JP2010510491A - 実流量の妥当性確認の実施方法 - Google Patents
実流量の妥当性確認の実施方法 Download PDFInfo
- Publication number
- JP2010510491A JP2010510491A JP2009537333A JP2009537333A JP2010510491A JP 2010510491 A JP2010510491 A JP 2010510491A JP 2009537333 A JP2009537333 A JP 2009537333A JP 2009537333 A JP2009537333 A JP 2009537333A JP 2010510491 A JP2010510491 A JP 2010510491A
- Authority
- JP
- Japan
- Prior art keywords
- flow rate
- gas
- orifice
- mfc
- indicated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims abstract description 107
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 79
- 238000006243 chemical reaction Methods 0.000 claims abstract description 38
- 238000012545 processing Methods 0.000 claims abstract description 10
- 230000001419 dependent effect Effects 0.000 claims 1
- 239000007789 gas Substances 0.000 abstract description 107
- 230000008569 process Effects 0.000 description 17
- 238000012360 testing method Methods 0.000 description 13
- 238000009530 blood pressure measurement Methods 0.000 description 7
- 238000005094 computer simulation Methods 0.000 description 6
- 239000011261 inert gas Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000002474 experimental method Methods 0.000 description 5
- 238000010200 validation analysis Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012937 correction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
- G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
- G01F25/15—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters specially adapted for gas meters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/3065—Plasma etching; Reactive-ion etching
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/7722—Line condition change responsive valves
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Fluid Mechanics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Measuring Volume Flow (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Flow Control (AREA)
Abstract
【選択図】図2
Description
前述のように、較正係数は、式1のように、一組の実測上流圧力値の平均値と一組の最良圧力値の平均値との比を計算することによって決定される。
較正係数=最良圧力測定値/平均上流圧力測定値=ΔPg/Pm 式1
オリフィス(ガス)=mPgas(1±ΔPg/Pm)−λ 式2
(較正予測流量−MFC流量)/MFC流量=[(mPgas(1±ΔPg/Pm)−λ)/MFC流量]−1 式3
ある実施形態において、正確なガス表のデータは実験的方法によって計算することができる。図3は、ある実施形態において、実験的方法に基づく一組の正確なガス表を作成するステップを説明する簡単なフローチャートを示す。
Claims (20)
- 質量流量コントローラ(MFC)で制御されるガス流量供給システムによってガスを前記反応室の上流にあるオリフィスに供給し、
前記ガスを加圧して前記オリフィス内にチョーク流れ状態を作り出し、
前記ガスの一組の上流圧力値を一組の圧力センサによって測定し、
較正係数は前記一組の上流圧力値の平均値と一組の最良上流圧力値の平均値との比であり、前記最良上流圧力値は指示流量に関連する圧力値を表わし、前記指示流量は前記MFCによって指示される流量であって、
前記実ガス流量を決定するために一組の較正係数を提供してなるプラズマ処理システムの反応室における実ガス流量を決定する方法。 - 前記一組の較正係数の各較正係数は一組のオリフィスの個々のオリフィスと関連しており、前記各較正係数は前記個々のオリフィスの直径と形状の少なくとも一方に依存している、請求項1に記載の方法。
- 前記較正係数は前記一組の上流圧力値に適用されて補正圧力値を決定する、請求項1に記載の方法。
- 前記実流量は前記補正圧力値を正確なガス表と比較することによって決定され、前記正確なガス表は実ガスの性質と、正確なMFCと、精密オリフィスとに基づく圧力値及び流量値の表を表わす、請求項3に記載の方法。
- 前記圧力値の前記表は前記最良圧力値の表である、請求項4に記載の方法。
- 前記指示流量を前記実流量と前記指示流量との差に分けることによって前記MFCに対する誤差のパーセンテージを計算することをさらに含む、請求項4に記載の方法。
- 前記誤差のパーセンテージは前記MFCを調整するために適用される、請求項5に記載の方法。
- 前記一組の圧力センサは一組の圧力計である、請求項1に記載の方法。
- 前記一組の圧力センサは前記オリフィスの上流に定置される、請求項7に記載の方法。
- 質量流量コントローラ(MFC)で制御されるガス流量供給システムによってガスを前記反応室の上流にあるオリフィスに供給し、
前記ガスを加圧して前記オリフィス内にチョーク流れ状態を作り出し、
