JP2010505638A5 - - Google Patents
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- Publication number
- JP2010505638A5 JP2010505638A5 JP2009532338A JP2009532338A JP2010505638A5 JP 2010505638 A5 JP2010505638 A5 JP 2010505638A5 JP 2009532338 A JP2009532338 A JP 2009532338A JP 2009532338 A JP2009532338 A JP 2009532338A JP 2010505638 A5 JP2010505638 A5 JP 2010505638A5
- Authority
- JP
- Japan
- Prior art keywords
- retaining ring
- recess
- protrusion
- annular
- inner diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004593 Epoxy Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 238000005498 polishing Methods 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/549,622 US7789736B2 (en) | 2006-10-13 | 2006-10-13 | Stepped retaining ring |
| US11/549,622 | 2006-10-13 | ||
| PCT/US2007/005251 WO2008045132A1 (en) | 2006-10-13 | 2007-02-28 | Stepped retaining ring |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010505638A JP2010505638A (ja) | 2010-02-25 |
| JP2010505638A5 true JP2010505638A5 (enExample) | 2010-04-08 |
| JP5330998B2 JP5330998B2 (ja) | 2013-10-30 |
Family
ID=38292642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009532338A Active JP5330998B2 (ja) | 2006-10-13 | 2007-02-28 | 段付き保持リング |
Country Status (7)
| Country | Link |
|---|---|
| US (5) | US7789736B2 (enExample) |
| EP (1) | EP2076359B8 (enExample) |
| JP (1) | JP5330998B2 (enExample) |
| KR (1) | KR101401012B1 (enExample) |
| CN (2) | CN102275127B (enExample) |
| TW (1) | TWI389190B (enExample) |
| WO (1) | WO2008045132A1 (enExample) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008062355A (ja) * | 2006-09-08 | 2008-03-21 | Fujitsu Ltd | 研磨装置及び電子装置の製造方法 |
| US7789736B2 (en) | 2006-10-13 | 2010-09-07 | Applied Materials, Inc. | Stepped retaining ring |
| US8337111B2 (en) * | 2009-12-08 | 2012-12-25 | GM Global Technology Operations LLC | Axial retention assembly |
| US8967978B2 (en) | 2012-07-26 | 2015-03-03 | Pratt & Whitney Canada Corp. | Axial retention for fasteners in fan joint |
| DE102013214020A1 (de) | 2013-07-17 | 2015-02-19 | Stabilo International Gmbh | Digitaler Stift |
| JP6403981B2 (ja) * | 2013-11-13 | 2018-10-10 | 株式会社荏原製作所 | 基板保持装置、研磨装置、研磨方法、およびリテーナリング |
| US10252397B2 (en) * | 2014-10-30 | 2019-04-09 | Applied Materials, Inc. | Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes |
| TWM504343U (zh) * | 2014-12-05 | 2015-07-01 | Kai Fung Technology Co Ltd | 化學機械研磨固定裝置 |
| US10500695B2 (en) | 2015-05-29 | 2019-12-10 | Applied Materials, Inc. | Retaining ring having inner surfaces with features |
| TWD179095S (zh) * | 2015-08-25 | 2016-10-21 | 荏原製作所股份有限公司 | 基板保持環 |
| US10688750B2 (en) * | 2017-10-03 | 2020-06-23 | Applied Materials, Inc. | Bonding structure of E chuck to aluminum base configuration |
| WO2019070757A1 (en) * | 2017-10-04 | 2019-04-11 | Applied Materials, Inc. | RING RING DESIGN |
| DE102018110881A1 (de) * | 2018-05-07 | 2019-11-07 | Schaeffler Technologies AG & Co. KG | Anordnung zur Fliehkraftsicherung zumindest eines auf einer Rotorwelle einer elektrischen Maschine zur Lagesicherung axial festgesetzten Sicherungsrings und Verwendung einer solchen Anordnung |
| KR102708235B1 (ko) * | 2019-06-03 | 2024-09-23 | 주식회사 케이씨텍 | 기판의 연마 장치용 캐리어 헤드의 리테이너 링 |
| CN110181355B (zh) * | 2019-06-27 | 2021-08-17 | 西安奕斯伟硅片技术有限公司 | 一种研磨装置、研磨方法及晶圆 |
| CN112536713A (zh) * | 2019-09-23 | 2021-03-23 | 清华大学 | 一种保持环 |
| CN110524412B (zh) * | 2019-09-30 | 2024-07-12 | 清华大学 | 一种化学机械抛光保持环和化学机械抛光承载头 |
