JP2010538451A - 発光素子 - Google Patents
発光素子 Download PDFInfo
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- JP2010538451A JP2010538451A JP2010522795A JP2010522795A JP2010538451A JP 2010538451 A JP2010538451 A JP 2010538451A JP 2010522795 A JP2010522795 A JP 2010522795A JP 2010522795 A JP2010522795 A JP 2010522795A JP 2010538451 A JP2010538451 A JP 2010538451A
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- Prior art keywords
- lead frame
- light emitting
- substrate
- heat
- emitting diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45139—Silver (Ag) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/642—Heat extraction or cooling elements characterized by the shape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09318—Core having one signal plane and one power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
Abstract
Description
21 第1リードフレーム
21a 凸部
22 第2リードフレーム
30 発光ダイオード
40 ワイヤー
50 モールディング部材
60 熱伝導装置
61 ビア
62 金属層
60a 凹部
70 熱伝達パッド
Claims (20)
- 基板と、
前記基板の上に形成された第1リードフレーム及び第2リードフレームと、
前記第1リードフレーム及び第2リードフレームと電気的に連結され、前記第1リードフレームに実装された第1発光ダイオードと、
前記基板の上に形成され、前記第1リードフレームと電気的に分離されて配置された熱伝導装置と、
前記第1リードフレーム及び前記熱伝導装置と接触して前記第1リードフレーム及び前記熱伝導装置を熱的に連結させる熱伝達パッドと、が含まれる発光素子。 - 前記第1リードフレームと前記第1発光ダイオードは直接またはワイヤーを介在して電気的に連結される請求項1に記載の発光素子。
- 前記第2リードフレームと前記第1発光ダイオードはワイヤーを介在して電気的に連結される請求項1に記載の発光素子。
- 前記熱伝導装置は前記基板を貫通するビアと連結される請求項1に記載の発光素子。
- 前記ビアは前記基板の背面に配置された金属層と連結される請求項4に記載の発光素子。
- 前記熱伝達パッドはテープ、塗料、樹脂中の少なくともいずれか1つである請求項1に記載の発光素子。
- 前記第1リードフレーム及び熱伝導装置中の一方は凸状の凸部が形成され、他方は前記凸部を囲む凹部が形成される請求項1に記載の発光素子。
- 前記第1リードフレームにおいて、前記熱伝達パッドと接触する部分の少なくとも一部分は、前記熱伝達パッドと接触しない部分よりも熱伝導度が高い物質から形成される請求項1に記載の発光素子。
- 前記熱伝導装置において、前記熱伝達パッドと接触する部分の少なくとも一部分は、前記熱伝達パッドと接触しない部分よりも熱伝導度が高い物質から形成される請求項1に記載の発光素子。
- 前記熱伝達パッドは、前記第2リードフレームと前記熱伝導装置も熱的に連結させる請求項1に記載の発光素子。
- 前記熱伝達パッドは、前記第1リードフレームと、前記熱伝導装置と、及び前記第1リードフレームと熱伝導装置の間に露出される基板と、の上に形成される請求項1に記載の発光素子。
- 前記基板の上に形成された第3リードフレーム及び第4リードフレームと、
前記第3リードフレーム及び第4リードフレームと電気的に連結され、前記第3リードフレームに実装された第2発光ダイオードと、が含まれ、
前記第2リードフレームと第3リードフレームは連結されて一体に形成、またはワイヤーを介在して電気的に連結される請求項1に記載の発光素子。 - 基板と、
前記基板の上に形成された第1リードフレーム及び第2リードフレームと、
前記基板の上に形成され、前記第1リードフレーム及び第2リードフレームと電気的に分離されて配置された熱伝導装置と、
前記熱伝導装置の上に実装され、前記第1リードフレーム及び第2リードフレームと電気的に連結される発光ダイオードと、が含まれる発光素子。 - 前記熱伝導装置は基板を貫通するビアと連結され、前記ビアは前記基板の背面に形成された金属層と連結される請求項13に記載の発光素子。
- 基板と、
前記基板の上に形成された第1リードフレーム、第2リードフレーム、第3リードフレーム及び第4リードフレームと、
前記基板の上に形成された第1熱伝導装置及び第2熱伝導装置と、
前記第1熱伝導装置の上に実装され、前記第1リードフレーム及び第2リードフレームと電気的に連結される第1発光ダイオードと、
前記第3リードフレームの上に実装され、前記第3リードフレーム及び第4リードフレームと電気的に連結される第2発光ダイオードと、
前記第3リードフレームと前記第2熱伝導装置と接触し、前記第3リードフレームと前記第2熱伝導装置を熱的に連結させる熱伝達パッドと、が含まれる発光素子。 - 前記第1熱伝導装置及び第2熱伝導装置は前記基板を貫通するビアと連結され、前記ビアは前記基板の背面に形成される金属層と連結される請求項15に記載の発光素子。
- 前記熱伝達パッドは、前記第3リードフレームと、前記第2熱伝導装置と、及び前記第3リードフレームと前記第2熱伝導装置の間に露出された基板と、の上に形成される請求項15に記載の発光素子。
- 前記熱伝達パッドはテープ、塗料、樹脂中少なくともいずれか1つである請求項15に記載の発光素子。
- 前記基板の上に形成された第5リードフレーム及び第6リードフレームと、
前記第5リードフレーム及び第6リードフレームと電気的に連結され、前記第5リードフレームに実装された第3発光ダイオードと、が含まれ、
前記第4リードフレームと第5リードフレームは連結されて一体に形成、またはワイヤーを介在して電気的に連結される請求項15に記載の発光素子。 - 前記基板の上に形成された第7リードフレーム、第8リードフレーム及び第3熱伝導装置と、
前記第3熱伝導装置の上に形成された第4発光ダイオードと、が含まれ、
前記第4発光ダイオードは前記第7リードフレーム及び第8リードフレームと電気的に連結される請求項15に記載の発光素子。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2007-0086578 | 2007-08-28 | ||