前記ガスの上流圧力を一組の圧力センサによって測定して一組の上流圧力値を収集し、
前記オリフィスの前記一組の上流圧力値に基づいて前記実流量を計算し、
前記実流量を、前記MFCによって指示される流量である指示流量と比較してなるプラズマ処理システムの反応室における実ガス流量の妥当性を確認する方法 - 前記オリフィスは精密オリフィスである、請求項10に記載の方法。
- 前記オリフィスは前記反応室よりも小さい領域サイズを有する、請求項11に記載の方法。
- 前記一組の圧力センサは前記オリフィスの上流に定置される、請求項10に記載の方法。
- 前記一組の圧力センサは一組の圧力計である、請求項13に記載の方法。
- 前記一組の上流圧力値は前記実流量と直線関係を有する、請求項10に記載の方法。
- 前記実流量は前記一組の上流圧力値を正確なガス表に適用することによって抽出され、前記正確なガス表は実ガスの性質と、正確なMFCと、精密オリフィスとに基づく圧力値及び流量値の表を表わす、請求項10に記載の方法。
- 指示流量を前記実流量と前記指示流量との差に分けることによって前記MFCに対する誤差のパーセンテージを計算することをさらに含む、請求項16に記載の方法。
- 前記誤差のパーセンテージは前記MFCを調整するために適用される、請求項17に記載の方法。
- 一組の較正係数の較正係数を適用して前記実流量を決定することをさらに含み、前記較正係数は前記一組の上流圧力値の平均値と一組の最良上流圧力値の平均値との比であり、前記最良圧力値は指示流量に関連する圧力値を表わし、前記指示流量は前記MFCによって指示される流量である、請求項10に記載の方法。
- 前記指示流量を前記実流量と前記指示流量との差に分けることによって前記MFCに対する誤差のパーセンテージを計算することをさらに含む、請求項19に記載の方法。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US86640606P | 2006-11-17 | 2006-11-17 | |
US60/866,406 | 2006-11-17 | ||
US11/938,171 US7822570B2 (en) | 2006-11-17 | 2007-11-09 | Methods for performing actual flow verification |
US11/938,171 | 2007-11-09 | ||
PCT/US2007/084724 WO2008064044A1 (en) | 2006-11-17 | 2007-11-14 | Methods for performing actual flow verification |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013268982A Division JP2014089205A (ja) | 2006-11-17 | 2013-12-26 | 実流量の妥当性確認の実施方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010510491A true JP2010510491A (ja) | 2010-04-02 |
JP5530718B2 JP5530718B2 (ja) | 2014-06-25 |
Family
ID=39415594
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009537333A Active JP5530718B2 (ja) | 2006-11-17 | 2007-11-14 | 実流量の妥当性確認の実施方法 |
JP2013268982A Pending JP2014089205A (ja) | 2006-11-17 | 2013-12-26 | 実流量の妥当性確認の実施方法 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013268982A Pending JP2014089205A (ja) | 2006-11-17 | 2013-12-26 | 実流量の妥当性確認の実施方法 |
Country Status (6)
Country | Link |
---|---|
US (3) | US7822570B2 (ja) |
JP (2) | JP5530718B2 (ja) |
KR (1) | KR101472146B1 (ja) |
CN (1) | CN101536159B (ja) |
SG (1) | SG176489A1 (ja) |
WO (1) | WO2008064044A1 (ja) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012248193A (ja) * | 2011-05-26 | 2012-12-13 | Spts Technologies Ltd | マスフローコントローラーの監視 |
JP2013526063A (ja) * | 2010-04-30 | 2013-06-20 | アプライド マテリアルズ インコーポレイテッド | オリフィス比コンダクタンス制御を用いたフロー分割誤差を低減するための方法及び装置 |
US8538250B2 (en) | 2009-02-12 | 2013-09-17 | Lab Partners Associates, Inc. | Systems and methods for communicating with a device using one or more camera body controls |
US8571401B2 (en) | 2009-02-12 | 2013-10-29 | Lab Partners Associates, Inc. | Systems and methods for changing power states of a remote device using one or more camera body controls and a preset delay |
US9250499B2 (en) | 2007-05-29 | 2016-02-02 | Lab Partners Associates, Inc. | TTL photographic wireless communication system and method with exposure compensation value transfer to a remote lighting device |
US9420157B2 (en) | 2005-07-20 | 2016-08-16 | Lab Partners Associates, Inc. | Zero delay photographic synchronization system and method |
US9690169B2 (en) | 2013-11-04 | 2017-06-27 | Lab Partners Associates, Inc. | Photographic lighting system and method |
