JP2010530908A5 - - Google Patents
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- Publication number
- JP2010530908A5 JP2010530908A5 JP2010511597A JP2010511597A JP2010530908A5 JP 2010530908 A5 JP2010530908 A5 JP 2010530908A5 JP 2010511597 A JP2010511597 A JP 2010511597A JP 2010511597 A JP2010511597 A JP 2010511597A JP 2010530908 A5 JP2010530908 A5 JP 2010530908A5
- Authority
- JP
- Japan
- Prior art keywords
- curable composition
- group
- ion
- epoxy compound
- use according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 15
- 150000001875 compounds Chemical class 0.000 claims 9
- 239000004593 Epoxy Substances 0.000 claims 8
- 125000004432 carbon atom Chemical group C* 0.000 claims 3
- 239000003054 catalyst Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 claims 3
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical group [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 150000004693 imidazolium salts Chemical class 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 125000000962 organic group Chemical group 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 2
- 229940085991 phosphate ion Drugs 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 150000001450 anions Chemical class 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 230000008030 elimination Effects 0.000 claims 1
- 238000003379 elimination reaction Methods 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- GQZXNSPRSGFJLY-UHFFFAOYSA-N hydroxyphosphanone Chemical group OP=O GQZXNSPRSGFJLY-UHFFFAOYSA-N 0.000 claims 1
- 229940005631 hypophosphite ion Drugs 0.000 claims 1
- 238000001802 infusion Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- -1 metaphosphate ion Chemical class 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 229910052698 phosphorus Inorganic materials 0.000 claims 1
- 239000011574 phosphorus Substances 0.000 claims 1
- 239000004753 textile Substances 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07110279 | 2007-06-14 | ||
| EP07110279.2 | 2007-06-14 | ||
| PCT/EP2008/057115 WO2008152002A1 (de) | 2007-06-14 | 2008-06-06 | Katalysator für die härtung von epoxiden |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010530908A JP2010530908A (ja) | 2010-09-16 |
| JP2010530908A5 true JP2010530908A5 (enExample) | 2011-07-21 |
| JP5260639B2 JP5260639B2 (ja) | 2013-08-14 |
Family
ID=39830825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010511597A Expired - Fee Related JP5260639B2 (ja) | 2007-06-14 | 2008-06-06 | エポキシドの硬化のための触媒 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US8202580B2 (enExample) |
| EP (1) | EP2158250B1 (enExample) |
| JP (1) | JP5260639B2 (enExample) |
| KR (1) | KR101438867B1 (enExample) |
| CN (1) | CN101687977B (enExample) |
| AT (1) | ATE531746T1 (enExample) |
| TW (1) | TWI426091B (enExample) |
| WO (1) | WO2008152002A1 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008152005A1 (de) | 2007-06-12 | 2008-12-18 | Basf Se | Katalysator für die härtung von epoxiden |
| JP5407861B2 (ja) * | 2007-07-26 | 2014-02-05 | 味の素株式会社 | 樹脂組成物 |
| JP5377990B2 (ja) * | 2009-01-26 | 2013-12-25 | 株式会社ティ−アンドケイ東華 | 液状の潜在性硬化剤組成物及び一液性の硬化性エポキシド組成物 |
| WO2011025040A1 (ja) * | 2009-08-31 | 2011-03-03 | 日本合成化学工業株式会社 | エポキシ樹脂用硬化剤 |
| EP2387081B1 (en) | 2010-05-11 | 2015-09-30 | Samsung Electronics Co., Ltd. | Semiconductor light emitting device and method for fabricating the same |
| WO2012136273A1 (de) | 2011-04-08 | 2012-10-11 | Basf Se | Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen |
| JP5652617B2 (ja) * | 2011-04-27 | 2015-01-14 | 大日本印刷株式会社 | 熱硬化型粘接着剤組成物、粘接着シート、及び粘接着シートの製造方法 |
