JP2010538465A - 電気相互接続および熱管理のための構造およびプロセス - Google Patents
電気相互接続および熱管理のための構造およびプロセス Download PDFInfo
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Abstract
Description
22 構造体
24 第一基板
26 回路要素
28 第二基板
30 冷却剤チャネルスルーホール
32 金属ボンディング要素
34 冷却剤チャネル
36 電気フィードスルー
38 電気相互接続
40 分離リング
42 非導電領域
44 内部チャネル絶縁体
46 ボンディング平面
48 金属ボンディング要素
50 冷却剤スルーホール
52 冷却剤スルーホール
54 第三基板
58 冷却剤スルーホール
60 冷却剤スルーホール
62 第一冷却剤チャネル
64 第二冷却剤チャネル
68 電気フィードスルー
70 バレルビア
72 中央スルーホールチャネル
74 バレルビア
76 中央スルーホールチャネル
78 第一層
80 導電金属
84 第二層
100 入口
102 出口
104 冷却剤マニホールド
106 IC積層体
108 熱交換器
110 パイプ
112 回路基板
Claims (48)
- 熱管理のための構造であって、
共に接合された第一および第二基板であって、前記第一および第二基板のうち少なくともひとつの基板が少なくともひとつの回路要素を含んだ第一および第二基板と、
前記第一および第二基板のうちの少なくともひとつの基板の厚さにわたって延在する長さを有する入口スルーホールと、
前記第一および第二基板のうち少なくともひとつの基板の厚さにわたって延在する長さを有する出口スルーホールと、
前記第一および第二基板の間の封止を形成し、かつ前記第一および第二基板の間に空間を形成しているボンディング要素と、
前記第一および第二基板の間の前記空間に形成された第一冷却剤チャネルとを備え、
前記回路要素に冷却を提供するために、前記入口スルーホールに入る流体が前記第一冷却剤チャネルおよび前記出口スルーホールを移動する熱管理のための構造。 - 前記第一基板または前記第二基板の厚さを横切って延在し、かつ前記回路要素への電気接続を備える金属相互接続をさらに備える請求項1に記載の構造。
- 前記入口スルーホールおよび前記出口スルーホールのうち少なくともひとつが、前記第一基板または前記第二基板の厚さを横切って延在する金属導管を備える請求項1に記載の構造。
- 前記金属導管が、前記第一基板または前記第二基板の厚さを横切って延在しかつ前記回路要素への電気接続を備える金属相互接続を備える請求項3に記載の構造。
- 前記金属導管がフランジを備える請求項3に記載の構造。
- 前記第一基板または前記第二基板の厚さにわたって延在し、かつ前記フランジに接続された金属相互接続をさらに備える請求項5に記載の構造。
- 前記金属相互接続を前記入口スルーホールまたは前記出口スルーホールの内部から隔離する電気絶縁体をさらに備える請求項6に記載の構造。
- 前記電気絶縁体が、空気領域、不活性ガス領域、SiO2層、Si3N4層、SiOxNy層、非多孔質絶縁層、高分子層、またはそれらの任意の組み合わせを備える請求項7に記載の構造。
- 前記金属導管を囲む電気絶縁領域をさらに備える請求項3に記載の構造。
- 前記電気絶縁領域が空気領域、不活性ガス領域、SiO2層、Si3N4層、SiOxNy層、非多孔質絶縁層、高分子層、またはそれらの任意の組み合わせを備える請求項9に記載の構造。
- 前記ボンディング要素が、前記第一および第二基板を接合する共晶合金を備える請求項1に記載の構造。
- 前記共晶合金がCu、Sn、Au、およびPbのうち少なくともひとつを含む合金を備える請求項11に記載の方法。
- 前記第一冷却剤チャネルが前記第一および第二基板の間に流体の流れのための起伏のある経路を備える請求項1に記載の構造。
- 前記起伏のある経路が蛇行した経路および渦巻き経路の少なくともひとつを備える請求項13に記載の構造。
- 前記入口スルーホールおよび前記出口スルーホールの少なくともひとつが前記第一基板または前記第二基板を通る二つの通路を備え、前記通路が前記第一冷却剤チャネルに接続している請求項1に記載の構造。
- 前記二つの通路の少なくともひとつが前記通路の内面に設置された内部絶縁体を有する請求項15に記載の構造。
- 前記内部絶縁体が空気領域、不活性ガス領域、SiO2層、Si3N4層、SiOxNy層、非多孔質絶縁層、高分子層、またはそれらの任意の組み合わせを備える請求項16に記載の構造。
- 前記少なくともひとつの回路要素が発熱回路を備える請求項1に記載の構造。
- 第三基板をさらに備え、かつ少なくともひとつの前記第一、第二、および第三基板が発熱回路を含む請求項1に記載の構造。
- 前記第二および第三基板の間の空間に形成された第二冷却剤チャネルをさらに備え、前記第二冷却剤チャネルが前記第二および第三基板への冷却を提供する請求項19に記載の構造。
- 回路デバイスの熱管理のための構造を作る方法であって、
第一基板および第二基板を設けるステップであって、前記第一および第二基板のうち少なくともひとつが回路要素を含んでいるステップと、
前記第一基板および前記第二基板の少なくともひとつに前記第一基板または前記第二基板の厚さにわたって延在する入口スルーホールを形成するステップと、
前記第一基板および前記第二基板の少なくともひとつに前記第一基板または前記第二基板の厚さにわたって延在する出口スルーホールを形成するステップと、
前記第一および第二基板の少なくともひとつに各ボンディング要素を形成するステップと、
前記第一および第二基板の間に封止を形成し、かつ前記第一および第二基板の間に第一冷却剤チャネルを形成するために前記各ボンディング要素にて前記第一および第二基板をボンディングするステップと、
を備える回路デバイスの熱管理のための構造を作る方法。 - 各ボンディング要素を形成するステップが前記第一および第二基板に金属ボンディング要素を形成するステップを備える請求項21に記載の方法。
- 前記入口スルーホールを形成するステップおよび前記出口スルーホールを形成するステップの少なくともひとつが前記回路要素への接続のための金属導管を形成するステップを備える請求項21に記載の方法。
- 前記入口スルーホールを形成するステップおよび前記出口スルーホールを形成するステップの少なくともひとつが、前記金属導管を囲む電気絶縁領域を形成するステップを備える請求項23に記載の方法。
- 金属導管を形成するステップがフランジを有する前記金属導管を形成するステップを備える請求項23に記載の方法。
- 回路要素への電気接続を形成するために前記第一または前記第二基板の厚さにわたって延在する金属相互接続を形成するステップをさらに備える請求項25に記載の方法。
- 前記ボンディングの上に、前記金属相互接続に前記フランジを接続するステップをさらに備える請求項26に記載の方法。
- 金属相互接続を形成するステップが前記入口スルーホールまたは前記出口スルーホールの一部として前記金属相互接続を形成するステップを備える請求項26に記載の方法。
- 金属相互接続を形成するステップが電気絶縁体を使用して前記金属相互接続を前記スルーホール内部から隔離するステップを備える請求項26に記載の方法。
- 各金属ボンディング要素を形成するステップが前記第一および第二基板の間の前記第一冷却剤チャネルのための起伏のある経路を形成するステップを備える請求項21に記載の方法。
- 起伏のある経路を形成するステップが蛇行した経路および渦巻き経路の少なくともひとつを形成するステップを備える請求項30に記載の方法。
- 前記入口スルーホールを形成するステップおよび前記出口スルーホールを形成するステップの少なくともひとつが前記第一基板または前記第二基板を通る二つの通路を形成するステップを備え、前記通路が前記第一冷却剤チャネルに接続している請求項21に記載の方法。
- 前記通路の内面に内部絶縁体を配置するステップをさらに備える請求項32に記載の方法。
- 第三基板を設けるステップであって、少なくともひとつの前記第一、第二、および第三基板が発熱回路を含むステップと、
前記第二および第三基板の冷却のために、前記第二および第三基板の間の空間に第二冷却剤チャネルを形成するステップとをさらに備える請求項21に記載の方法。 - 第一および第二基板の熱管理システムであって、前記第一および第二基板の少なくともひとつが回路要素を含み、
前記第一および第二基板の少なくともひとつの基板の入口スルーホールを通じて流体を供給し、かつ前記第一および第二基板の少なくともひとつの基板の出口スルーホール通じて前記流体を除去するために構成された流体供給であって、前記流体は前記第一基板および第二基板の間の第一冷却剤チャネルを通り流れ、前記第一冷却剤チャネルは前記第一基板を前記第二基板に接合する少なくともひとつのボンディング要素により封止されている流体供給と、
前記流体に蓄積した熱を消散するよう構成された放熱器とを
備える熱管理システム。 - 前記放熱器が前記入口スルーホールに戻る前に前記流体を冷却するよう構成された熱交換器を備える請求項35に記載のシステム。
- 前記放熱器が流体の流れが前記出口スルーホールを通った後に前記流体を周囲に分配するよう構成された流体分配器を備える請求項35に記載のシステム。
- 前記流体供給が気体供給および液体供給の少なくともひとつを備える請求項35に記載のシステム。
- 前記気体供給が炭化水素系供給、フッ素化炭化水素系供給、塩素化炭化水素系供給、ヘリウム供給、水素供給、窒素供給、および空気供給の少なくともひとつを備える請求項38に記載のシステム。
- 前記液体供給が水、液化炭化水素系供給、液化フッ素化炭化水素系供給、液化塩素化炭化水素系供給、および液体窒素供給の少なくともひとつを備える請求項38に記載のシステム。
- 第一および第二基板の熱管理方法であって、前記第一および第二基板の少なくともひとつが回路要素を含み、
前記第一および第二基板の少なくともひとつの基板の入口スルーホール通じて流体を供給するステップと、
前記第一基板および第二基板の間の第一冷却剤チャネルを通じて前記流体を流すステップであって、前記第一冷却剤チャネルは前記第一基板を前記第二基板に接合する少なくともひとつのボンディング要素により封止されている、流体を流すステップと、
前記第一および第二基板の少なくともひとつの基板の出口スルーホールを通じて前記第一冷却剤チャネルから前記流体を除去するステップとを
備える熱管理方法。 - 前記入口スルーホールに戻る前に前記流体に蓄積された熱を消散させるステップをさらに備える請求項41に記載の方法。
- 熱を消散させるステップが前記入口スルーホールに戻る前に熱交換器を通り前記流体を循環させるステップを備える請求項41に記載の方法。
- 前記出口スルーホールを通る流体の流れの後に前記流体を周囲に分配するステップをさらに備える請求項41に記載の方法。
- 流体を供給するステップが前記第一冷却剤チャネルに気体または液体の少なくともひとつを供給するステップを備える請求項41に記載の方法。
- 気体または液体の少なくともひとつを供給するステップが、炭化水素系気体、フッ素化炭化水素系気体、塩素化炭化水素系気体、ヘリウム、水素、窒素、または空気のひとつを供給するステップを備える請求項45に記載の方法。
- 気体または液体の少なくともひとつを供給するステップが水、炭化水素系液体、フッ素化炭化水素系液体、塩素化炭化水素系液体、または液体窒素のひとつを供給するステップを備える請求項45に記載の方法。
- 前記第二基板および第三基板の間の空間により形成された第二冷却剤チャネルに前記流体を供給するステップをさらに備える請求項41に記載の方法。
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US20120048596A1 (en) | 2012-03-01 |
US8486765B2 (en) | 2013-07-16 |
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