TWI389190B - 階梯式定位環 - Google Patents

階梯式定位環 Download PDF

Info

Publication number
TWI389190B
TWI389190B TW096107043A TW96107043A TWI389190B TW I389190 B TWI389190 B TW I389190B TW 096107043 A TW096107043 A TW 096107043A TW 96107043 A TW96107043 A TW 96107043A TW I389190 B TWI389190 B TW I389190B
Authority
TW
Taiwan
Prior art keywords
ring
recess
inner diameter
positioning ring
annular
Prior art date
Application number
TW096107043A
Other languages
English (en)
Chinese (zh)
Other versions
TW200818293A (en
Inventor
Der Veen Shaun Van
Steven M Zuniga
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200818293A publication Critical patent/TW200818293A/zh
Application granted granted Critical
Publication of TWI389190B publication Critical patent/TWI389190B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW096107043A 2006-10-13 2007-03-01 階梯式定位環 TWI389190B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/549,622 US7789736B2 (en) 2006-10-13 2006-10-13 Stepped retaining ring

Publications (2)

Publication Number Publication Date
TW200818293A TW200818293A (en) 2008-04-16
TWI389190B true TWI389190B (zh) 2013-03-11

Family

ID=38292642

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096107043A TWI389190B (zh) 2006-10-13 2007-03-01 階梯式定位環

Country Status (7)

