JP2007504341A5 - - Google Patents
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- Publication number
- JP2007504341A5 JP2007504341A5 JP2006529945A JP2006529945A JP2007504341A5 JP 2007504341 A5 JP2007504341 A5 JP 2007504341A5 JP 2006529945 A JP2006529945 A JP 2006529945A JP 2006529945 A JP2006529945 A JP 2006529945A JP 2007504341 A5 JP2007504341 A5 JP 2007504341A5
- Authority
- JP
- Japan
- Prior art keywords
- dicyandiamide
- accelerator according
- epoxy resin
- urea derivative
- combination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 4
- 150000003672 ureas Chemical class 0.000 claims 4
- 238000001723 curing Methods 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 2
- YBBLOADPFWKNGS-UHFFFAOYSA-N 1,1-dimethylurea Chemical compound CN(C)C(N)=O YBBLOADPFWKNGS-UHFFFAOYSA-N 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000001029 thermal curing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10324486A DE10324486A1 (de) | 2003-05-30 | 2003-05-30 | Verwendung von Harnstoff-Derivaten als Beschleuniger für Epoxidharze |
| PCT/EP2004/005787 WO2004106402A2 (de) | 2003-05-30 | 2004-05-28 | Verwendung von harnstoff-derivaten als beschleuniger für epoxidharze |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007504341A JP2007504341A (ja) | 2007-03-01 |
| JP2007504341A5 true JP2007504341A5 (enExample) | 2007-04-12 |
| JP4587323B2 JP4587323B2 (ja) | 2010-11-24 |
Family
ID=33441480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006529945A Expired - Lifetime JP4587323B2 (ja) | 2003-05-30 | 2004-05-28 | エポキシ樹脂のための促進剤としての尿素−誘導体の使用 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7750107B2 (enExample) |
| EP (1) | EP1629025B1 (enExample) |
| JP (1) | JP4587323B2 (enExample) |
| CN (1) | CN100560633C (enExample) |
| CA (1) | CA2527099C (enExample) |
| DE (1) | DE10324486A1 (enExample) |
| ES (1) | ES2524323T3 (enExample) |
| PL (1) | PL1629025T3 (enExample) |
| WO (1) | WO2004106402A2 (enExample) |
Families Citing this family (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE502007002766D1 (de) * | 2007-11-14 | 2010-03-18 | Sika Technology Ag | Hitzehärtende Epoxidharzzusammensetzung enthaltend nichtaromatische Harnstoffe als Beschleuniger |
| WO2009108882A1 (en) * | 2008-02-28 | 2009-09-03 | Jewish War Veterans, U.S.A. National Memorial, Inc. | Yahrzeit system and method |
| EP2128182A1 (de) * | 2008-05-28 | 2009-12-02 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend einen Beschleuniger mit Heteroatomen |
| ATE468344T1 (de) * | 2008-08-27 | 2010-06-15 | Sika Technology Ag | Silan-/harnstoff-verbindung als hitzeaktivierbarer härter für epoxidharzzusammensetzungen |
| US10657488B2 (en) * | 2009-07-14 | 2020-05-19 | Carefusion 303, Inc. | Portable inventory tracking system |
| DE102010020882A1 (de) | 2010-05-18 | 2011-11-24 | Alzchem Trostberg Gmbh | Semicarbazone zur Härtung von Epoxidharzen |
| EP2426160B1 (de) | 2010-09-03 | 2014-01-15 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung mit Wasser als Treibmittel |
| DK2678368T3 (en) * | 2011-02-23 | 2015-08-10 | Alzchem Ag | NEW HARDENERS for epoxy resins |
| JP5817206B2 (ja) | 2011-05-09 | 2015-11-18 | 横浜ゴム株式会社 | 繊維強化複合材料用エポキシ樹脂組成物 |
| DE102011118760A1 (de) | 2011-11-15 | 2013-05-16 | Alzchem Ag | Verwendung von N,N'(-Dimethyl)-Uronen sowie Verfahren zur Härtung von Epoxidharz-Zusammensetzungen |
| DE102011118501A1 (de) | 2011-11-15 | 2013-05-16 | Alzchem Ag | Alkyl- oder Dialkyl-Semicarbazone als Härter für Epoxidharze |
| SI2850119T1 (sl) * | 2012-05-18 | 2018-10-30 | Hexcel Composites Limited | Hitro strdljive epoksi smole in iz njih pridobljeni prepregi |
| GB2503503B (en) * | 2012-06-29 | 2015-04-29 | Gurit Uk Ltd | Prepregs for manufacturing composite materials |
| DK2880071T3 (da) | 2012-08-02 | 2017-01-02 | Alzchem Ag | Flydende hærdere til hærdning af epoxyharpikser |
| CN103665324B (zh) * | 2013-11-14 | 2015-10-07 | 昆山珍实复合材料有限公司 | 一种环氧树脂潜伏性固化剂及相应的环氧树脂涂料 |
| CN107001897A (zh) * | 2014-12-31 | 2017-08-01 | 陶氏环球技术有限责任公司 | 具有改善的低温抗冲击性和耐冲洗性的耐撞击环氧粘合剂组合物 |
| US10478261B2 (en) * | 2015-05-29 | 2019-11-19 | Deka Products Limited Partnership | System, method, and apparatus for remote patient care |
| US10975193B2 (en) | 2015-09-09 | 2021-04-13 | Carbon, Inc. | Epoxy dual cure resins for additive manufacturing |
