a solder alloy, and the solder alloy contains 0.9% by weight. ~10.0% Ag, 〇.01%~二不' 0.04%~3% of view, the ratio of the hall is full of =A1 (excluding 〇), the remaining part contains % and unavoidable == , the comparison of the Al/Sb is preferably small Equivalent to 〇, >: Bellows) ϋ.18 (excluding and, the solder alloy of the present invention contains γ of 1.0% by weight or less, and less than or equal to 咖 = 'better package. Or, the solder alloy of the present invention preferably has Ag of 丨〇% to 8 and the solder alloy of the present invention is preferably 〇/〇. U1/〇~0.40%. 201042053 The solder alloy of the present invention preferably has A1 0.12% to 0.35%. Further, the solder alloy of the present invention preferably has a Sb of 0.50% to 3.00%. Further, the solder alloy of the present invention preferably has Sb of 1.00% to 2.50%. And 'this hair _ welding county money secrets or components with oxidized surface. Further, by using the solder alloy of the present invention, an oxide or a member having an oxidized surface can be firmly bonded, and an inexpensive solder joint can be provided. [Effect of the Invention] According to the present invention, a solder alloy such as a pair of glass or a liquid crystal container or a glass substrate which is suitable for use in fixing a metal conductor to a wire can be used. It has improved its joint reliability and is therefore of great industrial value. [Embodiment] As described above, an important feature of the present invention is that an alloy in which Sb is added to a Sn_Ag_A1 糸 solder alloy is used. The reason for limiting the chemical composition (weight percentage) of the solder alloy of the present invention will be described below.

Sb : 0.04%~3.00%

Sb is the most important element for suppressing the change of the solder alloy of the present invention over time. Regarding the above effect, although the correct verification cannot be performed, the reason is considered to be as follows: · Sb forms a compound with A1 present in the Sn-Ag-Al solder alloy, and as a result, formation of an Ag-Al intermetallic compound is suppressed. -AI intermetallic compounds are the cause of oxidation or white turbidity or voids 0 ❹ Ο 201042053

The content of Sb is also dependent on the amount of ruthenium. If it is too small to suppress the effect of changing with time, it is impossible to fully exert its effect by solid-solving Sb in Sn, and it can be characterized by characteristics and thermal fatigue (five) Ifatlgue) ^Mechanical machinery not only achieves the effect of suppressing changes over time, =. Therefore, for the properties and thermal fatigue characteristics, the solder joint of the present invention is obtained to obtain a mechanical specificity of 〇.5% or more. Further, it is more preferable that the content of _^ is preferably in another aspect. The excessive addition of Sb leads to a stagnation of sputum, and the result of the increase is too large, so that the effect of the variation of the partial inhibition by the addition of Sb = substance over time cannot be sufficiently obtained. Further, when a hard and brittle compound is obtained, not only does the ruthenium present in the lower part, but also the effect of the (4) oxidized temple-like alloy of the compound itself changes with time. The addition of % 烊 烊 tin increases the amount of addition of the solder alloy, and reduces the weldability. < (3) Wetting property Therefore, in the present invention, the content of Sb is preferably * 2.5% or less. & less than #于3·〇0%.

Ag : 0_9〇/〇~1 〇·〇〇/〇 The base of the solder alloy of the present invention, the alloy is determined to reduce the melting point by the eutectic reaction, and the creep ((10)P) strength of the solder is determined. When the alloy is stretched, the amount of 岣7 201042053 of the solder alloy must be greater than or equal to 0.9%. In order to ensure the strength required for the joint, the content of 转7 201042053 of the solder alloy must be greater than or equal to 0.9%. . There will be too much = too much, in addition to raising the melting point, the compound becomes a factor that reduces the impact resistance. J 1 is at 8 5 . /t ❸ is equal to the moving %, and more preferably less than the equivalent. For a strict demand such as a mobile phone, the anti-drop impact is particularly high. As °·9〇/- A1 : 0.01%~0·50〇/〇命士, In the Sn'Ag-based solder alloy of the present invention, A1 is indispensable for achieving bonding of difficult-to-bond materials such as a handle. Essential metal. That is to say, in the solder alloy of ^^^^, even if the mixing ratio of Sn and Ag is changed, it is difficult to combine, and by adding A1 to improve the factory with difficult materials, the door is difficult to produce. The bonding material is in close contact. This is because A] is strong and easily combines with the oxide of the material to be joined to improve the wettability of Z in the difficult-to-bond material. , ,,. However, if the content of A1 is too large, there is a fear that there will be an excessively superficial structure, and the anti-secret bondability will reduce the Ag_A1 gold compound which is oxidized, and it is easy to produce a solder joint due to oxidation. The interface of the joint solder and the bonding material is 201042053. The amount of this & Α1 is 0.010/^0^^ 0.01〇/〇^0.40〇/〇^^4 关系 in relation to the Sb content. .12〇/0^