Country Link
US (5) US7789736B2 (enExample)
EP (1) EP2076359B8 (enExample)
JP (1) JP5330998B2 (enExample)
KR (1) KR101401012B1 (enExample)
CN (2) CN102275127B (enExample)
TW (1) TWI389190B (enExample)
WO (1) WO2008045132A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008062355A (ja) * 2006-09-08 2008-03-21 Fujitsu Ltd 研磨装置及び電子装置の製造方法
US7789736B2 (en) 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
US8337111B2 (en) * 2009-12-08 2012-12-25 GM Global Technology Operations LLC Axial retention assembly
US8967978B2 (en) 2012-07-26 2015-03-03 Pratt & Whitney Canada Corp. Axial retention for fasteners in fan joint
DE102013214020A1 (de) 2013-07-17 2015-02-19 Stabilo International Gmbh Digitaler Stift
JP6403981B2 (ja) * 2013-11-13 2018-10-10 株式会社荏原製作所 基板保持装置、研磨装置、研磨方法、およびリテーナリング
US10252397B2 (en) * 2014-10-30 2019-04-09 Applied Materials, Inc. Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
TWM504343U (zh) * 2014-12-05 2015-07-01 Kai Fung Technology Co Ltd 化學機械研磨固定裝置
US10500695B2 (en) 2015-05-29 2019-12-10 Applied Materials, Inc. Retaining ring having inner surfaces with features
TWD179095S (zh) * 2015-08-25 2016-10-21 荏原製作所股份有限公司 基板保持環
US10688750B2 (en) * 2017-10-03 2020-06-23 Applied Materials, Inc. Bonding structure of E chuck to aluminum base configuration
WO2019070757A1 (en) * 2017-10-04 2019-04-11 Applied Materials, Inc. RING RING DESIGN
DE102018110881A1 (de) * 2018-05-07 2019-11-07 Schaeffler Technologies AG & Co. KG Anordnung zur Fliehkraftsicherung zumindest eines auf einer Rotorwelle einer elektrischen Maschine zur Lagesicherung axial festgesetzten Sicherungsrings und Verwendung einer solchen Anordnung
KR102708235B1 (ko) * 2019-06-03 2024-09-23 주식회사 케이씨텍 기판의 연마 장치용 캐리어 헤드의 리테이너 링
CN110181355B (zh) * 2019-06-27 2021-08-17 西安奕斯伟硅片技术有限公司 一种研磨装置、研磨方法及晶圆
CN112536713A (zh) * 2019-09-23 2021-03-23 清华大学 一种保持环
CN110524412B (zh) * 2019-09-30 2024-07-12 清华大学 一种化学机械抛光保持环和化学机械抛光承载头
KR102817778B1 (ko) * 2020-04-29 2025-06-05 어플라이드 머티어리얼스, 인코포레이티드 균일성 개선을 위한 히터 커버 플레이트
KR102727514B1 (ko) * 2020-11-09 2024-11-08 주식회사 케이씨텍 리테이너링 및 이를 포함하는 기판 연마 장치
US20230023915A1 (en) * 2021-07-21 2023-01-26 Applied Materials, Inc. Interlocked stepped retaining ring
US20230129597A1 (en) * 2021-10-27 2023-04-27 Sch Power Tech Co., Ltd. Retaining Ring for Wafer Polishing
WO2024224356A2 (en) * 2023-04-28 2024-10-31 Shpp Global Technologies B.V. Article for chemical mechanical polishing process and chemical mechanical polishing system including the article
CN119786402A (zh) * 2024-12-20 2025-04-08 拓荆创益(沈阳)半导体设备有限公司 晶圆托盘、薄膜沉积设备及方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5948204A (en) 1996-12-30 1999-09-07 Intel Corporation Wafer carrier ring method and apparatus for chemical-mechanical planarization
US6068548A (en) 1997-12-17 2000-05-30 Intel Corporation Mechanically stabilized retaining ring for chemical mechanical polishing
US6251215B1 (en) 1998-06-03 2001-06-26 Applied Materials, Inc. Carrier head with a multilayer retaining ring for chemical mechanical polishing
US6186880B1 (en) * 1999-09-29 2001-02-13 Semiconductor Equipment Technology Recyclable retaining ring assembly for a chemical mechanical polishing apparatus
CN2517109Y (zh) * 2001-12-06 2002-10-16 陈水源 一种晶片研磨用定位环
CN2538485Y (zh) * 2002-01-23 2003-03-05 陈水源 晶圆研磨定位环
DE10247180A1 (de) 2002-10-02 2004-04-15 Ensinger Kunststofftechnologie Gbr Haltering zum Halten von Halbleiterwafern in einer chemisch-mechanischen Poliervorrichtung
TWM255104U (en) 2003-02-05 2005-01-11 Applied Materials Inc Retaining ring with flange for chemical mechanical polishing
DE50304463D1 (de) 2003-04-04 2006-09-14 Leister Process Tech Verfahren und Vorrichtung zum überlappenden Verschweissen von flächigen Kunststoffmaterialien
US6974371B2 (en) * 2003-04-30 2005-12-13 Applied Materials, Inc. Two part retaining ring
US6821192B1 (en) * 2003-09-19 2004-11-23 Applied Materials, Inc. Retaining ring for use in chemical mechanical polishing
JP2007537052A (ja) 2004-05-13 2007-12-20 アプライド　マテリアルズ　インコーポレイテッド 導電部を備えた保持リング
US7789736B2 (en) * 2006-10-13 2010-09-07 Applied Materials, Inc. Stepped retaining ring
TWM485089U (zh) 2014-01-10 2014-09-01 Tanong Prec Technology Co Ltd 微霧系統

Also Published As

Publication number Publication date
KR20090066328A (ko) 2009-06-23
KR101401012B1 (ko) 2014-05-29
US20190030679A1 (en) 2019-01-31
CN102275127A (zh) 2011-12-14
CN102275127B (zh) 2015-01-07
US11958164B2 (en) 2024-04-16
JP2010505638A (ja) 2010-02-25
US20130231031A1 (en) 2013-09-05
CN101522370B (zh) 2011-08-17
TW200818293A (en) 2008-04-16
US10040168B2 (en) 2018-08-07
EP2076359B1 (en) 2016-07-13
US7789736B2 (en) 2010-09-07
CN101522370A (zh) 2009-09-02
US9694470B2 (en) 2017-07-04
WO2008045132A1 (en) 2008-04-17
EP2076359A1 (en) 2009-07-08
US20100303584A1 (en) 2010-12-02
US20170312882A1 (en) 2017-11-02
JP5330998B2 (ja) 2013-10-30
US20080096467A1 (en) 2008-04-24
US8465345B2 (en) 2013-06-18
EP2076359B8 (en) 2017-08-16

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