JP2010504436A - 希釈ガスを再循環させるための粒子トラップ／フィルタを含むシステム及び方法 - Google Patents

希釈ガスを再循環させるための粒子トラップ／フィルタを含むシステム及び方法 Download PDF

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Publication number
JP2010504436A
JP2010504436A JP2009529405A JP2009529405A JP2010504436A JP 2010504436 A JP2010504436 A JP 2010504436A JP 2009529405 A JP2009529405 A JP 2009529405A JP 2009529405 A JP2009529405 A JP 2009529405A JP 2010504436 A JP2010504436 A JP 2010504436A
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JP
Japan
Prior art keywords
chamber
gas
process gas
filter
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2009529405A
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English (en)
Japanese (ja)
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JP2010504436A5 (enExample
Inventor
ジョン エム ホワイト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/565,400 external-priority patent/US20080072929A1/en
Priority claimed from US11/846,359 external-priority patent/US20080072822A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of JP2010504436A publication Critical patent/JP2010504436A/ja
Publication of JP2010504436A5 publication Critical patent/JP2010504436A5/ja
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Vapour Deposition (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
JP2009529405A 2006-09-22 2007-09-20 希釈ガスを再循環させるための粒子トラップ／フィルタを含むシステム及び方法 Withdrawn JP2010504436A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US82671806P 2006-09-22 2006-09-22
US11/565,400 US20080072929A1 (en) 2006-09-22 2006-11-30 Dilution gas recirculation
US11/846,359 US20080072822A1 (en) 2006-09-22 2007-08-28 System and method including a particle trap/filter for recirculating a dilution gas
PCT/US2007/079084 WO2008036849A2 (en) 2006-09-22 2007-09-20 Particle trap / filter for recirculating a dilution gas in a plasma enhanced chemical vapor deposition system

Publications (2)

Publication Number Publication Date
JP2010504436A true JP2010504436A (ja) 2010-02-12
JP2010504436A5 JP2010504436A5 (enExample) 2010-11-11

Family

ID=39201842

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009529405A Withdrawn JP2010504436A (ja) 2006-09-22 2007-09-20 希釈ガスを再循環させるための粒子トラップ／フィルタを含むシステム及び方法

Country Status (5)

Country Link
EP (1) EP2082077A2 (enExample)
JP (1) JP2010504436A (enExample)
KR (1) KR20090058027A (enExample)
TW (1) TW200821402A (enExample)
WO (1) WO2008036849A2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014497A1 (ja) 2010-07-30 2012-02-02 Ｊｘ日鉱日石エネルギー株式会社 排ガス処理システム
JP2013089835A (ja) * 2011-10-20 2013-05-13 Shin Etsu Handotai Co Ltd 有害物除去装置
KR102062317B1 (ko) * 2013-04-24 2020-01-06 삼성디스플레이 주식회사 가스 정제 장치 및 방법

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101000296B1 (ko) * 2008-09-10 2010-12-13 세메스 주식회사 기액 분리 장치 및 이를 포함하는 기판 처리 장치
GB2489975A (en) * 2011-04-14 2012-10-17 Edwards Ltd Vacuum pumping system
US10395918B2 (en) 2015-05-22 2019-08-27 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for controlling plasma in semiconductor fabrication
CN111430281B (zh) * 2020-05-25 2023-03-31 中国科学院微电子研究所 一种反应腔室、反应腔室的控制方法及半导体加工设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6206970B1 (en) * 1997-09-03 2001-03-27 Micron Technology, Inc. Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods
US6206971B1 (en) * 1999-03-29 2001-03-27 Applied Materials, Inc. Integrated temperature controlled exhaust and cold trap assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012014497A1 (ja) 2010-07-30 2012-02-02 Ｊｘ日鉱日石エネルギー株式会社 排ガス処理システム
JP2013089835A (ja) * 2011-10-20 2013-05-13 Shin Etsu Handotai Co Ltd 有害物除去装置
KR102062317B1 (ko) * 2013-04-24 2020-01-06 삼성디스플레이 주식회사 가스 정제 장치 및 방법

Also Published As

Publication number Publication date
WO2008036849A2 (en) 2008-03-27
EP2082077A2 (en) 2009-07-29
TW200821402A (en) 2008-05-16
KR20090058027A (ko) 2009-06-08
WO2008036849A3 (en) 2008-06-12

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