| JP6109611B2 (ja) * | 2013-03-18 | 2017-04-05 | 積水化学工業株式会社 | 熱硬化性樹脂組成物、及び、半導体装置の製造方法 |
| DE102013008723A1 (de) | 2013-05-23 | 2014-11-27 | Deutsche Institute Für Textil- Und Faserforschung Denkendorf | Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung |
| PT3107733T (pt) * | 2014-02-19 | 2018-12-24 | Basf Se | Método e instalação para o revestimento de produtos de rolos |
| US10073845B2 (en) | 2015-01-07 | 2018-09-11 | International Business Machines Corporation | Estimating article publication dates and authors based on social media context |
| JP6137407B2 (ja) * | 2015-03-27 | 2017-05-31 | 東レ株式会社 | 繊維強化複合材料用２液型エポキシ樹脂組成物および繊維強化複合材料 |
| US10035926B2 (en) * | 2016-04-22 | 2018-07-31 | PRC—DeSoto International, Inc. | Ionic liquid catalysts in sulfur-containing polymer compositions |
| KR102698219B1 (ko) * | 2021-11-26 | 2024-08-26 | 한국과학기술연구원 | 에폭시 수지용 잠재성 경화제의 제조방법 및 이에 따른 에폭시 수지용 잠재성 경화제 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3635894A (en) | 1969-11-06 | 1972-01-18 | Ppg Industries Inc | Curable epoxy resin compositions containing organoimidazolium salt |
| DE2416408C3 (de) | 1974-04-04 | 1978-08-17 | Hitachi Chemical Co., Ltd. | Wärmehärtbare Gemische auf der Basis eines Epoxyharzes und einer komplexen Imidazoliumsalzverbindung und ihr Herstellungsverfahren |
| FR2486079A1 (fr) * | 1980-07-07 | 1982-01-08 | Rhone Poulenc Agrochimie | Sels quaternaires d'alcoyl-1-imidazolium de l'acide phosphoreux ou ses monoesters, procedes pour les preparer et compositions fongicides les contenant |
| JPS6129321A (ja) * | 1984-07-20 | 1986-02-10 | 松下電器産業株式会社 | 電気掃除機の床ノズル |
| JPS61293217A (ja) * | 1985-06-20 | 1986-12-24 | Masako Matsumoto | エポキシ樹脂硬化剤 |
| SG43193A1 (en) | 1990-05-21 | 1997-10-17 | Dow Chemical Co | Latent catalysts cure-inhibited epoxy resin compositions and laminates prepared therfrom |
| DE4110219A1 (de) | 1991-03-28 | 1992-10-01 | Huels Troisdorf | Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz |
| US5733954A (en) * | 1995-12-14 | 1998-03-31 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole |
| US6180696B1 (en) | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| WO2002048236A1 (en) * | 2000-12-14 | 2002-06-20 | Hitachi Chemical Co., Ltd. | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| CA2398682C (en) * | 2002-08-16 | 2007-11-13 | Cytec Technology Corp. | Phosphonium and imidazolium salts and methods of their preparation |
| JP2004217859A (ja) | 2003-01-17 | 2004-08-05 | Hitachi Chem Co Ltd | 接着シートの製造方法、半導体装置およびその製造方法 |
| DE10333239A1 (de) * | 2003-07-21 | 2005-03-10 | Basf Ag | Verfahren zur Herstellung von gereinigten 1,3- substituierten Imidazoliumsalzen |
| WO2005116038A1 (ja) * | 2004-05-28 | 2005-12-08 | San-Apro Limited | 新規なオニウムおよび遷移金属錯体のフッ素化アルキルフルオロリン酸塩 |
| JP4844130B2 (ja) | 2005-02-03 | 2011-12-28 | 住友化学株式会社 | β−ヒドロキシエーテル類の製造方法 |
| JP2007262401A (ja) * | 2006-03-03 | 2007-10-11 | San Apro Kk | 活性エネルギー線硬化性光学的立体造形用樹脂組成物およびそれを硬化した光造形物 |
-
2008
- 2008-06-06 WO PCT/EP2008/057115 patent/WO2008152002A1/de not_active Ceased
- 2008-06-06 KR KR1020107000779A patent/KR101438867B1/ko not_active Expired - Fee Related
- 2008-06-06 JP JP2010511597A patent/JP5260639B2/ja not_active Expired - Fee Related
- 2008-06-06 AT AT08760685T patent/ATE531746T1/de active
- 2008-06-06 CN CN2008800198886A patent/CN101687977B/zh active Active
- 2008-06-06 US US12/663,868 patent/US8202580B2/en active Active
- 2008-06-06 EP EP20080760685 patent/EP2158250B1/de active Active
- 2008-06-13 TW TW97122347A patent/TWI426091B/zh not_active IP Right Cessation
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