JP2007504341A5 - - Google Patents
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- Publication number
- JP2007504341A5 JP2007504341A5 JP2006529945A JP2006529945A JP2007504341A5 JP 2007504341 A5 JP2007504341 A5 JP 2007504341A5 JP 2006529945 A JP2006529945 A JP 2006529945A JP 2006529945 A JP2006529945 A JP 2006529945A JP 2007504341 A5 JP2007504341 A5 JP 2007504341A5
- Authority
- JP
- Japan
- Prior art keywords
- dicyandiamide
- accelerator according
- epoxy resin
- urea derivative
- combination
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 4
- 150000003672 ureas Chemical class 0.000 claims 4
- 238000001723 curing Methods 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 239000002131 composite material Substances 0.000 claims 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 2
- YBBLOADPFWKNGS-UHFFFAOYSA-N 1,1-dimethylurea Chemical compound CN(C)C(N)=O YBBLOADPFWKNGS-UHFFFAOYSA-N 0.000 claims 1
- 229930185605 Bisphenol Natural products 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000003973 paint Substances 0.000 claims 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000000843 powder Substances 0.000 claims 1
- 238000001029 thermal curing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10324486A DE10324486A1 (de) | 2003-05-30 | 2003-05-30 | Verwendung von Harnstoff-Derivaten als Beschleuniger für Epoxidharze |
| PCT/EP2004/005787 WO2004106402A2 (de) | 2003-05-30 | 2004-05-28 | Verwendung von harnstoff-derivaten als beschleuniger für epoxidharze |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007504341A JP2007504341A (ja) | 2007-03-01 |
| JP2007504341A5 true JP2007504341A5 (enExample) | 2007-04-12 |
| JP4587323B2 JP4587323B2 (ja) | 2010-11-24 |
Family
ID=33441480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006529945A Expired - Lifetime JP4587323B2 (ja) | 2003-05-30 | 2004-05-28 | エポキシ樹脂のための促進剤としての尿素−誘導体の使用 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7750107B2 (enExample) |
| EP (1) | EP1629025B1 (enExample) |
| JP (1) | JP4587323B2 (enExample) |
| CN (1) | CN100560633C (enExample) |
| CA (1) | CA2527099C (enExample) |
| DE (1) | DE10324486A1 (enExample) |
| ES (1) | ES2524323T3 (enExample) |
| PL (1) | PL1629025T3 (enExample) |
| WO (1) | WO2004106402A2 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE456596T1 (de) * | 2007-11-14 | 2010-02-15 | Sika Technology Ag | Hitzehärtende epoxidharzzusammensetzung enthaltend nichtaromatische harnstoffe als beschleuniger |
| US8230345B2 (en) * | 2008-02-28 | 2012-07-24 | Jewish War Veterans, U.S. National Memorial, Inc. | Yahrzeit system and method |
| EP2128182A1 (de) * | 2008-05-28 | 2009-12-02 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung enthaltend einen Beschleuniger mit Heteroatomen |
| EP2161274B1 (de) | 2008-08-27 | 2010-05-19 | Sika Technology AG | Silan-/Harnstoff-Verbindung als hitzeaktivierbarer Härter für Epoxidharzzusammensetzungen |
| US10657488B2 (en) * | 2009-07-14 | 2020-05-19 | Carefusion 303, Inc. | Portable inventory tracking system |