Al/Sb content ratio: G 25 or less (excluding 〇) An important feature of the present invention is that the content ratio of the A1 disk Sb contained in the lybium alloy is most suitable for 1 reason, and the reason is explained in detail. 'A1 and Ag in the Sn-Ag-Al-based solder alloy which is not added to form an intermetallic compound, that is, an Ag_A1 intermetallic compound. The intermetallic compound is considered to be a major cause of white turbidity in the solder joint portion due to the interface between the alloy, the solder alloy, and the material to be bonded due to oxidation, and therefore it is necessary to suppress the Ag_A1 intermetallic compound sf Sn'Ag-A.

Sb, actively precipitating from the Sb compound, thereby suppressing the precipitation of the intermetallic compound, thereby obtaining the Sb inhibiting portion. The above-mentioned A1 and Sb cannot sufficiently suppress the solder joint A when the content of A1 in the solder alloy is excessive or Sb out. The whiteness of the joint. = suppression changes with time, preferably less than equal residual portion Sn and unavoidable impurities 9 201042053

Sn acts to relax the thermal expansion coefficient of the material to be joined such as the glass and to lower the melting temperature, and is a matrix element constituting the solder alloy of the present invention. In particular, in the adjustment of the thermal expansion coefficient, it is desirable to wave Sn in the range of 85% to 95%. More preferably 9〇〇/. ~95%. As impurities which are not <avoid, Fe, Nl, c〇, Cr, v, Mr^_; the wet price of tin is therefore preferably limited to a total of less than or equal to 1%. It is better to limit these elements to a total of 5 〇〇 ppm or less. Therefore, it is better to limit these elements to the second one: the gap of the 抟 抟 - - - - - - - - - - - - - - - - - - - - - - - 』 』 』 』 』 』 』 More preferably, it is limited to less than or equal to 1 〇〇 ppm. Moreover, with regard to Zn, the ZnW-based less dry tin towel in the Japanese-supplied mountain is less viscous due to the vacuum in the vicinity of the solder surface. Moreover, the vapor pressure of ζη is high, and the contamination is connected; the material = the cause. In addition, there is an increase in the number of contaminations in the furnace, which hinders the soldering; = the ultrasonic welding method used for the amount of scum generated during the connection. In particular, it tends to be remarkable at the time of solder bonding. In the solder alloy of the present invention, it is preferable that the solder alloy ί is less than or equal to 1 () ° ° ° increase, and the synthesis is to make the oxide in the solder. (Floating (checking) produces tin to become brittle. Therefore, the reason for the oxidation of the I 2 nd conjugate is such that the oxygen content of the solder alloy of the shank is preferably less than 10 Ο ❹ 201042053 at 500 ppm, more preferably Less than or equal to 刈卯 melon. γ ·· Less than or equal to 1.0% Tin-melting gold is most suitable for reducing the specific suppression of glow = Γ γ. When the tear is reduced: the surface-force reduction of r-metal: Consider the generation of voids. The increase is increased, but the machine 2: ^ is an intermetallic compound and the solder alloy of the solder is Υ θ. Therefore, it is preferably ο1% of the present invention. In order to clearly determine that the drought ^ ν · 〇 % ' is preferably smaller than Equivalent to 〇·〇!〇/〇〇Get the effect of Aberdeen Yang, preferably greater than or equal to

