JP2010280746A5 - - Google Patents

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Publication number
JP2010280746A5
JP2010280746A5 JP2009132914A JP2009132914A JP2010280746A5 JP 2010280746 A5 JP2010280746 A5 JP 2010280746A5 JP 2009132914 A JP2009132914 A JP 2009132914A JP 2009132914 A JP2009132914 A JP 2009132914A JP 2010280746 A5 JP2010280746 A5 JP 2010280746A5
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JP
Japan
Prior art keywords
resin composition
meth
acrylate
thermosetting resin
polyfunctional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009132914A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010280746A (ja
JP5636169B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009132914A priority Critical patent/JP5636169B2/ja
Priority claimed from JP2009132914A external-priority patent/JP5636169B2/ja
Publication of JP2010280746A publication Critical patent/JP2010280746A/ja
Publication of JP2010280746A5 publication Critical patent/JP2010280746A5/ja
Application granted granted Critical
Publication of JP5636169B2 publication Critical patent/JP5636169B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009132914A 2009-06-02 2009-06-02 熱硬化性樹脂組成物及び電気電子部品 Expired - Fee Related JP5636169B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009132914A JP5636169B2 (ja) 2009-06-02 2009-06-02 熱硬化性樹脂組成物及び電気電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009132914A JP5636169B2 (ja) 2009-06-02 2009-06-02 熱硬化性樹脂組成物及び電気電子部品

Publications (3)

Publication Number Publication Date
JP2010280746A JP2010280746A (ja) 2010-12-16
JP2010280746A5 true JP2010280746A5 (https=) 2012-03-29
JP5636169B2 JP5636169B2 (ja) 2014-12-03

Family

ID=43537786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009132914A Expired - Fee Related JP5636169B2 (ja) 2009-06-02 2009-06-02 熱硬化性樹脂組成物及び電気電子部品

Country Status (1)

Country Link
JP (1) JP5636169B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2012101977A1 (ja) * 2011-01-25 2014-06-30 パナソニック株式会社 モールド構造体およびモータ
JP6419090B2 (ja) * 2014-01-29 2018-11-07 昭和電工株式会社 熱硬化性樹脂組成物、その硬化物、電気電子部品

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62199640A (ja) * 1986-02-28 1987-09-03 Nippon Shokubai Kagaku Kogyo Co Ltd 耐熱・耐熱水性硬化性組成物
JP2000053731A (ja) * 1998-06-04 2000-02-22 Mitsubishi Motors Corp 制振性樹脂組成物及び該樹脂組成物を用いた構造用制振性樹脂成形品
JP2004027019A (ja) * 2002-06-25 2004-01-29 Matsushita Electric Works Ltd 電気・電子部品成形用不飽和ポリエステル樹脂組成物及びその成形品
JP2005248019A (ja) * 2004-03-04 2005-09-15 Sumitomo Bakelite Co Ltd 樹脂組成物及び樹脂組成物を使用して作製した半導体装置
JP2006008867A (ja) * 2004-06-25 2006-01-12 Matsushita Electric Works Ltd ビニルエステル樹脂組成物及びその成形品
JP2009077577A (ja) * 2007-09-21 2009-04-09 Showa Highpolymer Co Ltd モータ構成部品封止用不飽和ポリエステル樹脂組成物及びそれを用いた封入モータ

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