JP2010519733A5 - - Google Patents

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Publication number
JP2010519733A5
JP2010519733A5 JP2009549651A JP2009549651A JP2010519733A5 JP 2010519733 A5 JP2010519733 A5 JP 2010519733A5 JP 2009549651 A JP2009549651 A JP 2009549651A JP 2009549651 A JP2009549651 A JP 2009549651A JP 2010519733 A5 JP2010519733 A5 JP 2010519733A5
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JP
Japan
Prior art keywords
long wavelength
circuit board
electronic circuit
axis
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009549651A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010519733A (ja
Filing date
Publication date
Priority claimed from US11/707,757 external-priority patent/US7710611B2/en
Application filed filed Critical
Publication of JP2010519733A publication Critical patent/JP2010519733A/ja
Publication of JP2010519733A5 publication Critical patent/JP2010519733A5/ja
Pending legal-status Critical Current

Links

JP2009549651A 2007-02-16 2008-01-03 単一照明および多重照明システムおよび方法 Pending JP2010519733A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/707,757 US7710611B2 (en) 2007-02-16 2007-02-16 Single and multi-spectral illumination system and method
PCT/US2008/050068 WO2008100646A2 (en) 2007-02-16 2008-01-03 Single and multi-spectral illumination system and method

Publications (2)

Publication Number Publication Date
JP2010519733A JP2010519733A (ja) 2010-06-03
JP2010519733A5 true JP2010519733A5 (cg-RX-API-DMAC7.html) 2011-02-24

Family

ID=39671890

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009549651A Pending JP2010519733A (ja) 2007-02-16 2008-01-03 単一照明および多重照明システムおよび方法

Country Status (8)

Country Link
US (1) US7710611B2 (cg-RX-API-DMAC7.html)
JP (1) JP2010519733A (cg-RX-API-DMAC7.html)
KR (1) KR20090125057A (cg-RX-API-DMAC7.html)
CN (1) CN101606448B (cg-RX-API-DMAC7.html)
DE (1) DE112008000339B4 (cg-RX-API-DMAC7.html)
GB (1) GB2458428B (cg-RX-API-DMAC7.html)
IL (1) IL199930A (cg-RX-API-DMAC7.html)
WO (1) WO2008100646A2 (cg-RX-API-DMAC7.html)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4696861B2 (ja) * 2005-11-11 2011-06-08 パナソニック株式会社 スクリーン印刷装置
US8730321B2 (en) * 2007-06-28 2014-05-20 Accuvein, Inc. Automatic alignment of a contrast enhancement system
WO2009107981A2 (ko) * 2008-02-26 2009-09-03 주식회사 고영테크놀러지 3차원형상 측정장치 및 측정방법
US8613134B2 (en) 2008-11-19 2013-12-24 Illinois Tool Works Inc. Method of conveying printed circuit boards
IT1392991B1 (it) * 2009-02-23 2012-04-02 Applied Materials Inc Procedimento di stampa serigrafica autoregolantesi
DE102009053575B4 (de) * 2009-11-06 2016-06-30 Ekra Automatisierungssysteme Gmbh Verfahren und Vorrichtung zum Bedrucken eines Substrats, insbesondere einer Leiterplatte, mit einer Druckpaste
EP2380738B1 (de) * 2010-04-22 2014-05-28 Manz AG Drucksieb und Verfahren zur Einstellung der relativen Lage eines Druckmusters und eines Substrats
US8474377B2 (en) * 2010-12-08 2013-07-02 Illinois Tool Works Inc. Combination stencil printer and dispenser and related methods
US9243726B2 (en) 2012-10-03 2016-01-26 Aarne H. Reid Vacuum insulated structure with end fitting and method of making same
US20140098216A1 (en) * 2012-10-08 2014-04-10 Dwfritz Automation Inc. Simultaneous-view object insertion systems, apparatuses and methods
JP2014091247A (ja) * 2012-11-02 2014-05-19 Panasonic Corp 半田印刷機及び半田印刷機の半田にじみ検査方法
US11176635B2 (en) * 2013-01-25 2021-11-16 Cyberoptics Corporation Automatic programming of solder paste inspection system
US8939074B2 (en) * 2013-03-12 2015-01-27 Illinois Tool Works Inc. Color-based linear three dimensional acquisition system and method
CN105209891B (zh) * 2013-05-13 2018-04-27 富士机械制造株式会社 元件安装机
US9743527B2 (en) * 2013-08-09 2017-08-22 CyberOptics Corporaiton Stencil programming and inspection using solder paste inspection system
US9463918B2 (en) 2014-02-20 2016-10-11 Aarne H. Reid Vacuum insulated articles and methods of making same
JP6654805B2 (ja) * 2015-03-12 2020-02-26 日東電工株式会社 配線回路基板の製造方法および検査方法
US9370924B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Dual action stencil wiper assembly for stencil printer
US9370925B1 (en) 2015-03-25 2016-06-21 Illinois Tool Works Inc. Stencil printer having stencil shuttle assembly
US10703089B2 (en) 2015-04-07 2020-07-07 Illinois Tool Works Inc. Edge lock assembly for a stencil printer
US9370923B1 (en) 2015-04-07 2016-06-21 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10723117B2 (en) 2015-04-07 2020-07-28 Illinois Tool Works Inc. Lift tool assembly for stencil printer
US10497908B2 (en) 2015-08-24 2019-12-03 Concept Group, Llc Sealed packages for electronic and energy storage devices
US10065256B2 (en) * 2015-10-30 2018-09-04 Concept Group Llc Brazing systems and methods
WO2017152045A1 (en) 2016-03-04 2017-09-08 Reid Aarne H Vacuum insulated articles with reflective material enhancement
US10823326B2 (en) 2016-11-15 2020-11-03 Concept Group Llc Enhanced vacuum-insulated articles with controlled microporous insulation
US11008153B2 (en) 2016-11-15 2021-05-18 Concept Group Llp Multiply-insulated assemblies
JP2020531764A (ja) 2017-08-25 2020-11-05 コンセプト グループ エルエルシー 複合的ジオメトリおよび複合的材料の断熱部品
JP6783739B2 (ja) 2017-10-31 2020-11-11 株式会社東芝 検査システムおよび検査方法
CN110132960B (zh) * 2018-02-09 2021-12-14 飞旭电子(苏州)有限公司 电路板组件的检测方法
US10780515B2 (en) * 2018-04-26 2020-09-22 Raytheon Technologies Corporation Auto-adaptive braze dispensing systems and methods
KR102528016B1 (ko) * 2018-10-05 2023-05-02 삼성전자주식회사 솔더 부재 실장 방법 및 시스템
JP7402634B2 (ja) * 2019-08-01 2023-12-21 株式会社Fuji マスク印刷機、供給位置案内装置
IT202100031832A1 (it) * 2021-12-20 2023-06-20 Scuola Univ Professionale Della Svizzera Italiana Supsi Apparato di acquisizione di informazioni tridimensionali di oggetti e superfici per un sistema di visione artificiale per l'ispezione ottica automatica della qualità visiva di un oggetto sottostante, in particolare assemblaggi elettronici, schede elettroniche e simili
US20250060316A1 (en) * 2021-12-20 2025-02-20 Scuola universitaria professionale della Svizzera italiana (SUPSI) Apparatus for acquiring three-dimensional information of objects and surfaces for an artificial vision system for automatic optical inspection of the visual quality of an underlying object, in particular electronic assemblies, circuit boards and the like
US11947094B1 (en) * 2023-03-23 2024-04-02 Illinois Tool Works Inc. Dual camera prism assembly for stencil printer