| DE102010020882A1 (de) | 2010-05-18 | 2011-11-24 | Alzchem Trostberg Gmbh | Semicarbazone zur Härtung von Epoxidharzen |
| EP2426160B1 (de) | 2010-09-03 | 2014-01-15 | Sika Technology AG | Hitzehärtende Epoxidharzzusammensetzung mit Wasser als Treibmittel |
| JP5976686B2 (ja) | 2011-02-23 | 2016-08-24 | アルツケム アクチェンゲゼルシャフト | エポキシ樹脂のための新規な硬化剤 |
| JP5817206B2 (ja) | 2011-05-09 | 2015-11-18 | 横浜ゴム株式会社 | 繊維強化複合材料用エポキシ樹脂組成物 |
| DE102011118760A1 (de) | 2011-11-15 | 2013-05-16 | Alzchem Ag | Verwendung von N,N'(-Dimethyl)-Uronen sowie Verfahren zur Härtung von Epoxidharz-Zusammensetzungen |
| DE102011118501A1 (de) | 2011-11-15 | 2013-05-16 | Alzchem Ag | Alkyl- oder Dialkyl-Semicarbazone als Härter für Epoxidharze |
| BR112014026244A2 (pt) * | 2012-05-18 | 2017-06-27 | Hexcel Composites Ltd | resinas epóxi de cura rápida e pré-impregnados obtidos das mesmas |
| GB2503503B (en) * | 2012-06-29 | 2015-04-29 | Gurit Uk Ltd | Prepregs for manufacturing composite materials |
| SI2880071T1 (sl) * | 2012-08-02 | 2017-01-31 | Alzchem Ag | Tekoče trdilo za strjevanje epoksidnih smol (I) |
| CN103665324B (zh) * | 2013-11-14 | 2015-10-07 | 昆山珍实复合材料有限公司 | 一种环氧树脂潜伏性固化剂及相应的环氧树脂涂料 |
| WO2016108958A1 (en) * | 2014-12-31 | 2016-07-07 | Dow Global Technologies Llc | Crash durable epoxy adhesive compositions having improved low-temperature impact resistance and wash off resistance |
| US10478261B2 (en) * | 2015-05-29 | 2019-11-19 | Deka Products Limited Partnership | System, method, and apparatus for remote patient care |
| US10975193B2 (en) | 2015-09-09 | 2021-04-13 | Carbon, Inc. | Epoxy dual cure resins for additive manufacturing |
| KR102625909B1 (ko) | 2015-09-10 | 2024-01-18 | 다우 글로벌 테크놀로지스 엘엘씨 | 유성 표면에 대한 개선된 접착력 및 높은 워시-오프 저항성을 갖는 일액형 강인화된 에폭시 접착제 |
| US10350823B2 (en) | 2015-12-22 | 2019-07-16 | Carbon, Inc. | Dual precursor resin systems for additive manufacturing with dual cure resins |
| CN106318302B (zh) * | 2016-08-22 | 2019-07-16 | 东莞市新懿电子材料技术有限公司 | 一种低温固化环氧树脂胶黏剂及其制备方法 |
| KR102421989B1 (ko) * | 2016-09-13 | 2022-07-19 | 다우 글로벌 테크놀로지스 엘엘씨 | 높은 면적 중량의 섬유 저장-안정성 프리프레그 또는 성형 화합물 중간체의 제조를 위한 촉매-도핑된 사이징제 |
| US11739241B2 (en) | 2017-06-23 | 2023-08-29 | Ddp Specialty Electronic Material Us, Llc | High temperature epoxy adhesive formulations |
| ES2927896T3 (es) | 2017-07-21 | 2022-11-11 | Huntsman Advanced Mat Americas Llc | Polímeros de butadieno terminado en urea y copolímeros de butadieno-acrilonitrilo |
| DE102017129487B4 (de) * | 2017-12-11 | 2021-03-18 | Vacuumschmelze Gmbh & Co. Kg | Epoxidharzmischung, deren Verwendung und Verfahren zur Herstellung einer Epoxidharzmischung |
| JP7275469B2 (ja) * | 2018-01-12 | 2023-05-18 | 味の素株式会社 | 被覆粒子 |
| DE102019113291A1 (de) * | 2019-05-20 | 2020-11-26 | Thyssenkrupp Steel Europe Ag | Blech für die Herstellung einer elektromagnetischen Komponente, insbesondere eines Statorpakets oder eines Rotorpakets, sowie Verfahren zur Herstellung einer elektromagnetischen Komponente |