Ge: gas less than or equal to 1〇%: in the case of a fruit that contains a suppressable smelting, which is equal to the high value of the tin oxide, as the Ge from f Ge ' is compared with the effector surface oxide which inhibits surface oxidation. , === In the solder surface layer, in this material, ~^ tilt the adhesion of the material to be joined. Because (4)%. More preferably, it is less than equal; the percentage of the amount indicates that it is preferably less than or equal to, preferably greater than 201042053. The solder alloy of the present invention is bonded without being used on the joint surface. After the object is joined, the solder can be pressed at any time == wide, and it can suppress the ceramics in the joint (-a). Further, it is needless to say that the oxide of #璁拎 = for oxidizing the soda lime system can also preferably suppress the change with time for the oxidation table member having A1 or the like. Moreover, even with respect to the image, it is possible to suppress changes with time. Compound: I: The solder alloy of I: is not only suitable for the oxides and nitrogens, but forms 7 turns on the glass. In addition, the film of the first layer or the like is thinner than the bonding. For example, the alloy is also coated on the joint surface for various metals such as stress _, copper, and the like. The ability 'even if the bonding ability is poorly applied to the surface treatment after the application of the tilting ability. The solder alloy of the invention can also be applied by using a substrate instead of soldering by coating on the surface of the oxide or nitride.接接:: The present invention: tin alloy oxide or nitride, etc.: θ, σ, for example, by coating a glass substrate that has been at room temperature and ?: tin to fix the metal conductor wire in the broken On the glass substrate, the linear temperature::, = is heated by the component to a liquid phase V* greater than or equal to the solder alloy or the wire f is considered to be sufficient to achieve a sufficient meltmg blt, below the liquidus temperature of the alloy. In order to perform double-layer breaking: ί: 201042053 Sealing of airtight container. In addition, if ultrasonic vibration is applied to the solder alloy, the bonding of the hard-to-join material is effective 'to take oxygen into the molten solder to promote the pair The wetting of the joint material helps [Example 1] Sn, Ag, A, Sb, Y, and Ge were weighed so that they became the group of Table 1 and then melted, and the alloy melt obtained in the pair was poured into a mold to prepare a solder. For the alloy, the following evaluation test was carried out. (5 Flat evaluation test 1) ❹ A borosilicate glass plate (product name: TEMPAX) cut into 30 mm square and 3 mm thick was set as the material to be joined and heated to 35. Pre-heating is performed on the hot plate of 〇°c. Then, the tip of the ultrasonic vibration (SUNBUNDER USM-III manufactured by Kuroda Technology Co., Ltd.) is applied to make the solder alloy The thickness is 100 μm coated on one side of the glass sheet 'slow cooling in the atmosphere. Then, the cutter is used for cutting so that the solder surface of the sample cooled to room temperature becomes 5 mm. + _ 5x5 mesh, making peeling test piece. The film confirms the change of solder joint strength, and the accelerated environmental test is to test the '1TTT^5 C 85RH% high temperature and high humidity test machine (manufactured by the company) HIFLEX) shouted for 1_ hour. Then Into the w test of the solder and glass surface of the test piece before and after the Dingli sigma test. The test is a tape (adhes C Nichiban company 1 & a -, J made CT-405AP-24 Adhesively affixed to one side of the test piece, and ordered 3 times of stripping <testing, counting the area where the solder peeled off. 13 201042053 In addition, 'on the peeling test, in the 5x5 grid, in order to ignore (·) The impact of 'using the central part of the 3 χ 3 grid to test. As shown in Table 1, it was confirmed that in the accelerated environment test, the alloy of the comparative example had sufficient strength to prevent peeling. 1 and ° are the same after the accelerated environmental test, and the invention examples and the comparator solder alloy are only at least equal to i _ 焊 solder (4). The _(四) alloy of the present invention also has sufficient joint strength after the rapid environmental test. σ (Evaluation Test 2) = cut into 30 mm square, 3 mm thick, nicknamed TEMPAX) as a secret (four) ridge to the nine iron head (Ultra Technology Co., manufactured by Kuroda Technology Co., Ltd.) to make solder alloy In the air, it is applied to the surface of the glass plate. In order to confirm the suppression, it is considered that the solder joint portion which is generated from the joint interface of the two glass plates is turbid due to oxidation or the like. In the glass test, the test piece was placed in a high temperature of 85 ° C, 85 RH %, and the "mFLEX of the company" was placed in the machine for a small hour. Machine (Nan Benhua ~ evaluation of the solder joint lamp of the test piece after the accelerated environmental test. About the solder The white turbid area of the joint, the joint interface of the solder and the glass plate in the Di:3⁄4 area, and the area of the white turbidity of the surface of the glass sheet of the test piece, and the area ratio of the glass of the glass 14 201042053 as shown in Table 1. The white turbid area ratio of the solder joint portion of the example of the present invention is 8% or less. On the other hand, the white turbid area ratio of the comparative example is a value exceeding 80%. This confirms that the content ratio of A1/Sb is set. For less than or equal to 0_25, the solder alloy of the present invention can be added After the environmental test, the white turbidity of the solder joint portion can be suppressed. (Evaluation test 3) The sample is a solder wire obtained by processing a solder alloy prepared to have a composition of Table 1 into a wire of φ 1 mm. Ο

