JP2010535283A - 添加剤存在下でのイオン液体を用いる金属電着方法 - Google Patents

添加剤存在下でのイオン液体を用いる金属電着方法 Download PDF

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Publication number
JP2010535283A
JP2010535283A JP2010518655A JP2010518655A JP2010535283A JP 2010535283 A JP2010535283 A JP 2010535283A JP 2010518655 A JP2010518655 A JP 2010518655A JP 2010518655 A JP2010518655 A JP 2010518655A JP 2010535283 A JP2010535283 A JP 2010535283A
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JP
Japan
Prior art keywords
chloride
anion
group
metal
ionic liquid
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Pending
Application number
JP2010518655A
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English (en)
Japanese (ja)
Inventor
クズマノビッチ,ボリス
ナブウルス−ウィレムス,ランバーダイン,ヨハンナ,ウィレミナ,マリア
ストリエン,コーネリス,ヨハンネス,ゴバーダス バン
ウェルター,フランズ,ウィンフリード
スピールマン,ヨハンナ,クリスティーナ
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Akzo Nobel NV
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Akzo Nobel NV
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Application filed by Akzo Nobel NV filed Critical Akzo Nobel NV
Publication of JP2010535283A publication Critical patent/JP2010535283A/ja
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/66Electroplating: Baths therefor from melts
    • C25D3/665Electroplating: Baths therefor from melts from ionic liquids
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25FPROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00Electrolytic etching or polishing
    • C25F3/16Polishing

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Engineering & Computer Science (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Catalysts (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electrolytic Production Of Metals (AREA)
JP2010518655A 2007-08-02 2008-07-30 添加剤存在下でのイオン液体を用いる金属電着方法 Pending JP2010535283A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP07113717 2007-08-02
US95443407P 2007-08-07 2007-08-07
PCT/EP2008/059962 WO2009016189A1 (fr) 2007-08-02 2008-07-30 Procédé pour électrodéposer des métaux à l'aide de liquides ioniques en présence d'un additif

Publications (1)

Publication Number Publication Date
JP2010535283A true JP2010535283A (ja) 2010-11-18

Family

ID=38870310

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010518655A Pending JP2010535283A (ja) 2007-08-02 2008-07-30 添加剤存在下でのイオン液体を用いる金属電着方法

Country Status (12)

Country Link
US (1) US20100252446A1 (fr)
EP (1) EP2171131B1 (fr)
JP (1) JP2010535283A (fr)
CN (1) CN101765681B (fr)
AT (1) ATE493523T1 (fr)
CA (1) CA2695488A1 (fr)
DE (1) DE602008004255D1 (fr)
ES (1) ES2358967T3 (fr)
HK (1) HK1143194A1 (fr)
PL (1) PL2171131T3 (fr)
TW (1) TWI359880B (fr)
WO (1) WO2009016189A1 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9580772B2 (en) * 2009-03-17 2017-02-28 Commonwealth Scientific And Industrial Research Organisation Electrorecovery of metals
DE102009035660A1 (de) * 2009-07-30 2011-02-03 Ewald Dörken Ag Verfahren zur elektrochemischen Beschichtung eines Werkstücks
US20120189778A1 (en) * 2011-01-26 2012-07-26 Riewe Curtis H Coating method using ionic liquid
CN102888630B (zh) * 2011-07-20 2015-11-18 中国科学院过程工程研究所 一种离子液体/添加剂体系低温电沉积制备纳米铝或纳米铝镀层的方法
US9758884B2 (en) * 2012-02-16 2017-09-12 Stacey Hingley Color control of trivalent chromium deposits
DE102012104707A1 (de) * 2012-05-31 2013-12-05 Benteler Automobiltechnik Gmbh Verfahren zum Herstellen eines Abgaswärmetauschers
WO2013182631A1 (fr) 2012-06-08 2013-12-12 Onderzoekscentrum Voor Aanwending Van Staal N.V. Procédé de production d'un revêtement métallique
CN102839403B (zh) * 2012-09-10 2015-02-25 太原理工大学 一种离子液体中电镀铝的方法
CN103484900A (zh) * 2013-09-18 2014-01-01 湖南工业大学 一种离子液体中直接电沉积晶态纳米晶无微裂纹铬镀层的方法
WO2015088859A2 (fr) 2013-12-10 2015-06-18 Lei Chen Alliage nickel-chrome électrodéposé
EP3080338B1 (fr) 2013-12-10 2018-10-03 Lei Chen Composite de nickel-chrome-aluminium par électrodéposition
US10378118B2 (en) * 2013-12-11 2019-08-13 United Technologies Corporation Electroformed nickel-chromium alloy
CN104294327B (zh) * 2014-10-20 2016-07-13 中国科学院过程工程研究所 一种离子液体电解液及用该电解液制备光亮铝镀层的方法
CN105220216B (zh) * 2015-09-28 2017-08-25 中国科学院兰州化学物理研究所 一种铝或铝合金电化学抛光方法
TWI662162B (zh) * 2016-11-15 2019-06-11 財團法人工業技術研究院 一種電鍍方法及其系統
JP7072796B2 (ja) * 2018-02-19 2022-05-23 国立大学法人 名古屋工業大学 調光部材
US20210156041A1 (en) * 2019-11-22 2021-05-27 Hamilton Sundstrand Corporation Metallic coating and method of application

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265120A (en) * 1975-11-26 1977-05-30 Sony Corp Electro plating method of aluminium or aluminium alloy
JP2004509927A (ja) * 2000-09-27 2004-04-02 サイオニックス・リミテッド イオン性液体類及びその使用方法
JP2004509945A (ja) * 2000-09-27 2004-04-02 サイオニックス・リミテッド イオン性液体類及び溶媒としてのその使用方法
JP2007070698A (ja) * 2005-09-07 2007-03-22 Kyoto Univ 金属の電析方法
JP2008523242A (ja) * 2004-12-10 2008-07-03 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング イオン性液体中でのタンタルおよび/または銅の電気化学的沈着
JP2009526910A (ja) * 2006-02-15 2009-07-23 アクゾ ノーベル ナムローゼ フェンノートシャップ イオン液体を用いる金属電着法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132571A (ja) * 1987-11-18 1989-05-25 Aguro Kanesho Kk 農園芸用殺菌剤
US6552843B1 (en) * 2002-01-31 2003-04-22 Innovative Technology Licensing Llc Reversible electrodeposition device with ionic liquid electrolyte
US20050205425A1 (en) * 2002-06-25 2005-09-22 Integran Technologies Process for electroplating metallic and metall matrix composite foils, coatings and microcomponents
US6721080B1 (en) * 2002-09-27 2004-04-13 D Morgan Tench Optimum switching of a reversible electrochemical mirror device
US6798556B2 (en) * 2003-01-31 2004-09-28 Rockwell Scientific Licensing, Llc. Locally-switched reversible electrodeposition optical modulator
US7320832B2 (en) * 2004-12-17 2008-01-22 Integran Technologies Inc. Fine-grained metallic coatings having the coefficient of thermal expansion matched to the one of the substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5265120A (en) * 1975-11-26 1977-05-30 Sony Corp Electro plating method of aluminium or aluminium alloy
JP2004509927A (ja) * 2000-09-27 2004-04-02 サイオニックス・リミテッド イオン性液体類及びその使用方法
JP2004509945A (ja) * 2000-09-27 2004-04-02 サイオニックス・リミテッド イオン性液体類及び溶媒としてのその使用方法
JP2008523242A (ja) * 2004-12-10 2008-07-03 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング イオン性液体中でのタンタルおよび/または銅の電気化学的沈着
JP2007070698A (ja) * 2005-09-07 2007-03-22 Kyoto Univ 金属の電析方法
JP2009526910A (ja) * 2006-02-15 2009-07-23 アクゾ ノーベル ナムローゼ フェンノートシャップ イオン液体を用いる金属電着法

Also Published As

Publication number Publication date
HK1143194A1 (en) 2010-12-24
DE602008004255D1 (de) 2011-02-10
TW200925334A (en) 2009-06-16
CA2695488A1 (fr) 2009-02-05
US20100252446A1 (en) 2010-10-07
PL2171131T3 (pl) 2011-05-31
EP2171131B1 (fr) 2010-12-29
TWI359880B (en) 2012-03-11
ATE493523T1 (de) 2011-01-15
WO2009016189A1 (fr) 2009-02-05
EP2171131A1 (fr) 2010-04-07
CN101765681B (zh) 2013-03-20
CN101765681A (zh) 2010-06-30
ES2358967T3 (es) 2011-05-17

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