| DE102019121195A1 (de) * | 2019-08-06 | 2021-02-11 | Alzchem Trostberg Gmbh | Lagerstabile Epoxidharz-Zusammensetzung |
| DE102019128530A1 (de) * | 2019-10-22 | 2021-04-22 | Deutsches Zentrum für Luft- und Raumfahrt e.V. | Verfahren und Vorrichtung zum Ermitteln einer Bauteildicke |
| US20230105437A1 (en) * | 2020-03-25 | 2023-04-06 | Adeka Corporation | Curable resin composition and method for suppressing curing shrinkage of curable resin composition |
| DE102020109985A1 (de) * | 2020-04-09 | 2021-10-14 | Thyssenkrupp Steel Europe Ag | Verfahren zum Herstellen eines Blechpakets, Blechpaket und Elektrische Maschine |
| JP2024512348A (ja) * | 2021-03-05 | 2024-03-19 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 衝撃耐性、耐応力性、及び溶接性を備えたエポキシ接着剤 |
| JP7475794B2 (ja) * | 2021-05-12 | 2024-04-30 | 信越化学工業株式会社 | 封止用樹脂組成物及び半導体装置 |
| CN118772377B (zh) * | 2024-09-10 | 2025-09-12 | 汉方新材料科技(嘉善)有限公司 | 一种脲类环氧固化促进剂、环氧导电银胶及制备方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5010639B2 (enExample) * | 1972-10-27 | 1975-04-23 | ||
| JPS5426000A (en) * | 1977-07-28 | 1979-02-27 | Mitsubishi Chem Ind Ltd | Epoxy resin composition |
| JPS5693748A (en) | 1979-12-28 | 1981-07-29 | Semedain Kk | Epoxy resin composition with excellent thixotropic property |
| JPS56133856A (en) * | 1980-03-21 | 1981-10-20 | Nitto Electric Ind Co Ltd | Epoxy resin composition for sealing semiconductor |
| JPS6487667A (en) * | 1987-09-28 | 1989-03-31 | Yokohama Rubber Co Ltd | Adhesive composition with good oil-surface adhesivity and adhesive taking advantage of said feature |
| JP2922283B2 (ja) * | 1990-09-28 | 1999-07-19 | 日本カーバイド工業株式会社 | 熱硬化性感圧接着剤組成物用アクリル系共重合体 |
| JPH05209110A (ja) * | 1992-01-30 | 1993-08-20 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物 |
| JPH10182794A (ja) * | 1996-12-25 | 1998-07-07 | Toto Kasei Co Ltd | 速硬化エポキシ樹脂組成物 |
| EP1153952A4 (en) * | 1999-12-14 | 2004-04-28 | Mitsui Chemicals Inc | SEALANT FOR LIQUID CRYSTAL DISPLAY CELL, COMPOSITION FOR SEALING LIQUID CRYSTAL DISPLAY CELLS AND LIQUID CRYSTAL DISPLAY ELEMENT |
| US6403222B1 (en) * | 2000-09-22 | 2002-06-11 | Henkel Corporation | Wax-modified thermosettable compositions |
-
2003
- 2003-05-30 DE DE10324486A patent/DE10324486A1/de not_active Withdrawn
-
2004
- 2004-05-28 CN CNB2004800151472A patent/CN100560633C/zh not_active Expired - Lifetime
- 2004-05-28 WO PCT/EP2004/005787 patent/WO2004106402A2/de not_active Ceased
- 2004-05-28 ES ES04735210.9T patent/ES2524323T3/es not_active Expired - Lifetime
- 2004-05-28 CA CA2527099A patent/CA2527099C/en not_active Expired - Fee Related
- 2004-05-28 EP EP04735210.9A patent/EP1629025B1/de not_active Expired - Lifetime
- 2004-05-28 PL PL04735210T patent/PL1629025T3/pl unknown
- 2004-05-28 JP JP2006529945A patent/JP4587323B2/ja not_active Expired - Lifetime
- 2004-05-28 US US10/558,160 patent/US7750107B2/en not_active Expired - Lifetime
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