| BR112018003401B1 (pt) * | 2015-09-10 | 2022-06-14 | Dow Global Technologies Llc | Adesivo de epóxi de um componente, método para uso do adesivo de epóxi, método para aderir um primeiro substrato oleoso a um segundo substrato, endurecedor elastomérico reativo tendo grupos isocianato capeados e adesivo de epóxi |
| EP3341792A1 (en) | 2015-12-22 | 2018-07-04 | Carbon, Inc. | Dual precursor resin systems for additive manufacturing with dual cure resins |
| CN106318302B (zh) * | 2016-08-22 | 2019-07-16 | 东莞市新懿电子材料技术有限公司 | 一种低温固化环氧树脂胶黏剂及其制备方法 |
| CN109689744B (zh) * | 2016-09-13 | 2023-05-23 | 陶氏环球技术有限责任公司 | 用于制备高面积重量纤维贮存稳定性预浸料或模制复合中间体的掺杂催化剂的上浆剂 |
| US11739241B2 (en) | 2017-06-23 | 2023-08-29 | Ddp Specialty Electronic Material Us, Llc | High temperature epoxy adhesive formulations |
| ES2927693T3 (es) | 2017-07-21 | 2022-11-10 | Huntsman Advanced Mat Americas Llc | Polímeros de butadieno terminado en urea y copolímeros de butadieno-acrilonitrilo |
| DE102017129487B4 (de) * | 2017-12-11 | 2021-03-18 | Vacuumschmelze Gmbh & Co. Kg | Epoxidharzmischung, deren Verwendung und Verfahren zur Herstellung einer Epoxidharzmischung |
| DE112019000385T5 (de) * | 2018-01-12 | 2020-09-17 | Ajinomoto Co., Inc. | Beschichtetes Teilchen |
| DE102019113291A1 (de) * | 2019-05-20 | 2020-11-26 | Thyssenkrupp Steel Europe Ag | Blech für die Herstellung einer elektromagnetischen Komponente, insbesondere eines Statorpakets oder eines Rotorpakets, sowie Verfahren zur Herstellung einer elektromagnetischen Komponente |
| DE102019121195A1 (de) * | 2019-08-06 | 2021-02-11 | Alzchem Trostberg Gmbh | Lagerstabile Epoxidharz-Zusammensetzung |
| DE102019128530B4 (de) * | 2019-10-22 | 2026-07-30 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verfahren zum Ermitteln einer Bauteildicke |
| US12590178B2 (en) * | 2020-03-25 | 2026-03-31 | Adeka Corporation | Curable resin composition and method for suppressing curing shrinkage of curable resin composition |
| DE102020109985A1 (de) * | 2020-04-09 | 2021-10-14 | Thyssenkrupp Steel Europe Ag | Verfahren zum Herstellen eines Blechpakets, Blechpaket und Elektrische Maschine |
| KR102778957B1 (ko) * | 2021-03-05 | 2025-03-12 | 헨켈 아게 운트 코. 카게아아 | 충돌 내구성, 응력 내구성 및 용접성 에폭시 접착제 |
| JP7475794B2 (ja) * | 2021-05-12 | 2024-04-30 | 信越化学工業株式会社 | 封止用樹脂組成物及び半導体装置 |
| MX2024006050A (es) * | 2022-03-03 | 2024-06-04 | Henkel Ag & Co Kgaa | Adhesivos estructurales epoxi resistentes a la humedad curados y sin curar. |
| CN118772377B (zh) * | 2024-09-10 | 2025-09-12 | 汉方新材料科技(嘉善)有限公司 | 一种脲类环氧固化促进剂、环氧导电银胶及制备方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010639B2 (enExample) * | 1972-10-27 | 1975-04-23 | ||
| JPS5426000A (en) * | 1977-07-28 | 1979-02-27 | Mitsubishi Chem Ind Ltd | Epoxy resin composition |
| JPS5693748A (en) | 1979-12-28 | 1981-07-29 | Semedain Kk | Epoxy resin composition with excellent thixotropic property |
| JPS56133856A (en) * | 1980-03-21 | 1981-10-20 | Nitto Electric Ind Co Ltd | Epoxy resin composition for sealing semiconductor |
| JPS6487667A (en) * | 1987-09-28 | 1989-03-31 | Yokohama Rubber Co Ltd | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
| JP2922283B2 (ja) * | 1990-09-28 | 1999-07-19 | 日本カーバイド工業株式会社 | 熱硬化性感圧接着剤組成物用アクリル系共重合体 |
| JPH05209110A (ja) * | 1992-01-30 | 1993-08-20 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物 |
| JPH10182794A (ja) * | 1996-12-25 | 1998-07-07 | Toto Kasei Co Ltd | 速硬化エポキシ樹脂組成物 |
| CN1346375A (zh) * | 1999-12-14 | 2002-04-24 | 三井化学株式会社 | 用于液晶盒的密封胶、用于液晶盒密封胶的组合物以及液晶显示器件 |
| US6403222B1 (en) * | 2000-09-22 | 2002-06-11 | Henkel Corporation | Wax-modified thermosettable compositions |
-
2003
- 2003-05-30 DE DE10324486A patent/DE10324486A1/de not_active Withdrawn
-
2004
- 2004-05-28 JP JP2006529945A patent/JP4587323B2/ja not_active Expired - Lifetime
- 2004-05-28 CA CA2527099A patent/CA2527099C/en not_active Expired - Fee Related
- 2004-05-28 PL PL04735210T patent/PL1629025T3/pl unknown
- 2004-05-28 US US10/558,160 patent/US7750107B2/en not_active Expired - Lifetime
- 2004-05-28 WO PCT/EP2004/005787 patent/WO2004106402A2/de not_active Ceased
- 2004-05-28 ES ES04735210.9T patent/ES2524323T3/es not_active Expired - Lifetime
- 2004-05-28 CN CNB2004800151472A patent/CN100560633C/zh not_active Expired - Lifetime
- 2004-05-28 EP EP04735210.9A patent/EP1629025B1/de not_active Expired - Lifetime
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