JP2010507258A5 - - Google Patents

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Publication number
JP2010507258A5
JP2010507258A5 JP2009533451A JP2009533451A JP2010507258A5 JP 2010507258 A5 JP2010507258 A5 JP 2010507258A5 JP 2009533451 A JP2009533451 A JP 2009533451A JP 2009533451 A JP2009533451 A JP 2009533451A JP 2010507258 A5 JP2010507258 A5 JP 2010507258A5
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JP
Japan
Prior art keywords
film substrate
polymer film
deposited metal
pattern
recessed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009533451A
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English (en)
Japanese (ja)
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JP2010507258A (ja
Filing date
Publication date
Priority claimed from US11/550,626 external-priority patent/US20080095988A1/en
Application filed filed Critical
Publication of JP2010507258A publication Critical patent/JP2010507258A/ja
Publication of JP2010507258A5 publication Critical patent/JP2010507258A5/ja
Withdrawn legal-status Critical Current

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JP2009533451A 2006-10-18 2007-10-11 高分子基材上に付着金属のパターンを形成する方法 Withdrawn JP2010507258A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/550,626 US20080095988A1 (en) 2006-10-18 2006-10-18 Methods of patterning a deposit metal on a polymeric substrate
PCT/US2007/081027 WO2008048840A2 (en) 2006-10-18 2007-10-11 Methods of patterning a deposit metal on a polymeric substrate

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014036305A Division JP2014103419A (ja) 2006-10-18 2014-02-27 高分子基材上に付着金属のパターンを形成する方法

Publications (2)

Publication Number Publication Date
JP2010507258A JP2010507258A (ja) 2010-03-04
JP2010507258A5 true JP2010507258A5 (cg-RX-API-DMAC7.html) 2010-11-25

Family

ID=39246947

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2009533451A Withdrawn JP2010507258A (ja) 2006-10-18 2007-10-11 高分子基材上に付着金属のパターンを形成する方法
JP2014036305A Ceased JP2014103419A (ja) 2006-10-18 2014-02-27 高分子基材上に付着金属のパターンを形成する方法
JP2016021732A Withdrawn JP2016105504A (ja) 2006-10-18 2016-02-08 高分子基材上に付着金属のパターンを形成する方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2014036305A Ceased JP2014103419A (ja) 2006-10-18 2014-02-27 高分子基材上に付着金属のパターンを形成する方法
JP2016021732A Withdrawn JP2016105504A (ja) 2006-10-18 2016-02-08 高分子基材上に付着金属のパターンを形成する方法

Country Status (5)

Country Link
US (2) US20080095988A1 (cg-RX-API-DMAC7.html)
EP (1) EP2076619A2 (cg-RX-API-DMAC7.html)
JP (3) JP2010507258A (cg-RX-API-DMAC7.html)
CN (1) CN101528979A (cg-RX-API-DMAC7.html)
WO (1) WO2008048840A2 (cg-RX-API-DMAC7.html)

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