WO2008036849A3 - Particle trap / filter for recirculating a dilution gas in a plasma enhanced chemical vapor deposition system - Google Patents

Particle trap / filter for recirculating a dilution gas in a plasma enhanced chemical vapor deposition system Download PDF

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Publication number
WO2008036849A3
WO2008036849A3 PCT/US2007/079084 US2007079084W WO2008036849A3 WO 2008036849 A3 WO2008036849 A3 WO 2008036849A3 US 2007079084 W US2007079084 W US 2007079084W WO 2008036849 A3 WO2008036849 A3 WO 2008036849A3
Authority
WO
WIPO (PCT)
Prior art keywords
filter
particle trap
gas
recirculating
vapor deposition
Prior art date
Application number
PCT/US2007/079084
Other languages
French (fr)
Other versions
WO2008036849A2 (en
Inventor
John M White
Original Assignee
Applied Materials Inc
John M White
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/565,400 external-priority patent/US20080072929A1/en
Priority claimed from US11/846,359 external-priority patent/US20080072822A1/en
Application filed by Applied Materials Inc, John M White filed Critical Applied Materials Inc
Priority to JP2009529405A priority Critical patent/JP2010504436A/en
Priority to EP07842916A priority patent/EP2082077A2/en
Publication of WO2008036849A2 publication Critical patent/WO2008036849A2/en
Publication of WO2008036849A3 publication Critical patent/WO2008036849A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D53/00—Separation of gases or vapours; Recovering vapours of volatile solvents from gases; Chemical or biological purification of waste gases, e.g. engine exhaust gases, smoke, fumes, flue gases, aerosols
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02C—CAPTURE, STORAGE, SEQUESTRATION OR DISPOSAL OF GREENHOUSE GASES [GHG]
    • Y02C20/00—Capture or disposal of greenhouse gases
    • Y02C20/30—Capture or disposal of greenhouse gases of perfluorocarbons [PFC], hydrofluorocarbons [HFC] or sulfur hexafluoride [SF6]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Filtering Of Dispersed Particles In Gases (AREA)

Abstract

The present invention comprises a method and an apparatus that include a particle trap/filter for recirculating a processing gas through a system. The processing gas may be evacuated from the chamber and may pass through a particle trap/filter. A portion of the gas may recirculate back to the processing chamber while another portion of the process gas may be evacuated through mechanical backing pumps. As the processing gas flows through the particle trap/filter, contaminant substances may be captured by a filter medium inside the particle trap/filter. The recirculated portion of the processing gas may then join fresh, unrecirculated process gas and enter the processing chamber. The amount of gas recirculated may determine the amount of fresh, unrecirculated process gas that may be delivered to the process chamber.
PCT/US2007/079084 2006-09-22 2007-09-20 Particle trap / filter for recirculating a dilution gas in a plasma enhanced chemical vapor deposition system WO2008036849A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009529405A JP2010504436A (en) 2006-09-22 2007-09-20 System and method including a particle trap / filter for recirculating diluent gas
EP07842916A EP2082077A2 (en) 2006-09-22 2007-09-20 System and method including a particle trap/filter for recirculating a dilution gas

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US82671806P 2006-09-22 2006-09-22
US60/826,718 2006-09-22
US11/565,400 US20080072929A1 (en) 2006-09-22 2006-11-30 Dilution gas recirculation
US11/565,400 2006-11-30
US11/846,359 2007-08-28
US11/846,359 US20080072822A1 (en) 2006-09-22 2007-08-28 System and method including a particle trap/filter for recirculating a dilution gas

Publications (2)

Publication Number Publication Date
WO2008036849A2 WO2008036849A2 (en) 2008-03-27
WO2008036849A3 true WO2008036849A3 (en) 2008-06-12

Family

ID=39201842

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/079084 WO2008036849A2 (en) 2006-09-22 2007-09-20 Particle trap / filter for recirculating a dilution gas in a plasma enhanced chemical vapor deposition system

Country Status (5)

Country Link
EP (1) EP2082077A2 (en)
JP (1) JP2010504436A (en)
KR (1) KR20090058027A (en)
TW (1) TW200821402A (en)
WO (1) WO2008036849A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101000296B1 (en) * 2008-09-10 2010-12-13 세메스 주식회사 Apparatus for separating a gas-liquid and apparatus for processing a substrate including the same
WO2012014497A1 (en) 2010-07-30 2012-02-02 Ｊｘ日鉱日石エネルギー株式会社 Exhaust gas processing system
GB2489975A (en) 2011-04-14 2012-10-17 Edwards Ltd Vacuum pumping system
JP5598454B2 (en) * 2011-10-20 2014-10-01 信越半導体株式会社 Hazardous material removal device
KR102062317B1 (en) * 2013-04-24 2020-01-06 삼성디스플레이 주식회사 Apparatus and method for purifying gas
US10395918B2 (en) 2015-05-22 2019-08-27 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for controlling plasma in semiconductor fabrication
CN111430281B (en) * 2020-05-25 2023-03-31 中国科学院微电子研究所 Reaction chamber, control method of reaction chamber and semiconductor processing equipment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6206970B1 (en) * 1997-09-03 2001-03-27 Micron Technology, Inc. Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods
US6517592B2 (en) * 1999-03-29 2003-02-11 Applied Materials, Inc. Cold trap assembly

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6206970B1 (en) * 1997-09-03 2001-03-27 Micron Technology, Inc. Semiconductor wafer processor, semiconductor processor gas filtering system and semiconductor processing methods
US6517592B2 (en) * 1999-03-29 2003-02-11 Applied Materials, Inc. Cold trap assembly

Also Published As

Publication number Publication date
WO2008036849A2 (en) 2008-03-27
TW200821402A (en) 2008-05-16
KR20090058027A (en) 2009-06-08
JP2010504436A (en) 2010-02-12
EP2082077A2 (en) 2009-07-29

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