JP2010510656A - 誘電性アンチヒューズと直列にシリサイドに隣接して結晶化されたp−i−nダイオードおよびその形成方法 - Google Patents
誘電性アンチヒューズと直列にシリサイドに隣接して結晶化されたp−i−nダイオードおよびその形成方法 Download PDFInfo
- Publication number
- JP2010510656A JP2010510656A JP2009537188A JP2009537188A JP2010510656A JP 2010510656 A JP2010510656 A JP 2010510656A JP 2009537188 A JP2009537188 A JP 2009537188A JP 2009537188 A JP2009537188 A JP 2009537188A JP 2010510656 A JP2010510656 A JP 2010510656A
- Authority
- JP
- Japan
- Prior art keywords
- dielectric
- layer
- silicide
- conductor
- germanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 73
- 229910021332 silicide Inorganic materials 0.000 title claims abstract description 47
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 title claims abstract description 47
- 230000015654 memory Effects 0.000 claims abstract description 128
- 239000004065 semiconductor Substances 0.000 claims abstract description 101
- 239000000463 material Substances 0.000 claims abstract description 79
- 230000000903 blocking effect Effects 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 238000000231 atomic layer deposition Methods 0.000 claims abstract description 9
- 239000004020 conductor Substances 0.000 claims description 128
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 34
- 239000010703 silicon Substances 0.000 claims description 33
- 229910052710 silicon Inorganic materials 0.000 claims description 32
- SCCCLDWUZODEKG-UHFFFAOYSA-N germanide Chemical compound [GeH3-] SCCCLDWUZODEKG-UHFFFAOYSA-N 0.000 claims description 25
- 230000015556 catabolic process Effects 0.000 claims description 15
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 14
- 229910017052 cobalt Inorganic materials 0.000 claims description 11
- 239000010941 cobalt Substances 0.000 claims description 11
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 11
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 11
- 229910052732 germanium Inorganic materials 0.000 claims description 10
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 9
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 9
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 9
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 239000010936 titanium Substances 0.000 claims description 9
- 229910052719 titanium Inorganic materials 0.000 claims description 9
- 229910017121 AlSiO Inorganic materials 0.000 claims description 8
- 229910003855 HfAlO Inorganic materials 0.000 claims description 8
- 229910004129 HfSiO Inorganic materials 0.000 claims description 8
- 229910021193 La 2 O 3 Inorganic materials 0.000 claims description 8
- -1 Ta 2 O 5 Inorganic materials 0.000 claims description 8
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 8
- 229910006501 ZrSiO Inorganic materials 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 6
- 239000003989 dielectric material Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 6
- 238000000059 patterning Methods 0.000 claims description 5
- 229910021341 titanium silicide Inorganic materials 0.000 claims description 5
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- DDHRUTNUHBNAHW-UHFFFAOYSA-N cobalt germanium Chemical compound [Co].[Ge] DDHRUTNUHBNAHW-UHFFFAOYSA-N 0.000 claims 2
- 230000007547 defect Effects 0.000 abstract description 13
- 239000010410 layer Substances 0.000 description 126
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 31
- 230000004888 barrier function Effects 0.000 description 17
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 13
- 239000000377 silicon dioxide Substances 0.000 description 13
- 235000012239 silicon dioxide Nutrition 0.000 description 13
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 7
- 229910052721 tungsten Inorganic materials 0.000 description 7
- 239000010937 tungsten Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229920005591 polysilicon Polymers 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 239000002019 doping agent Substances 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 230000006399 behavior Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000012777 electrically insulating material Substances 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910000927 Ge alloy Inorganic materials 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910000676 Si alloy Inorganic materials 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- AXQKVSDUCKWEKE-UHFFFAOYSA-N [C].[Ge].[Si] Chemical compound [C].[Ge].[Si] AXQKVSDUCKWEKE-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000003190 augmentative effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Semiconductor Memories (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/560,283 US7682920B2 (en) | 2003-12-03 | 2006-11-15 | Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse |
| US11/560,289 US8018024B2 (en) | 2003-12-03 | 2006-11-15 | P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse |
| PCT/US2007/023855 WO2008060543A2 (en) | 2006-11-15 | 2007-11-13 | P-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse and methods of forming the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010510656A true JP2010510656A (ja) | 2010-04-02 |
| JP2010510656A5 JP2010510656A5 (enExample) | 2010-10-21 |
Family
ID=42211734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009537188A Pending JP2010510656A (ja) | 2006-11-15 | 2007-11-13 | 誘電性アンチヒューズと直列にシリサイドに隣接して結晶化されたp−i−nダイオードおよびその形成方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2010510656A (enExample) |
| TW (1) | TWI424535B (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009289963A (ja) * | 2008-05-29 | 2009-12-10 | Toshiba Corp | 不揮発性記憶装置及びその製造方法 |
| JP2012023374A (ja) * | 2010-07-13 | 2012-02-02 | Crossbar Inc | 二端子抵抗性スイッチングデバイス構造及びその製造方法 |
| JP2012028765A (ja) * | 2010-07-09 | 2012-02-09 | Crossbar Inc | SiGe材料を使用する抵抗性メモリー |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4719910B2 (ja) * | 2008-11-26 | 2011-07-06 | 国立大学法人東北大学 | 半導体装置の製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302700A (ja) * | 1993-04-19 | 1994-10-28 | Kawasaki Steel Corp | 半導体装置およびその製造方法 |
| JPH08139197A (ja) * | 1994-11-11 | 1996-05-31 | Tadahiro Omi | シリサイド反応を利用した半導体装置 |
| JP2003197867A (ja) * | 2001-12-14 | 2003-07-11 | Hewlett Packard Co <Hp> | メモリ構造における連続アンチヒューズ材料 |
| JP2003203864A (ja) * | 2002-01-09 | 2003-07-18 | Sangaku Renkei Kiko Kyushu:Kk | 半導体薄膜の製造方法 |
| JP2004327677A (ja) * | 2003-04-24 | 2004-11-18 | Sharp Corp | 半導体膜およびその製造方法 |
| JP2005347468A (ja) * | 2004-06-02 | 2005-12-15 | Matsushita Electric Ind Co Ltd | 不揮発性メモリ |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050158950A1 (en) * | 2002-12-19 | 2005-07-21 | Matrix Semiconductor, Inc. | Non-volatile memory cell comprising a dielectric layer and a phase change material in series |
-
2007
- 2007-11-13 JP JP2009537188A patent/JP2010510656A/ja active Pending
- 2007-11-15 TW TW96143253A patent/TWI424535B/zh not_active IP Right Cessation
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06302700A (ja) * | 1993-04-19 | 1994-10-28 | Kawasaki Steel Corp | 半導体装置およびその製造方法 |
| JPH08139197A (ja) * | 1994-11-11 | 1996-05-31 | Tadahiro Omi | シリサイド反応を利用した半導体装置 |
| JP2003197867A (ja) * | 2001-12-14 | 2003-07-11 | Hewlett Packard Co <Hp> | メモリ構造における連続アンチヒューズ材料 |
| JP2003203864A (ja) * | 2002-01-09 | 2003-07-18 | Sangaku Renkei Kiko Kyushu:Kk | 半導体薄膜の製造方法 |
| JP2004327677A (ja) * | 2003-04-24 | 2004-11-18 | Sharp Corp | 半導体膜およびその製造方法 |
| JP2005347468A (ja) * | 2004-06-02 | 2005-12-15 | Matsushita Electric Ind Co Ltd | 不揮発性メモリ |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009289963A (ja) * | 2008-05-29 | 2009-12-10 | Toshiba Corp | 不揮発性記憶装置及びその製造方法 |
| JP2012028765A (ja) * | 2010-07-09 | 2012-02-09 | Crossbar Inc | SiGe材料を使用する抵抗性メモリー |
| JP2012023374A (ja) * | 2010-07-13 | 2012-02-02 | Crossbar Inc | 二端子抵抗性スイッチングデバイス構造及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI424535B (zh) | 2014-01-21 |
| TW200837897A (en) | 2008-09-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7682920B2 (en) | Method for making a p-i-n diode crystallized adjacent to a silicide in series with a dielectric antifuse | |
| US8633567B2 (en) | Devices including a P-I-N diode disposed adjacent a silicide in series with a dielectric material | |
| TWI441263B (zh) | 具有大且均勻之電流的上指p-i-n二極體的大型陣列及其形成方法 | |
| US8349663B2 (en) | Vertical diode based memory cells having a lowered programming voltage and methods of forming the same | |
| KR101128246B1 (ko) | 비-휘발성 프로그램 가능한 메모리 | |
| US7855119B2 (en) | Method for forming polycrystalline thin film bipolar transistors | |
| JP5139269B2 (ja) | 半導体ダイオードを含む低温で製作された高密度不揮発性メモリアレイ | |
| CN101313423B (zh) | 包含氧化镍钴切换元件的存储单元 | |
| US20100288996A1 (en) | Memory arrays including memory levels that share conductors, and methods of forming such memory arrays | |
| CN101878508A (zh) | 多个反熔丝存储器单元以及形成、编程和测试该器件的方法 | |
| CN101553925B (zh) | 邻近于硅化物而结晶的与介电反熔丝串联的p-i-n二极管及其形成方法 | |
| JP2010510656A (ja) | 誘電性アンチヒューズと直列にシリサイドに隣接して結晶化されたp−i−nダイオードおよびその形成方法 | |
| US8004013B2 (en) | Polycrystalline thin film bipolar transistors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100831 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100831 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121130 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121204 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130226 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130521 |