JP7507234B2 (ja) | 2019-09-11 | 2024-06-27 | ラム リサーチ コーポレーション | 基板処理システムの処理チャンバの整合を改善するための流量計測較正 |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7822570B2 (en) * | 2006-11-17 | 2010-10-26 | Lam Research Corporation | Methods for performing actual flow verification |
US7881886B1 (en) * | 2006-11-17 | 2011-02-01 | Lam Research Corporation | Methods for performing transient flow prediction and verification using discharge coefficients |
CN101727111B (zh) * | 2008-10-15 | 2011-09-14 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种腔室压力控制方法、装置及控制系统 |
JP5346628B2 (ja) * | 2009-03-11 | 2013-11-20 | 株式会社堀場エステック | マスフローコントローラの検定システム、検定方法、検定用プログラム |
JP2010247028A (ja) * | 2009-04-13 | 2010-11-04 | Renesas Electronics Corp | プラズマ処理装置、異常検出装置、及び異常検出方法 |
TWI435196B (zh) | 2009-10-15 | 2014-04-21 | Pivotal Systems Corp | 氣體流量控制方法及裝置 |
US8397739B2 (en) * | 2010-01-08 | 2013-03-19 | Applied Materials, Inc. | N-channel flow ratio controller calibration |
US8707754B2 (en) * | 2010-04-30 | 2014-04-29 | Applied Materials, Inc. | Methods and apparatus for calibrating flow controllers in substrate processing systems |
CA2840888C (en) | 2011-07-04 | 2019-07-02 | Schlumberger Canada Limited | System and method for measuring flow rates for individual petroleum wells in a well pad field |
JP5809012B2 (ja) * | 2011-10-14 | 2015-11-10 | 株式会社堀場エステック | 流量制御装置、流量測定機構、又は、当該流量測定機構を備えた流量制御装置に用いられる診断装置及び診断用プログラム |
US9778083B2 (en) | 2013-05-16 | 2017-10-03 | Lam Research Corporation | Metrology method for transient gas flow |
US9580360B2 (en) | 2014-04-07 | 2017-02-28 | Lam Research Corporation | Monolithic ceramic component of gas delivery system and method of making and use thereof |
US10128087B2 (en) | 2014-04-07 | 2018-11-13 | Lam Research Corporation | Configuration independent gas delivery system |
CN103900666B (zh) * | 2014-04-16 | 2017-03-15 | 四川海力智能科技有限公司 | 膜式燃气表长期运行的计量精度控制方法 |
US10557197B2 (en) | 2014-10-17 | 2020-02-11 | Lam Research Corporation | Monolithic gas distribution manifold and various construction techniques and use cases therefor |
US10022689B2 (en) | 2015-07-24 | 2018-07-17 | Lam Research Corporation | Fluid mixing hub for semiconductor processing tool |
CN105182463A (zh) * | 2015-08-14 | 2015-12-23 | 深圳市华星光电技术有限公司 | 一种导光板及显示装置 |
US10118263B2 (en) | 2015-09-02 | 2018-11-06 | Lam Researech Corporation | Monolithic manifold mask and substrate concepts |
CN108139760A (zh) * | 2015-10-28 | 2018-06-08 | 株式会社富士金 | 流量信号补正方法以及使用其的流量控制装置 |
CN105203190B (zh) * | 2015-10-30 | 2018-07-20 | 天津英利新能源有限公司 | 质量流量计的标定方法 |
US9879795B2 (en) | 2016-01-15 | 2018-01-30 | Lam Research Corporation | Additively manufactured gas distribution manifold |
US10215317B2 (en) | 2016-01-15 | 2019-02-26 | Lam Research Corporation | Additively manufactured gas distribution manifold |
US10684159B2 (en) | 2016-06-27 | 2020-06-16 | Applied Materials, Inc. | Methods, systems, and apparatus for mass flow verification based on choked flow |
US11105664B2 (en) * | 2017-03-23 | 2021-08-31 | Honeywell International Inc. | Apparatus and method for creating inferential process flow measurements using flow restrictor and upstream and downstream pressure measurements |