In order to evaluate the oxidation resistance of the solder alloy, the accelerated environmental test was carried out by placing the sample in an 85 C 85 RH% high-temperature and high-humidity tester (HIFLEX manufactured by Nanben Chemical Co., Ltd.) for 1 hour. Regarding the oxygen content of the solder alloy, when the oxygen content of the solder alloy is less than or equal to 1000 Ppm, the EMGA-620W manufactured by Horiba, Ltd. is used for the measurement. When the oxygen content of the solder alloy exceeds the allowable amount, the market is used. The manufactured EMGA_55 was measured. As shown in Table 1, after the accelerated environmental test, the oxygen content t of the solder of the present invention was equal to 3 GG, whereas the content (4) of the solder j of the comparative example was a value exceeding 丨_ppm. From this, it was confirmed that the effect of the solder alloy deuteration can be suppressed by setting the content ratio of A1/Sb of the soldered tin alloy in the example of 5 to less than or equal to .5. ',' (evaluation test 4)

The sample used the following solder wire material, the solder alloy 3 was prepared in the same manner as the solder alloy 4 φ 丨Ϊ evaluated the deterioration of the tan alloy with time (4), accelerated environmental test I 15 201042053 sample at 85t85RH 〇 / 0 The ancient, w-made HIFLEX), the test machine (five) this into a company system in order to investigate the solder alloy at any time, "the 9-inch solder wire after the environmental test." Bending test Ding Ru 〇 ^ As shown in Table 1, π, regarding the solder alloy of the example of the present invention, even if it is: 90. Bending, inspection, solder wire will not be damaged, but for the comparison of solder alloy, bending, folding 90. ! The solder wire will be donated. Therefore, by assuming that the A1/Sb of the solder alloy of the present invention is equal to 0.25, the change in the soldering time can be suppressed. 16 201042053 ο oo [14] 4 Comparative Example Accelerated Environmental Test Test (85°) C 85RH% 1000 h ) Bending test (to reach the number of breaks) 〇oo 〇oooo 〇o 1—< r—^ Dragon and 1 b m '1 ·<IT) 〇\ rsi fN 〇s fN UO oo CN ( N o (N s 5538 3863 joint surface white turbidity area rate (%) ooooor**"i 〇ooo OO sooooo ON. oooo ON o 〇soo ο o 1 before the test % ^ o 〇\ o Q\ oo Or r-&gt ;〇\o 〇\ oo 〇\ o On δ ON o O'. o ON ο o Al/Sb ratio go inch oo inch o ΓΛ oS ooo ^T) oooo OC o Ρ; dj solder composition (weight percentage) 〇 ο ooo 〇oooooosdo ο soooo 〇ooooodsd O oo ο o Xi GO 沄ds T-^ g iN iN g name iN oc (N ri o 〇\ dr— s 1— vn d Csj »—( osdsd G\ CN d O ( N d ooosdmmoso 2 d 〇\ CN d Ό dd ^T) m O o 〇. og *- o cnJ crs. ON (N swallow ni name mm 00 etc. in o 〇 Voo ΓΛ m CN od CN ON iN oc Ο) inch^T) oc 13 m 15 CO 15 15 CQ CQ 13 CO 13 15 CO Ί5 CQ 3 cn cn m CQ Έ CQ Sample No. No.1 No.2 No. 3 1 No.4 Π No.5 No.6 No.7 No.10 I No.10 I | No. 10 I 1 No.11 I | No.12 | No. 13 | No.14 1 201042053 [Example 2 ] Hundred eight I8, A1, %, Y, G...n, so that it is not a weight knife, Ag=8.5〇/〇, A1:=〇.35%, Sb=r2〇%, γ = 0.^ %, Ge=_. The remaining part is % of the grade. 'The alloy is melted in an Ar gas atmosphere, and then the obtained alloy melt is poured into the cloth to produce the _(10) alloy. Similarly, the comparison of life = not = plus Sb -, the same way to make a weight percentage as ^

