KR20090058027A - 희석 가스를 재순환시키기 위한 입자 트랩/필터를 포함하는 시스템 및 방법 - Google Patents

희석 가스를 재순환시키기 위한 입자 트랩/필터를 포함하는 시스템 및 방법 Download PDF

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Publication number
KR20090058027A
KR20090058027A KR1020097008138A KR20097008138A KR20090058027A KR 20090058027 A KR20090058027 A KR 20090058027A KR 1020097008138 A KR1020097008138 A KR 1020097008138A KR 20097008138 A KR20097008138 A KR 20097008138A KR 20090058027 A KR20090058027 A KR 20090058027A
Authority
KR
South Korea
Prior art keywords
chamber
vapor deposition
chemical vapor
enhanced chemical
plasma enhanced
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020097008138A
Other languages
English (en)
Korean (ko)
Inventor
존 엠. 화이트
Original Assignee
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/565,400 external-priority patent/US20080072929A1/en
Priority claimed from US11/846,359 external-priority patent/US20080072822A1/en
Application filed by 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 어플라이드 머티어리얼스, 인코포레이티드
Publication of KR20090058027A publication Critical patent/KR20090058027A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Chemical Vapour Deposition (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)
KR1020097008138A 2006-09-22 2007-09-20 희석 가스를 재순환시키기 위한 입자 트랩/필터를 포함하는 시스템 및 방법 Withdrawn KR20090058027A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US82671806P 2006-09-22 2006-09-22
US60/826,718 2006-09-22
US11/565,400 2006-11-30
US11/565,400 US20080072929A1 (en) 2006-09-22 2006-11-30 Dilution gas recirculation
US11/846,359 2007-08-28
US11/846,359 US20080072822A1 (en) 2006-09-22 2007-08-28 System and method including a particle trap/filter for recirculating a dilution gas

Publications (1)

Publication Number Publication Date
KR20090058027A true KR20090058027A (ko) 2009-06-08

Family

ID=39201842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020097008138A Withdrawn KR20090058027A (ko) 2006-09-22 2007-09-20 희석 가스를 재순환시키기 위한 입자 트랩/필터를 포함하는 시스템 및 방법

Country Status (5)

Country Link
EP (1) EP2082077A2 (enExample)
JP (1) JP2010504436A (enExample)
KR (1) KR20090058027A (enExample)
TW (1) TW200821402A (enExample)
WO (1) WO2008036849A2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101000296B1 (ko) * 2008-09-10 2010-12-13 세메스 주식회사 기액 분리 장치 및 이를 포함하는 기판 처리 장치
CN103052435A (zh) 2010-07-30 2013-04-17 吉坤日矿日石能源株式会社 排气处理系统
GB2489975A (en) * 2011-04-14 2012-10-17 Edwards Ltd Vacuum pumping system
JP5598454B2 (ja) * 2011-10-20 2014-10-01 信越半導体株式会社 有害物除去装置
KR102062317B1 (ko) * 2013-04-24 2020-01-06 삼성디스플레이 주식회사 가스 정제 장치 및 방법
US10395918B2 (en) 2015-05-22 2019-08-27 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for controlling plasma in semiconductor fabrication
JP6934379B2 (ja) * 2017-09-22 2021-09-15 大陽日酸株式会社 トラップ装置及びトラップ装置の運転方法
CN111430281B (zh) * 2020-05-25 2023-03-31 中国科学院微电子研究所 一种反应腔室、反应腔室的控制方法及半导体加工设备

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6206970B1 (en) * 1997-09-03 2001-03-27 Micron Technology, Inc. Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods
US6206971B1 (en) * 1999-03-29 2001-03-27 Applied Materials, Inc. Integrated temperature controlled exhaust and cold trap assembly

Also Published As

Publication number Publication date
WO2008036849A3 (en) 2008-06-12
JP2010504436A (ja) 2010-02-12
WO2008036849A2 (en) 2008-03-27
EP2082077A2 (en) 2009-07-29
TW200821402A (en) 2008-05-16

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20090421

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid