JP2010516478A5 - - Google Patents

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Publication number
JP2010516478A5
JP2010516478A5 JP2009547374A JP2009547374A JP2010516478A5 JP 2010516478 A5 JP2010516478 A5 JP 2010516478A5 JP 2009547374 A JP2009547374 A JP 2009547374A JP 2009547374 A JP2009547374 A JP 2009547374A JP 2010516478 A5 JP2010516478 A5 JP 2010516478A5
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JP
Japan
Prior art keywords
temperature
metal
melting point
melting
point temperature
Prior art date
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Granted
Application number
JP2009547374A
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English (en)
Japanese (ja)
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JP2010516478A (ja
JP5871450B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2008/051590 external-priority patent/WO2008091825A2/en
Publication of JP2010516478A publication Critical patent/JP2010516478A/ja
Publication of JP2010516478A5 publication Critical patent/JP2010516478A5/ja
Application granted granted Critical
Publication of JP5871450B2 publication Critical patent/JP5871450B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009547374A 2007-01-22 2008-01-22 高温はんだ材料 Expired - Fee Related JP5871450B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US88599707P 2007-01-22 2007-01-22
US60/885,997 2007-01-22
US89176307P 2007-02-27 2007-02-27
US60/891,763 2007-02-27
PCT/US2008/051590 WO2008091825A2 (en) 2007-01-22 2008-01-22 High temperature solder materials

Publications (3)

Publication Number Publication Date
JP2010516478A JP2010516478A (ja) 2010-05-20
JP2010516478A5 true JP2010516478A5 (enExample) 2015-08-13
JP5871450B2 JP5871450B2 (ja) 2016-03-01

Family

ID=39645113

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009547374A Expired - Fee Related JP5871450B2 (ja) 2007-01-22 2008-01-22 高温はんだ材料

Country Status (6)

Country Link
US (1) US20100096043A1 (enExample)
EP (1) EP2121231A4 (enExample)
JP (1) JP5871450B2 (enExample)
CN (1) CN101641176B (enExample)
CA (1) CA2676218C (enExample)
WO (1) WO2008091825A2 (enExample)

Families Citing this family (26)

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Publication number Priority date Publication date Assignee Title
CN101823187B (zh) * 2010-02-04 2012-01-25 哈尔滨工业大学 纳米Ni增强低温无铅复合焊膏及其制备方法
US8348139B2 (en) 2010-03-09 2013-01-08 Indium Corporation Composite solder alloy preform
US9017446B2 (en) * 2010-05-03 2015-04-28 Indium Corporation Mixed alloy solder paste
US8902565B2 (en) * 2010-05-26 2014-12-02 Kemet Electronics Corporation Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes
JP2012174332A (ja) * 2011-02-17 2012-09-10 Fujitsu Ltd 導電性接合材料、導体の接合方法、及び半導体装置の製造方法
DE102011013172A1 (de) * 2011-02-28 2012-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Paste zum Verbinden von Bauteilen elektronischer Leistungsmodule, System und Verfahren zum Auftragen der Paste
US9198302B2 (en) * 2012-07-18 2015-11-24 Koninklijke Philips N.V. Method of soldering an electronic component with a high lateral accuracy
JP2014036165A (ja) * 2012-08-09 2014-02-24 Shinko Electric Ind Co Ltd 半導体装置
DE102013218423A1 (de) * 2012-10-01 2014-04-17 Robert Bosch Gmbh Verfahren zum Herstellen einer Lötverbindung und Schaltungsbauteil
DE102012217922A1 (de) * 2012-10-01 2014-04-03 Robert Bosch Gmbh Verfahren zum Herstellen einer Lötverbindung und Schaltungsbauteil
US11440142B2 (en) 2012-11-16 2022-09-13 Ormet Circuits, Inc. Alternative compositions for high temperature soldering applications
EP2923366B1 (en) * 2012-11-26 2017-09-20 Kemet Electronics Corporation Leadless multi-layered ceramic capacitor stacks
DE102013218425B4 (de) * 2013-09-13 2024-06-06 Robert Bosch Gmbh Verfahren zum Herstellen einer Lötverbindung und Schaltungsbauteil
CN103722304B (zh) * 2014-01-09 2016-12-07 北京航空航天大学 一种用于界面强化传热的铝合金界面低温扩散连接用材料
DE102014111634A1 (de) * 2014-08-14 2016-02-18 Atv Technologie Gmbh Vorrichtung zum insbesondere thermischen Verbinden mikro-elektromechanischer Bauteile
US9687940B2 (en) * 2014-11-18 2017-06-27 Baker Hughes Incorporated Methods and compositions for brazing, and earth-boring tools formed from such methods and compositions
US9731384B2 (en) 2014-11-18 2017-08-15 Baker Hughes Incorporated Methods and compositions for brazing
KR20160061182A (ko) * 2014-11-21 2016-05-31 현대자동차주식회사 은 페이스트의 접합 방법
WO2016174584A1 (en) * 2015-04-28 2016-11-03 Ormet Circuits, Inc. Sintering pastes with high metal loading for semiconductor die attach applications
MY201476A (en) 2016-05-06 2024-02-26 Alpha Assembly Solutions Inc High reliability lead-free solder alloy
CN106001980A (zh) * 2016-06-15 2016-10-12 中国科学院电工研究所 一种电力电子模块封装用高温无铅焊片及其制备方法
KR102121439B1 (ko) * 2016-10-24 2020-06-10 주식회사 엘지화학 금속 페이스트 및 열전 모듈
US10794642B2 (en) 2017-09-11 2020-10-06 Toyota Motor Engineering & Manufacturing North America, Inc. Low temperature sintering porous metal foam layers for enhanced cooling and processes for forming thereof
ES2928498T3 (es) 2019-05-07 2022-11-18 Light Med Usa Inc Método de fase líquida transitoria de plata-indio de unión de dispositivo semiconductor y soporte de dispersión de calor y estructura semiconductora que tiene una junta de unión de fase líquida transitoria de plata-indio
CN110783445B (zh) * 2019-10-17 2021-08-31 中国科学院上海硅酸盐研究所 一种分段热电器件连接用焊片及其制备方法
CN113814603B (zh) * 2021-10-27 2023-05-16 广东工业大学 一种复合钎料、焊点制备方法和应用

Family Cites Families (15)

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Publication number Priority date Publication date Assignee Title
US5853622A (en) * 1990-02-09 1998-12-29 Ormet Corporation Transient liquid phase sintering conductive adhesives
JPH0422595A (ja) * 1990-05-18 1992-01-27 Toshiba Corp クリームはんだ
JP3161815B2 (ja) * 1992-06-09 2001-04-25 太平洋セメント株式会社 セラミックスと金属の接合用ロウ材及びその接合方法
US5328521A (en) * 1993-03-08 1994-07-12 E. I. Du Pont De Nemours And Company Kinetic solder paste composition
CA2131256A1 (en) * 1993-09-07 1995-03-08 Dongkai Shangguan Lead-free solder alloy
JPH0985485A (ja) * 1995-06-02 1997-03-31 Seiko Instr Inc ろう材
JP3908426B2 (ja) * 1999-12-24 2007-04-25 日本碍子株式会社 セラミックコンデンサー電極形成用ペースト
AU2001261952A1 (en) * 2000-05-24 2001-12-03 Stephen F. Corbin Variable melting point solders and brazes
JP3414388B2 (ja) * 2000-06-12 2003-06-09 株式会社日立製作所 電子機器
CN100578778C (zh) * 2000-12-21 2010-01-06 株式会社日立制作所 电子器件
CN1358606A (zh) * 2001-12-19 2002-07-17 北京工业大学 金属颗粒增强的锡铅基复合钎料及其制备方法
JP2004017093A (ja) * 2002-06-17 2004-01-22 Toshiba Corp 鉛フリーはんだ合金、及びこれを用いた鉛フリーはんだペースト
EP1479738A1 (en) * 2003-05-20 2004-11-24 DSM IP Assets B.V. Hydrophobic coatings comprising reactive nano-particles
EP1864750B1 (en) * 2005-04-01 2016-11-09 Koki Company Limited Conductive filler and solder material
JP2006289474A (ja) * 2005-04-14 2006-10-26 Hitachi Metals Ltd ロウ材シートおよびその製造方法ならびに電子部品

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