| KR102817778B1 (ko) * | 2020-04-29 | 2025-06-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 균일성 개선을 위한 히터 커버 플레이트 |
| KR102727514B1 (ko) * | 2020-11-09 | 2024-11-08 | 주식회사 케이씨텍 | 리테이너링 및 이를 포함하는 기판 연마 장치 |
| US20230023915A1 (en) * | 2021-07-21 | 2023-01-26 | Applied Materials, Inc. | Interlocked stepped retaining ring |
| US20230129597A1 (en) * | 2021-10-27 | 2023-04-27 | Sch Power Tech Co., Ltd. | Retaining Ring for Wafer Polishing |
| WO2024224356A2 (en) * | 2023-04-28 | 2024-10-31 | Shpp Global Technologies B.V. | Article for chemical mechanical polishing process and chemical mechanical polishing system including the article |
| CN119786402A (zh) * | 2024-12-20 | 2025-04-08 | 拓荆创益(沈阳)半导体设备有限公司 | 晶圆托盘、薄膜沉积设备及方法 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5738574A (en) | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
| US5948204A (en) | 1996-12-30 | 1999-09-07 | Intel Corporation | Wafer carrier ring method and apparatus for chemical-mechanical planarization |
| US6068548A (en) | 1997-12-17 | 2000-05-30 | Intel Corporation | Mechanically stabilized retaining ring for chemical mechanical polishing |
| US6251215B1 (en) | 1998-06-03 | 2001-06-26 | Applied Materials, Inc. | Carrier head with a multilayer retaining ring for chemical mechanical polishing |
| US6186880B1 (en) * | 1999-09-29 | 2001-02-13 | Semiconductor Equipment Technology | Recyclable retaining ring assembly for a chemical mechanical polishing apparatus |
| CN2517109Y (zh) * | 2001-12-06 | 2002-10-16 | 陈水源 | 一种晶片研磨用定位环 |
| CN2538485Y (zh) * | 2002-01-23 | 2003-03-05 | 陈水源 | 晶圆研磨定位环 |
| DE10247180A1 (de) | 2002-10-02 | 2004-04-15 | Ensinger Kunststofftechnologie Gbr | Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung |
| TWM255104U (en) | 2003-02-05 | 2005-01-11 | Applied Materials Inc | Retaining ring with flange for chemical mechanical polishing |
| DE50304463D1 (de) | 2003-04-04 | 2006-09-14 | Leister Process Tech | Verfahren und Vorrichtung zum überlappenden Verschweissen von flächigen Kunststoffmaterialien |
| US6974371B2 (en) * | 2003-04-30 | 2005-12-13 | Applied Materials, Inc. | Two part retaining ring |
| US6821192B1 (en) * | 2003-09-19 | 2004-11-23 | Applied Materials, Inc. | Retaining ring for use in chemical mechanical polishing |
| JP2007537052A (ja) | 2004-05-13 | 2007-12-20 | アプライド マテリアルズ インコーポレイテッド | 導電部を備えた保持リング |
| US7789736B2 (en) * | 2006-10-13 | 2010-09-07 | Applied Materials, Inc. | Stepped retaining ring |
| TWM485089U (zh) | 2014-01-10 | 2014-09-01 | Tanong Prec Technology Co Ltd | 微霧系統 |
-
2006
- 2006-10-13 US US11/549,622 patent/US7789736B2/en active Active
-
2007
- 2007-02-28 CN CN201110234962.XA patent/CN102275127B/zh active Active
- 2007-02-28 EP EP07751980.9A patent/EP2076359B8/en active Active
- 2007-02-28 CN CN200780038236.2A patent/CN101522370B/zh active Active
- 2007-02-28 KR KR1020097009811A patent/KR101401012B1/ko active Active
- 2007-02-28 WO PCT/US2007/005251 patent/WO2008045132A1/en not_active Ceased
- 2007-02-28 JP JP2009532338A patent/JP5330998B2/ja active Active
- 2007-03-01 TW TW096107043A patent/TWI389190B/zh active
-
2010
- 2010-08-05 US US12/851,480 patent/US8465345B2/en active Active
-
2013
- 2013-05-16 US US13/895,620 patent/US9694470B2/en active Active
-
2017
- 2017-06-26 US US15/632,684 patent/US10040168B2/en active Active
-
2018
- 2018-08-06 US US16/056,450 patent/US11958164B2/en active Active
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