For s 〇 35/°'Y==〇.〇75%, Ge=〇.〇3%, the remaining part ς Π monument tin alloy. A test for the solder alloy produced. (5 flat evaluation test 1), stand: first, will cut.彳 into 5. The mm-square, 3 mm-thick glazed glass phase is placed on the heating 5 refractory δ!, , , and plate for the TEMPAX) material to be joined, and preheated. Thereafter, the supersonic extinguishing == carrier (Ultrasonic welding device S ER USM-III manufactured by Kuroda Technology Co., Ltd.) was used to make this comparison available.

Degree becomes 5. The way of _ coating = one of the board is to the official. The _ device is used for cutting so that the surface of the solder of the cold 5x5 smear cloth becomes a grid of 5 mm square (5x5 mesh, and the test piece is produced. The effect of the film on the gasification of 85τΊι^, the accelerated environmental test is Sealed mn^〇 testing machine (the glass side of the Nanometer Chemical Co., Ltd. observation of the welding of the test piece before and after the environmental test, the joint interface of the glass 18 201042053 plate. In addition, in the 5x5 grid, in order to influence Using a 3x3 grid in the center portion, and β, the result is a solder alloy and a comparative example of the present invention.

J, the cloth is closely attached to the glass to obtain a mirror surface, but in the accelerated environment test: After the 'Lai alloy towel of the present invention, the lang is very small-partial (the very few parts of the 3 grids within 9 squares of the object) are white turbid, In contrast, in the solder alloy of the comparative example, white turbidity was observed in the entire (four) domain of 9 cells. As a result, it was confirmed that the solder alloy of the present invention to which Sb was added had an effect of suppressing the occurrence of white turbidity in a two-temperature and high-humidity environment. (Evaluation Test 2) A test piece of the solder alloy of the present invention and the known tin alloy of the present invention was prepared in the same manner as in the evaluation test 1. Next, a peeling test of four pieces of solder and glass plate connection interfaces before and after the accelerated environmental test was performed. In addition, the peeling test was carried out by adhering a tape (CT-405AP-24 manufactured by Nichiban Co., Ltd.) to one side of the test piece and repeatedly peeling three times to count the area where the solder peeled off. After the solder was applied, no peeling was observed in the solder alloy of the present invention and the solder alloy of the comparative example. After the accelerated environmental test, in the nine cells as the object, the present invention produced solder peeling only in the area of one square. On the other hand, in the comparative example, solder peeling occurred in the area of five squares. From this result, it was confirmed that the solder alloy of the present invention to which Sb is added has an effect of preventing deterioration of bonding strength with time in a high-temperature and high-humidity environment. (Evaluation Test 3) 19 201042053 The solder alloy of the present invention and the solder alloy of the comparative example were produced in the same manner as the test evaluation 1, and then rolled into a solder flake having a thickness of (four), and the same as (evaluation test) was carried out. The environmental test was accelerated to observe the change in the internal structure of the solder. The microstructure after the accelerated environmental test of the solder alloy of the present invention indicates that the micro-group 4 after the accelerated environmental test of the solder alloy of the example is not shown in Fig. 2 . In comparison with FIG. 2, it was found that voids in the solder alloy were not observed in the solder alloy of the present invention, and voids in the solder alloy were confirmed in the solder alloy of the comparative example. It is a big problem for the application: it is confirmed that the added bismuth tin alloy effectively suppresses the occurrence of this problem. [Example 3] Weigh Ag, Al, Sb, and Sn to account for λ, 丄 θ It is shown as Ag = 3.5%, A1 = 〇1〇Q/ s. It is expressed as a percentage by weight from ...·1〇/〇Sb=1·5%, and the rest is Sn--after 'in Al" 4 in the environment to carry out the solution The molten metal melted into the mold to prepare the cup of the present invention. The evaluation test of the produced riding money 。 (evaluation test 1) into 25, seeing side, 2.5 thick thick oxide plate, L Manufactured by the company, the product name is ssa_s) as: 妾::枓: set on a hot plate heated to 27 ,, pre-applied with a tip that applies ultrasonic vibration (Kurota Technology Co., Ltd. & The boring wave soldering device SUNBUNDER USM-III) is applied to the surface of the soldering iron coated on the oxidized top but at room temperature after the temperature of 20 201042053 is 130 μm. 5 5×5 grid, peeling test In the 5x5 grid, the 3X3 mesh of the central part is used for the influence of the edge and the edge. Ο 是 It is the == alloy stripping on the purely printed substrate of the county. As a result, it was confirmed that the addition of "2" was also obtained for the oxidized member having an oxidized surface (evaluation test 2), and the glass substrate of the film having a thickness of 0.3 _ was formed, and the glass substrate of 〇7 = drought was taken as The material is joined and heated in Jia County. After that, the ultrasonic vibration was added to the work, and the ultrasonic welding of the rrNDrsM_m was made. The thickness of the bridge was 0.1 μm, and it was applied to the glass substrate to form m = ; = ; Slow cooling. The cutting is performed so that the two chambers are two; the =: the surface is in a lattice shape of 5 m square. Regarding the subtraction, in the forest of 5 X 5 , the rabbit τ does not sound and the central portion 3 = is used. In order to ignore the shadow of the edge part of the two ί = knot: is not confirmed to confront. The film coated invention is referred to as tin 5 4 . From this result, it was confirmed that the solder alloy of the present invention 21 201042053 to which Sb was added can also obtain sufficient joint strength for a difficult-to-bond material such as Mo. (Evaluation Test 3) An A1 plate cut into a 30 mm square and l_0 mm thick was set as a material to be joined and heated to 24 Torr. (3) On the hot plate, after pre-heating, 'Using the tip of ultrasonic wave (SUNBUNDER USM-III manufactured by Kuroda Technology Co., Ltd.) with ultrasonic vibration applied, the thickness of the solder alloy of the present invention becomes 1 The 〇〇μπι method was applied to one surface of the A1 plate and slowly cooled in the atmosphere 17. A peeling sample was produced by cutting to make the surface of the solder applied after cooling to room temperature into a lattice shape of 5 mm square of 5 mm square. ^ Regarding the sample, in the 5x5 grid, in order to ignore the edge portion, the 3x3 grid of the central portion is utilized. ~ As a result of the peeling test, the original solder alloy to which the A1 plate was applied was not confirmed. From this result, it was confirmed that the solder alloy to which % is added can also obtain the joint strength of the A1 member having an oxidized surface. [Illustration of the diagram]

Fig. 1 is a photograph showing an example of an environmental test of the solder alloy of the present invention. Fig. 2 is a photograph showing an example of an accelerated structure of a solder alloy of a comparative example. [Main component symbol description] Μ 22

Claims (1)

201042053 VII. Patent application scope: 1. A solder alloy characterized by: in terms of weight percentage, the solder alloy comprises 0.9%~10.0% Ag, 0.01%~0.50% Ab, and 0.04%~3.00% Sb, . The ratio of Al/Sb satisfies the relationship of 0.25 or less but does not include 0, and the remaining portion contains Sn and unavoidable impurities. 2. The solder alloy of claim 1, wherein: the ratio of Al/Sb is less than or equal to 0.18 but does not include zero. 3. The solder alloy according to claim 1 or 2, wherein the Ag is 1.0% to 8.5% by weight. 4. The solder alloy of claim 1, wherein: A1 is 0.01% to 0.40% by weight percent. 5. The solder alloy of claim 1, wherein: A1 is 0.12% to 0.35% by weight percent. 6. The solder alloy according to claim 1, wherein: widely expressed as a weight percentage, Sb is from 0.50% to 3.00%. ❹ 7. The solder alloy of claim 1, wherein: ^ is expressed by weight percent, and Sb is 1.00% to 2.50%. The solder alloy according to claim 1, wherein: the weight percentage includes one or both of Y of less than or equal to 1.0% and Ge of less than 1.0%. 9. The solder alloy of claim 1, wherein: the solder alloy is a bonding alloy or a member having an oxidized surface. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> Into = 24