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US34615A (en) 1862-03-04 Improvement in cartridges for fire-arms
US4924304A (en) * 1987-11-02 1990-05-08 Mpm Corporation Video probe aligning of object to be acted upon
US5278012A (en) * 1989-03-29 1994-01-11 Hitachi, Ltd. Method for producing thin film multilayer substrate, and method and apparatus for detecting circuit conductor pattern of the substrate
US5058178A (en) * 1989-12-21 1991-10-15 At&T Bell Laboratories Method and apparatus for inspection of specular, three-dimensional features
US5060063A (en) * 1990-07-30 1991-10-22 Mpm Corporation Viewing and illuminating video probe with viewing means for simultaneously viewing object and device images along viewing axis and translating them along optical axis
JP2698213B2 (ja) 1990-11-07 1998-01-19 三菱電機株式会社 回路基板および回路基板の位置認識方式
JPH05223532A (ja) * 1991-07-10 1993-08-31 Raytheon Co 自動視覚検査システム
US5157438A (en) * 1992-02-04 1992-10-20 Dek Printing Machines Limited Workpiece support and clamping means
GB9323978D0 (en) * 1993-11-22 1994-01-12 Dek Printing Machines Ltd Alignment systems
JP3617547B2 (ja) 1995-02-14 2005-02-09 富士通株式会社 配線パターンを観察する方法および加工装置
US5943089A (en) * 1996-08-23 1999-08-24 Speedline Technologies, Inc. Method and apparatus for viewing an object and for viewing a device that acts upon the object
GB2323664A (en) * 1997-03-25 1998-09-30 Dek Printing Machines Ltd Viewing and imaging systems
DE19728144C2 (de) * 1997-07-02 2001-02-01 Ekra Eduard Kraft Gmbh Verfahren und Vorrichtung zum Erzeugen von Testmustern
US6040895A (en) * 1997-10-08 2000-03-21 Siemens Aktiengesellschaft Method and device for controlled illumination of an object for improving identification of an object feature in an image of the object
JP2000022393A (ja) * 1998-06-30 2000-01-21 Yamaha Motor Co Ltd 認識用照明装置
US6198529B1 (en) * 1999-04-30 2001-03-06 International Business Machines Corporation Automated inspection system for metallic surfaces
US6891967B2 (en) * 1999-05-04 2005-05-10 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US7072503B2 (en) 1999-05-04 2006-07-04 Speedline Technologies, Inc. Systems and methods for detecting defects in printed solder paste
US6738505B1 (en) * 1999-05-04 2004-05-18 Speedline Technologies, Inc. Method and apparatus for detecting solder paste deposits on substrates
GB2359515B (en) 2000-02-23 2003-12-03 Kistech Ltd Method of printing and printing machine
DE10128476C2 (de) 2001-06-12 2003-06-12 Siemens Dematic Ag Optische Sensorvorrichtung zur visuellen Erfassung von Substraten
JP2003172711A (ja) * 2001-09-26 2003-06-20 Dainippon Screen Mfg Co Ltd 画像処理を利用した検査対象物の表面検査
JP3981259B2 (ja) * 2001-11-01 2007-09-26 松下電器産業株式会社 基板用支持治具
US7028391B2 (en) * 2002-06-19 2006-04-18 Speedline Technologies, Inc. Method and apparatus for supporting a substrate
GB2403003B (en) 2003-06-19 2006-06-07 Dek Int Gmbh Inspection system for and method of inspecting deposits printed on workpieces
JP2006242719A (ja) * 2005-03-02 2006-09-14 Omron Corp 半田材劣化度判断装置、半田印刷機、半田材劣化度判断方法、半田印刷方法、半田材劣化度判断プログラム、半田印刷プログラムおよびコンピュータ読み取り可能な記録媒体
JP5191089B2 (ja) * 2005-06-30 2013-04-24 Ｃｋｄ株式会社 基板の検査装置
US20070102477A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
US7458318B2 (en) * 2006-02-01 2008-12-02 Speedline Technologies, Inc. Off-axis illumination assembly and method

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