US10823598B2 (en) | 2017-03-23 | 2020-11-03 | Honeywell International Inc. | Apparatus and method for creating inferential process flow measurements using other process measurements |
JP6913498B2 (ja) | 2017-04-18 | 2021-08-04 | 東京エレクトロン株式会社 | 流量制御器の出力流量を求める方法及び被処理体を処理する方法 |
CN107968042B (zh) * | 2017-11-28 | 2020-07-17 | 北京北方华创微电子装备有限公司 | 一种不同反应腔室之间工艺结果的匹配方法和装置 |
KR102628015B1 (ko) | 2017-12-01 | 2024-01-23 | 삼성전자주식회사 | 질량 유량 제어기, 반도체 소자의 제조장치 및 그의 관리방법 |
WO2019195292A1 (en) * | 2018-04-03 | 2019-10-10 | Lam Research Corporation | Mems coriolis gas flow controller |
US10760944B2 (en) | 2018-08-07 | 2020-09-01 | Lam Research Corporation | Hybrid flow metrology for improved chamber matching |
CN112563105B (zh) * | 2019-09-10 | 2023-11-03 | 中微半导体设备(上海)股份有限公司 | 等离子体处理装置中实现气体流量验证的系统及方法 |
KR102534971B1 (ko) * | 2020-12-17 | 2023-05-22 | 주식회사 한국가스기술공사 | 유량 컴퓨터의 테스트를 위한 시스템 및 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5740614A (en) * | 1980-08-25 | 1982-03-06 | Oval Eng Co Ltd | Self-checking of reference meter for inspection system employing thereof |
JP2006012872A (ja) * | 2004-06-22 | 2006-01-12 | Tokyo Electron Ltd | 基板処理装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4437489A (en) * | 1981-12-24 | 1984-03-20 | Hewlett-Packard Company | Gas flow controller |
US4794947A (en) * | 1986-11-29 | 1989-01-03 | Kabushiki Kaisha Nippon IC (also trading as Nippon IC, Inc.) | Mass flow controller |
DE3900836A1 (de) * | 1989-01-13 | 1990-07-19 | Bosch Gmbh Robert | Verfahren zur messung der steuerquerschnittsflaeche einer duese |
EP0547617B1 (en) * | 1991-12-18 | 1996-07-10 | Pierre Delajoud | Mass flow meter and method |
US5911834A (en) * | 1996-11-18 | 1999-06-15 | Applied Materials, Inc. | Gas delivery system |
US6062256A (en) * | 1997-02-11 | 2000-05-16 | Engineering Measurements Company | Micro mass flow control apparatus and method |
US5968588A (en) * | 1997-03-17 | 1999-10-19 | Applied Materials, Inc. | In-situ liquid flow rate estimation and verification by sonic flow method |
US6074691A (en) * | 1997-06-24 | 2000-06-13 | Balzers Aktiengesellschaft | Method for monitoring the flow of a gas into a vacuum reactor |
JP4789323B2 (ja) | 1998-09-14 | 2011-10-12 | アプライド マテリアルズ インコーポレイテッド | プログラム可能な処理パラメータを備えたウエハ処理リアクタシステム及びその操作方法 |
KR100375834B1 (ko) | 2000-04-10 | 2003-03-15 | 주식회사 무한 | 리모트 플라즈마를 이용한 원자층 형성장치의 기체이송장치 |
US6619139B2 (en) * | 2001-02-16 | 2003-09-16 | Enginuity, Llc | Gas flow sensor and high pressure gaseous fuel injection system |
US6591850B2 (en) | 2001-06-29 | 2003-07-15 | Applied Materials, Inc. | Method and apparatus for fluid flow control |
US6523346B1 (en) * | 2001-11-02 | 2003-02-25 | Alstom (Switzerland) Ltd | Process for controlling the cooling air mass flow of a gas turbine set |
US7060330B2 (en) * | 2002-05-08 | 2006-06-13 | Applied Materials, Inc. | Method for forming ultra low k films using electron beam |
US7192486B2 (en) * | 2002-08-15 | 2007-03-20 | Applied Materials, Inc. | Clog-resistant gas delivery system |
TW200407328A (en) * | 2002-09-19 | 2004-05-16 | Shinetsu Chemical Co | Liquid organometallic compound vaporizing/feeding system |
US7169231B2 (en) * | 2002-12-13 | 2007-01-30 | Lam Research Corporation | Gas distribution system with tuning gas |
