JP2010521803A5 - - Google Patents

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Publication number
JP2010521803A5
JP2010521803A5 JP2009553128A JP2009553128A JP2010521803A5 JP 2010521803 A5 JP2010521803 A5 JP 2010521803A5 JP 2009553128 A JP2009553128 A JP 2009553128A JP 2009553128 A JP2009553128 A JP 2009553128A JP 2010521803 A5 JP2010521803 A5 JP 2010521803A5
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JP
Japan
Prior art keywords
drying
dielectric
temperature
solution
substrate material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009553128A
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English (en)
Japanese (ja)
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JP2010521803A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/EP2008/052895 external-priority patent/WO2008110562A1/de
Publication of JP2010521803A publication Critical patent/JP2010521803A/ja
Publication of JP2010521803A5 publication Critical patent/JP2010521803A5/ja
Withdrawn legal-status Critical Current

Links

JP2009553128A 2007-03-15 2008-03-12 多孔質導電性基板材料を誘電体で被膜する方法 Withdrawn JP2010521803A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07104185 2007-03-15
PCT/EP2008/052895 WO2008110562A1 (de) 2007-03-15 2008-03-12 Verfahren zur herstellung einer beschichtung eines porösen, elektrisch leitfähigen trägermaterials mit einem dielektrikum

Publications (2)

Publication Number Publication Date
JP2010521803A JP2010521803A (ja) 2010-06-24
JP2010521803A5 true JP2010521803A5 (enExample) 2011-04-28

Family

ID=39634017

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009553128A Withdrawn JP2010521803A (ja) 2007-03-15 2008-03-12 多孔質導電性基板材料を誘電体で被膜する方法

Country Status (8)

Country Link
US (1) US20100046141A1 (enExample)
EP (1) EP2135266A1 (enExample)
JP (1) JP2010521803A (enExample)
KR (1) KR20090122226A (enExample)
CN (1) CN101636804A (enExample)
RU (1) RU2009137942A (enExample)
TW (1) TW200920825A (enExample)
WO (1) WO2008110562A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106518040B (zh) * 2016-10-28 2019-09-24 湘潭酷弗聚能科技材料有限公司 一种陶瓷复合粉体的合成方法及陶瓷复合粉体
JP7120887B2 (ja) 2018-11-09 2022-08-17 出光興産株式会社 導電性高分子含有多孔質体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19827575A1 (de) * 1998-06-20 1999-12-23 Philips Patentverwaltung Keramisches passives elektronisches Bauelement mit Durchdringungsverbundwerkstoff
US6375688B1 (en) * 1998-09-29 2002-04-23 Matsushita Electric Industrial Co., Ltd. Method of making solid electrolyte capacitor having high capacitance
JP2002222742A (ja) * 2001-01-25 2002-08-09 Rohm Co Ltd 電解質コンデンサの製造方法
TW200534331A (en) * 2004-02-20 2005-10-16 Mykrolis Corp Non-porous adherent inert coatings and methods of making
DE102004052086A1 (de) * 2004-10-26 2006-04-27 Basf Ag Kondensatoren hoher Energiedichte

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