KR1020070086578A KR100877877B1 (ko) | 2007-08-28 | 2007-08-28 | 발광 소자 |
PCT/KR2008/004668 WO2009028812A2 (en) | 2007-08-28 | 2008-08-11 | Light emitting device |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010538451A true JP2010538451A (ja) | 2010-12-09 |
JP5288642B2 JP5288642B2 (ja) | 2013-09-11 |
Family
ID=40387992
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010522795A Active JP5288642B2 (ja) | 2007-08-28 | 2008-08-11 | 発光素子 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8759846B2 (ja) |
EP (1) | EP2188849B1 (ja) |
JP (1) | JP5288642B2 (ja) |
KR (1) | KR100877877B1 (ja) |
CN (1) | CN101779301B (ja) |
TW (1) | TWI481067B (ja) |
WO (1) | WO2009028812A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20160017946A (ko) * | 2014-08-07 | 2016-02-17 | 엘지이노텍 주식회사 | 발광 모듈 |
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US9887338B2 (en) | 2009-07-28 | 2018-02-06 | Intellectual Discovery Co., Ltd. | Light emitting diode device |
US8896015B2 (en) * | 2010-06-25 | 2014-11-25 | Axlen, Inc. | LED package and method of making the same |
JP5685865B2 (ja) * | 2010-09-02 | 2015-03-18 | 住友ベークライト株式会社 | 光源装置 |
JP5685864B2 (ja) * | 2010-09-02 | 2015-03-18 | 住友ベークライト株式会社 | 光源装置 |
KR20120118686A (ko) | 2011-04-19 | 2012-10-29 | 엘지이노텍 주식회사 | 발광소자 모듈 |
KR101752447B1 (ko) * | 2011-06-01 | 2017-07-05 | 서울반도체 주식회사 | 발광 다이오드 어셈블리 |
CN105042527A (zh) * | 2015-08-13 | 2015-11-11 | 深圳市骏森光电子有限公司 | 一种用于安防的红外led灯珠及红外灯板 |
TR201514689A2 (tr) | 2015-11-20 | 2017-06-21 | Farba Otomotiv Aydinlatma Ve Plastik Fabrikalari Anonim Sirketi | Led esaslı aydınlatma sistemlerinde tercih edilen ışık motoru sistemi. |
WO2018218010A1 (en) * | 2017-05-24 | 2018-11-29 | Osram Sylvania Inc. | Lighting device modules |
US10986722B1 (en) * | 2019-11-15 | 2021-04-20 | Goodrich Corporation | High performance heat sink for double sided printed circuit boards |
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2007
- 2007-08-28 KR KR1020070086578A patent/KR100877877B1/ko active IP Right Grant
-
2008
- 2008-08-11 JP JP2010522795A patent/JP5288642B2/ja active Active
- 2008-08-11 US US12/671,179 patent/US8759846B2/en active Active
- 2008-08-11 WO PCT/KR2008/004668 patent/WO2009028812A2/en active Application Filing
- 2008-08-11 EP EP08793182.0A patent/EP2188849B1/en active Active
- 2008-08-11 CN CN2008801031739A patent/CN101779301B/zh active Active
- 2008-08-28 TW TW097133009A patent/TWI481067B/zh active
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JP2002198660A (ja) * | 2000-12-27 | 2002-07-12 | Kyocera Corp | 回路基板及びその製造方法 |
US6838702B1 (en) * | 2003-10-10 | 2005-01-04 | Lambda Opto Technology Co., Ltd | Light emitting diode |
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WO2009028812A3 (en) | 2009-04-23 |
CN101779301B (zh) | 2012-07-04 |
TWI481067B (zh) | 2015-04-11 |
EP2188849A4 (en) | 2013-10-16 |
EP2188849A2 (en) | 2010-05-26 |
JP5288642B2 (ja) | 2013-09-11 |
WO2009028812A2 (en) | 2009-03-05 |
EP2188849B1 (en) | 2015-02-18 |
US20100193807A1 (en) | 2010-08-05 |
US8759846B2 (en) | 2014-06-24 |
CN101779301A (zh) | 2010-07-14 |
TW200921950A (en) | 2009-05-16 |
KR100877877B1 (ko) | 2009-01-13 |
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