JP4137666B2 (ja) * | 2003-02-17 | 2008-08-20 | 株式会社堀場エステック | マスフローコントローラ |
US6990414B2 (en) * | 2003-03-03 | 2006-01-24 | Brad Belke | Electronic gas flow measurement and recording device |
US7335396B2 (en) * | 2003-04-24 | 2008-02-26 | Micron Technology, Inc. | Methods for controlling mass flow rates and pressures in passageways coupled to reaction chambers and systems for depositing material onto microfeature workpieces in reaction chambers |
TW200507141A (en) * | 2003-05-12 | 2005-02-16 | Agere Systems Inc | Method of mass flow control flow verification and calibration |
US7109114B2 (en) * | 2004-05-07 | 2006-09-19 | Applied Materials, Inc. | HDP-CVD seasoning process for high power HDP-CVD gapfil to improve particle performance |
US20070021935A1 (en) | 2005-07-12 | 2007-01-25 | Larson Dean J | Methods for verifying gas flow rates from a gas supply system into a plasma processing chamber |
US7822570B2 (en) | 2006-11-17 | 2010-10-26 | Lam Research Corporation | Methods for performing actual flow verification |
JP2011510404A (ja) * | 2008-01-18 | 2011-03-31 | ピヴォタル システムズ コーポレーション | ガスの流量を決定する方法、ガス・フロー・コントローラの動作を決定する方法、ガスフローコントロールシステムの一部の容量を決定する方法、及びガス搬送システム |
US8997686B2 (en) * | 2010-09-29 | 2015-04-07 | Mks Instruments, Inc. | System for and method of fast pulse gas delivery |
-
2007
- 2007-11-09 US US11/938,171 patent/US7822570B2/en active Active
- 2007-11-14 SG SG2011084670A patent/SG176489A1/en unknown
- 2007-11-14 WO PCT/US2007/084724 patent/WO2008064044A1/en active Application Filing
- 2007-11-14 JP JP2009537333A patent/JP5530718B2/ja active Active
- 2007-11-14 CN CN2007800427823A patent/CN101536159B/zh active Active
- 2007-11-14 KR KR1020097010085A patent/KR101472146B1/ko active IP Right Grant
-
2010
- 2010-09-21 US US12/887,218 patent/US8150646B2/en active Active
-
2012
- 2012-03-30 US US13/436,705 patent/US8521461B2/en active Active
-
2013
- 2013-12-26 JP JP2013268982A patent/JP2014089205A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5740614A (en) * | 1980-08-25 | 1982-03-06 | Oval Eng Co Ltd | Self-checking of reference meter for inspection system employing thereof |
JP2006012872A (ja) * | 2004-06-22 | 2006-01-12 | Tokyo Electron Ltd | 基板処理装置 |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9420157B2 (en) | 2005-07-20 | 2016-08-16 | Lab Partners Associates, Inc. | Zero delay photographic synchronization system and method |
US9918000B2 (en) | 2005-07-20 | 2018-03-13 | Lab Partners Associates, Inc. | Zero delay predictor signal synchronization system and method |
US9250499B2 (en) | 2007-05-29 | 2016-02-02 | Lab Partners Associates, Inc. | TTL photographic wireless communication system and method with exposure compensation value transfer to a remote lighting device |
US9602707B2 (en) | 2007-05-29 | 2017-03-21 | Lab Partners Associates, Inc. | External photographic wireless communication device |
US8538250B2 (en) | 2009-02-12 | 2013-09-17 | Lab Partners Associates, Inc. | Systems and methods for communicating with a device using one or more camera body controls |
