JP2010531057A - フィルムキャリアテープの製造方法 - Google Patents
フィルムキャリアテープの製造方法 Download PDFInfo
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- JP2010531057A JP2010531057A JP2010513106A JP2010513106A JP2010531057A JP 2010531057 A JP2010531057 A JP 2010531057A JP 2010513106 A JP2010513106 A JP 2010513106A JP 2010513106 A JP2010513106 A JP 2010513106A JP 2010531057 A JP2010531057 A JP 2010531057A
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- pattern
- carrier tape
- sprocket hole
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/005—Punching of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Abstract
Description
図2〜図18は本発明の一実施例によるフィルムキャリアテープの製造方法を説明するための図面である。
図19は本発明の他の実施例によるフィルムキャリアテープの製造方法を表す順序図である。
図20〜図21は本発明によるまた他の実施例によるフィルムキャリアテープの製造方法を説明するための図面である。
図22または図27は本発明のまた他の実施例によるフィルムキャリアテープの製造方法を説明するための図面である。
図28は本発明のまた他の実施例によるフィルムキャリアテープの製造方法を表す順序図である。
Claims (9)
- フィルムキャリアテープ形成領域と第1スプロケットホール形成領域とに区分され、絶縁フィルムと該絶縁フィルム上に積層された導電層とを含むベースフィルムを供給することと;
前記第1スプロケットホール形成領域内に第1スプロケットホールを形成することと;
前記フィルムキャリアテープ形成領域内の前記導電層をパターニングして導電パターンを形成することと;
前記フィルムキャリアテープ形成領域内に第2スプロケットホールを形成することと、を含むフィルムキャリアテープの製造方法。 - 前記導電パターンが配線パターンと補強パターンとを含む請求項1のフィルムキャリアテープの製造方法。
- 前記補強パターンが該補強パターンの下部の前記絶縁フィルムを露出する開口部を含み、該開口部によって露出された該絶縁フィルムに前記第2スプロケットホールを形成する請求項2のフィルムキャリアテープの製造方法。
- 前記第2スプロケットホールが前記開口部よりも小さい請求項3のフィルムキャリアテープの製造方法。
- 前記導電パターンをメッキして、メッキされた配線パターンとメッキされた補強パターンとを形成し、該メッキされた補強パターンが該メッキされた補強パターン下部の前記絶縁フィルムを露出する開口部を含み、該開口部によって露出された該絶縁フィルムに前記第2スプロケットホールを形成する請求項2のフィルムキャリアテープの製造方法。
- 前記導電パターンが配線パターンと中間パターンとを含み、該中間パターンと前記絶縁フィルムとを同時に打ち抜いて、補強パターンを完成するとともに該絶縁フィルムに前記第2スプロケットホールを形成する請求項1のフィルムキャリアテープの製造方法。
- 前記導電層のパターニングが前記導電層上へのフォトレジストパターンの形成を含み、該フォトレジストパターンが前記配線パターンを形成するための第1パターンと前記補強パターンまたは前記中間パターンを形成するための第2パターンとを含む請求項2または請求項6のフィルムキャリアテープの製造方法。
- フィルムキャリアテープ形成領域と第1スプロケットホール形成領域とに区分され、絶縁フィルムと該絶縁フィルム上に積層された導電層とを含むベースフィルムを供給することと;
前記第1スプロケットホール形成領域内に第1スプロケットホールを形成することと;
前記第1スプロケットホールを形成した後、前記フィルムキャリアテープ形成領域内に第2スプロケットホールを形成することと、を含むフィルムキャリアテープの製造方法。 - 前記フィルムキャリアテープ形成領域上にフォトレジスト層を形成した後、前記第2スプロケットホールを形成する請求項8のフィルムキャリアテープの製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070061799A KR100818328B1 (ko) | 2007-06-22 | 2007-06-22 | 필름 캐리어 테이프의 제조 방법 |
PCT/KR2008/003425 WO2009002035A2 (en) | 2007-06-22 | 2008-06-17 | Method of manufacturing film carrier tape |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010531057A true JP2010531057A (ja) | 2010-09-16 |
JP2010531057A5 JP2010531057A5 (ja) | 2011-05-06 |
Family
ID=39533400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010513106A Pending JP2010531057A (ja) | 2007-06-22 | 2008-06-17 | フィルムキャリアテープの製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2010531057A (ja) |
KR (1) | KR100818328B1 (ja) |
WO (1) | WO2009002035A2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101870191B1 (ko) * | 2012-03-05 | 2018-06-22 | 해성디에스 주식회사 | 회로 기판 제조방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002299385A (ja) * | 2001-03-29 | 2002-10-11 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープ及びその製造方法 |
JP3463634B2 (ja) * | 1999-12-07 | 2003-11-05 | カシオ計算機株式会社 | キャリアテープの製造方法 |
JP2004273703A (ja) * | 2003-03-07 | 2004-09-30 | Shindo Denshi Kogyo Kk | テープキャリア、およびその製造方法 |
JP2006156856A (ja) * | 2004-12-01 | 2006-06-15 | Shindo Denshi Kogyo Kk | Cofテープの製造方法、およびcofテープ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3709452B2 (ja) * | 2002-06-26 | 2005-10-26 | 三井金属鉱業株式会社 | Cofフィルムキャリアテープの製造方法 |
JP2007067073A (ja) | 2005-08-30 | 2007-03-15 | Nitto Denko Corp | Tab用テープキャリアの製造方法 |
JP2007067272A (ja) * | 2005-09-01 | 2007-03-15 | Nitto Denko Corp | Tab用テープキャリアおよびその製造方法 |
-
2007
- 2007-06-22 KR KR1020070061799A patent/KR100818328B1/ko not_active IP Right Cessation
-
2008
- 2008-06-17 WO PCT/KR2008/003425 patent/WO2009002035A2/en active Application Filing
- 2008-06-17 JP JP2010513106A patent/JP2010531057A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3463634B2 (ja) * | 1999-12-07 | 2003-11-05 | カシオ計算機株式会社 | キャリアテープの製造方法 |
JP2002299385A (ja) * | 2001-03-29 | 2002-10-11 | Mitsui Mining & Smelting Co Ltd | 電子部品実装用フィルムキャリアテープ及びその製造方法 |
JP2004273703A (ja) * | 2003-03-07 | 2004-09-30 | Shindo Denshi Kogyo Kk | テープキャリア、およびその製造方法 |
JP2006156856A (ja) * | 2004-12-01 | 2006-06-15 | Shindo Denshi Kogyo Kk | Cofテープの製造方法、およびcofテープ |
Also Published As
Publication number | Publication date |
---|---|
WO2009002035A2 (en) | 2008-12-31 |
WO2009002035A3 (en) | 2009-02-26 |
KR100818328B1 (ko) | 2008-04-02 |
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