TW200833464A - Retainer ring for polishing head - Google Patents

Retainer ring for polishing head

Info

Publication number
TW200833464A
TW200833464A TW096140964A TW96140964A TW200833464A TW 200833464 A TW200833464 A TW 200833464A TW 096140964 A TW096140964 A TW 096140964A TW 96140964 A TW96140964 A TW 96140964A TW 200833464 A TW200833464 A TW 200833464A
Authority
TW
Taiwan
Prior art keywords
polishing head
retainer ring
base unit
resin
ring
Prior art date
Application number
TW096140964A
Other languages
Chinese (zh)
Inventor
Takayoshi Kuwabara
Soshi Yamada
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of TW200833464A publication Critical patent/TW200833464A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

In order to achieve the above object, the invention provides a retainer ring for polishing head includes: a base unit made of a highly rigid material, formed to have a ring-like shape, and supported on the polishing head side; and a resin unit in which a plurality of resin blocks are fixed to the lower surface of the base unit at almost the same intervals and which serves as a contact side to the polishing pad. Flow paths for the slurry are constituted by spaces between adjacent resin blocks and the lower surface of the base unit.
TW096140964A 2007-01-16 2007-10-31 Retainer ring for polishing head TW200833464A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007007485A JP2008177248A (en) 2007-01-16 2007-01-16 Retainer ring for polishing head

Publications (1)

Publication Number Publication Date
TW200833464A true TW200833464A (en) 2008-08-16

Family

ID=39510003

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096140964A TW200833464A (en) 2007-01-16 2007-10-31 Retainer ring for polishing head

Country Status (5)

Country Link
US (1) US20080171500A1 (en)
JP (1) JP2008177248A (en)
KR (1) KR20080067563A (en)
DE (1) DE102007052100A1 (en)
TW (1) TW200833464A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505910B (en) * 2012-11-05 2015-11-01 Sang Hyo Han Method of manufacturing retainer ring for polishing wafer
CN113023357A (en) * 2021-04-14 2021-06-25 湖南三安半导体有限责任公司 Pasting device
TWI740989B (en) * 2016-07-25 2021-10-01 美商應用材料股份有限公司 Retaining ring for cmp

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010036284A (en) * 2008-08-01 2010-02-18 Tokyo Seimitsu Co Ltd Polishing head having no contamination of metal
KR20100114327A (en) * 2009-04-15 2010-10-25 (주)아이에스테크노 Method of producing retainer ring abrasive and retainer ring abrasive made thereby
US8998676B2 (en) * 2012-10-26 2015-04-07 Applied Materials, Inc. Retaining ring with selected stiffness and thickness
KR101637540B1 (en) * 2014-06-23 2016-07-08 주식회사 케이씨텍 Chemical mechanical polishing apparatus
KR101655075B1 (en) * 2015-08-21 2016-09-07 주식회사 케이씨텍 Chemical mechanical polishing apparatus
KR101675560B1 (en) * 2015-11-02 2016-11-14 주식회사 윌비에스엔티 Retainner Ring of Chemical Mechanical Polishing Apparatus
JP6966896B2 (en) * 2017-08-21 2021-11-17 信越ポリマー株式会社 Sliding member
KR102088512B1 (en) * 2018-07-13 2020-03-12 주식회사 에스엠티 Cmp retainer ring, method of manufacturing the same, and cmp apparatus including the retainer ring
JP1651619S (en) * 2019-07-11 2020-01-27
JP1651618S (en) * 2019-07-11 2020-01-27
USD940670S1 (en) * 2019-09-26 2022-01-11 Willbe S&T Co., Ltd. Retainer ring for chemical mechanical polishing device
TWI791305B (en) * 2021-10-18 2023-02-01 尚源股份有限公司 Wafer Grinding Embedded Structure
US20230129597A1 (en) * 2021-10-27 2023-04-27 Sch Power Tech Co., Ltd. Retaining Ring for Wafer Polishing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1177859B1 (en) * 2000-07-31 2009-04-15 Ebara Corporation Substrate holding apparatus and substrate polishing apparatus
US7255637B2 (en) * 2000-09-08 2007-08-14 Applied Materials, Inc. Carrier head vibration damping
JP3627143B2 (en) 2000-10-23 2005-03-09 株式会社東京精密 Wafer polishing equipment
US6899610B2 (en) * 2001-06-01 2005-05-31 Raytech Innovative Solutions, Inc. Retaining ring with wear pad for use in chemical mechanical planarization
WO2003061904A1 (en) * 2002-01-22 2003-07-31 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface for slurry distribution
JPWO2006038259A1 (en) * 2004-09-30 2008-07-31 株式会社ルネサステクノロジ Method of manufacturing semiconductor device
US7134948B2 (en) * 2005-01-15 2006-11-14 Applied Materials, Inc. Magnetically secured retaining ring

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI505910B (en) * 2012-11-05 2015-11-01 Sang Hyo Han Method of manufacturing retainer ring for polishing wafer
TWI740989B (en) * 2016-07-25 2021-10-01 美商應用材料股份有限公司 Retaining ring for cmp
US11673226B2 (en) 2016-07-25 2023-06-13 Applied Materials, Inc. Retaining ring for CMP
CN113023357A (en) * 2021-04-14 2021-06-25 湖南三安半导体有限责任公司 Pasting device
CN113023357B (en) * 2021-04-14 2022-06-07 湖南三安半导体有限责任公司 Pasting device

Also Published As

Publication number Publication date
JP2008177248A (en) 2008-07-31
US20080171500A1 (en) 2008-07-17
DE102007052100A1 (en) 2008-07-17
KR20080067563A (en) 2008-07-21

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