JP2010278207A5 - - Google Patents

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Publication number
JP2010278207A5
JP2010278207A5 JP2009129011A JP2009129011A JP2010278207A5 JP 2010278207 A5 JP2010278207 A5 JP 2010278207A5 JP 2009129011 A JP2009129011 A JP 2009129011A JP 2009129011 A JP2009129011 A JP 2009129011A JP 2010278207 A5 JP2010278207 A5 JP 2010278207A5
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JP
Japan
Prior art keywords
plate
processing apparatus
plasma processing
processing chamber
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009129011A
Other languages
English (en)
Japanese (ja)
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JP2010278207A (ja
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Publication date
Application filed filed Critical
Priority to JP2009129011A priority Critical patent/JP2010278207A/ja
Priority claimed from JP2009129011A external-priority patent/JP2010278207A/ja
Publication of JP2010278207A publication Critical patent/JP2010278207A/ja
Publication of JP2010278207A5 publication Critical patent/JP2010278207A5/ja
Pending legal-status Critical Current

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JP2009129011A 2009-05-28 2009-05-28 プラズマ処理装置 Pending JP2010278207A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009129011A JP2010278207A (ja) 2009-05-28 2009-05-28 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009129011A JP2010278207A (ja) 2009-05-28 2009-05-28 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JP2010278207A JP2010278207A (ja) 2010-12-09
JP2010278207A5 true JP2010278207A5 (enExample) 2012-07-12

Family

ID=43424904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009129011A Pending JP2010278207A (ja) 2009-05-28 2009-05-28 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP2010278207A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013204053A (ja) * 2012-03-27 2013-10-07 Ulvac Japan Ltd 成膜装置
US12014903B2 (en) * 2019-07-18 2024-06-18 Hitachi High-Tech Corporation Plasma processing apparatus
JP7644606B2 (ja) * 2021-01-27 2025-03-12 株式会社日立ハイテク 真空処理装置
CN115483085A (zh) * 2022-10-17 2022-12-16 盛吉盛半导体科技(北京)有限公司 一种用于集成电路设备改善抽气均匀性的装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11345801A (ja) * 1998-05-29 1999-12-14 Shibaura Mechatronics Corp 真空処理装置
JP2000058294A (ja) * 1998-08-07 2000-02-25 Furontekku:Kk プラズマ処理装置
JP3748230B2 (ja) * 2002-02-20 2006-02-22 株式会社日立ハイテクノロジーズ プラズマエッチング装置及びシャワープレート
JP2004349375A (ja) * 2003-05-21 2004-12-09 Nec Kansai Ltd ドライエッチング装置のガス分散板
JP4825689B2 (ja) * 2007-01-12 2011-11-30 株式会社日立ハイテクノロジーズ 真空処理装置
JP2009111301A (ja) * 2007-11-01 2009-05-21 Hitachi High-Technologies Corp プラズマ処理装置

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