US8571401B2 (en) | 2009-02-12 | 2013-10-29 | Lab Partners Associates, Inc. | Systems and methods for changing power states of a remote device using one or more camera body controls and a preset delay |
JP2013526063A (ja) * | 2010-04-30 | 2013-06-20 | アプライド マテリアルズ インコーポレイテッド | オリフィス比コンダクタンス制御を用いたフロー分割誤差を低減するための方法及び装置 |
JP2012248193A (ja) * | 2011-05-26 | 2012-12-13 | Spts Technologies Ltd | マスフローコントローラーの監視 |
JP2018152089A (ja) * | 2011-05-26 | 2018-09-27 | エスピーティーエス テクノロジーズ リミティド | マスフローコントローラーの監視 |
US9690169B2 (en) | 2013-11-04 | 2017-06-27 | Lab Partners Associates, Inc. | Photographic lighting system and method |
JP7507234B2 (ja) | 2019-09-11 | 2024-06-27 | ラム リサーチ コーポレーション | 基板処理システムの処理チャンバの整合を改善するための流量計測較正 |
Also Published As
Publication number | Publication date |
---|---|
KR101472146B1 (ko) | 2014-12-12 |
US20080115560A1 (en) | 2008-05-22 |
US8521461B2 (en) | 2013-08-27 |
CN101536159B (zh) | 2011-12-28 |
KR20090080529A (ko) | 2009-07-24 |
CN101536159A (zh) | 2009-09-16 |
US8150646B2 (en) | 2012-04-03 |
US20110029268A1 (en) | 2011-02-03 |
JP5530718B2 (ja) | 2014-06-25 |
SG176489A1 (en) | 2011-12-29 |
US7822570B2 (en) | 2010-10-26 |
JP2014089205A (ja) | 2014-05-15 |
US20120247581A1 (en) | 2012-10-04 |
WO2008064044A1 (en) | 2008-05-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5530718B2 (ja) | 実流量の妥当性確認の実施方法 | |
JP6093019B2 (ja) | 質量流量制御システム | |
US7881886B1 (en) | Methods for performing transient flow prediction and verification using discharge coefficients | |
US8205629B2 (en) | Real time lead-line characterization for MFC flow verification | |
TWI591466B (zh) | 用於質量流控制器驗證之系統與方法 | |
TWI642910B (zh) | 流量控制機器、流量控制機器的流量校正方法、流量測定機器及使用流量測定機器的流量測定方法 | |
JP5512517B2 (ja) | 異なる体積を提供可能な質量流量検証装置及び関連する方法 | |
JP6130825B2 (ja) | 上流体積質量流量検証システムおよび方法 | |
JPH05248916A (ja) | 質量流量計、流体の質量測定方法及び粘度測定装置 | |
JP2010216807A (ja) | マスフローメータ、マスフローコントローラ、それらを含むマスフローメータシステムおよびマスフローコントローラシステム | |
US10437264B2 (en) | System and method for improving the accuracy of a rate of decay measurement for real time correction in a mass flow controller or mass flow meter by using a thermal model to minimize thermally induced error in the rod measurement | |
JP7105905B2 (ja) | 圧力減衰速度に基づく質量流量点検の方法、システム、及び装置 | |
TWI416619B (zh) | 執行實際流動驗證的方法 | |
US10090178B2 (en) | Gas temperature measurement method and gas introduction system | |
JP7249030B2 (ja) | 流量測定装置内の容積測定方法および流量測定装置 | |
KR20050026393A (ko) | 질량 유량 검출 장치를 보정하기 위한 시스템 및 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20101112 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120119 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20121204 |
|
A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20130228 |
|
A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20130307 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130403 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20130903 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20131226 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20140212 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140324 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140421 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5530718 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |