JP2010275596A - 接触抵抗、防汚特性に優れるプローブピン用途に好適な銀合金 - Google Patents
接触抵抗、防汚特性に優れるプローブピン用途に好適な銀合金 Download PDFInfo
- Publication number
- JP2010275596A JP2010275596A JP2009129992A JP2009129992A JP2010275596A JP 2010275596 A JP2010275596 A JP 2010275596A JP 2009129992 A JP2009129992 A JP 2009129992A JP 2009129992 A JP2009129992 A JP 2009129992A JP 2010275596 A JP2010275596 A JP 2010275596A
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- JP
- Japan
- Prior art keywords
- probe pin
- contact resistance
- application
- silver alloy
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
- C22C5/08—Alloys based on silver with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
【解決手段】本発明は、Au−Cu合金からなるプローブピン用途に適した銀合金であって、Cu:30〜50重量%、残部Agである銀合金である。この材料は、更に、Niを2〜10重量%含むことで、強度面でより改善される。そして、これらの材料からなるプローブピンは、低い接触圧でも接触抵抗が安定しており、強度面、防汚特性にも優れ、長期間安定的に使用可能なプローブピンを得ることができる。
【選択図】図3
Description
Claims (3)
- Au−Cu合金からなるプローブピン用途に適した銀合金であって、Cu:30〜50重量%、残部Agである銀合金。
- 更に、Niを2〜10重量%含む請求項1記載のプローブピン用途に適した銀合金。
- 請求項1又は請求項2記載の材料からなるプローブピン。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009129992A JP4801757B2 (ja) | 2009-05-29 | 2009-05-29 | 接触抵抗、防汚特性に優れるプローブピン |
TW099116958A TWI486461B (zh) | 2009-05-29 | 2010-05-27 | 適用於接觸電阻、防污特性良好的探測針用途的銀合金 |
EP10780644.0A EP2436790B1 (en) | 2009-05-29 | 2010-05-28 | Silver alloy that is appropriately usable in probe pins having excellent contact resistance and excellent anti-stain properties |
CN201510672606.4A CN105369049B (zh) | 2009-05-29 | 2010-05-28 | 接触电阻和防污特性优良的适合用于探针用途的银合金 |
US13/057,370 US8591805B2 (en) | 2009-05-29 | 2010-05-28 | Silver alloy having excellent contact resistance and antifouling property and suitable for use in probe pin |
KR1020117003906A KR101260135B1 (ko) | 2009-05-29 | 2010-05-28 | 접촉저항, 방오특성이 우수한 프로브 핀 |
CN2010800025225A CN102137945A (zh) | 2009-05-29 | 2010-05-28 | 接触电阻和防污特性优良的适合用于探针用途的银合金 |
PCT/JP2010/059087 WO2010137690A1 (ja) | 2009-05-29 | 2010-05-28 | 接触抵抗、防汚特性に優れるプローブピン用途に好適な銀合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009129992A JP4801757B2 (ja) | 2009-05-29 | 2009-05-29 | 接触抵抗、防汚特性に優れるプローブピン |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010275596A true JP2010275596A (ja) | 2010-12-09 |
JP4801757B2 JP4801757B2 (ja) | 2011-10-26 |
Family
ID=43222795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009129992A Active JP4801757B2 (ja) | 2009-05-29 | 2009-05-29 | 接触抵抗、防汚特性に優れるプローブピン |
Country Status (7)
Country | Link |
---|---|
US (1) | US8591805B2 (ja) |
EP (1) | EP2436790B1 (ja) |
JP (1) | JP4801757B2 (ja) |
KR (1) | KR101260135B1 (ja) |
CN (2) | CN105369049B (ja) |
TW (1) | TWI486461B (ja) |
WO (1) | WO2010137690A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016159316A1 (ja) * | 2015-03-31 | 2016-10-06 | 日本発條株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101251926B1 (ko) * | 2011-10-14 | 2013-04-08 | 황귀순 | 프로브 유닛 |
CN110809805B (zh) * | 2017-07-10 | 2021-10-26 | 株式会社协成 | 使用铜银合金的导电性部件、触头引脚以及装置 |
KR102259743B1 (ko) | 2017-12-01 | 2021-06-02 | 주식회사 엘지화학 | 열가소성 수지 조성물 및 이를 이용한 열가소성 수지 성형품 |
RU2724301C2 (ru) * | 2018-12-17 | 2020-06-22 | Акционерное общество "НПО "Орион" | Способ увеличения прочности зондов многозондовых головок |
CN111411253A (zh) * | 2020-04-14 | 2020-07-14 | 紫金矿业集团黄金冶炼有限公司 | 一种高纯银铜合金异型丝材的制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6216896A (ja) * | 1985-07-17 | 1987-01-26 | Tanaka Kikinzoku Kogyo Kk | セラミツクス用ろう材 |
JP2002071714A (ja) * | 2000-08-31 | 2002-03-12 | Kanai Hiroaki | プローブカード用プローブピン |
JP2002311055A (ja) * | 2001-04-18 | 2002-10-23 | Tokyo Cathode Laboratory Co Ltd | プローブカード |
JP2004076055A (ja) * | 2002-08-13 | 2004-03-11 | Hitachi Metals Ltd | 導電性スペーサ用金属球 |
JP2005066686A (ja) * | 2003-08-27 | 2005-03-17 | Toshiba Corp | 接合材、接合材の製造方法、およびこれを用いた真空バルブ |
WO2008149886A1 (ja) * | 2007-06-06 | 2008-12-11 | Tanaka Kikinzoku Kogyo K.K. | プローブピン用材料 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2196303A (en) * | 1939-02-21 | 1940-04-09 | Mallory & Co Inc P R | Silver copper alloy |
US2303272A (en) * | 1941-09-18 | 1942-11-24 | Fansteel Metallurgical Corp | Metal alloy |
US2970248A (en) * | 1957-11-12 | 1961-01-31 | Pacific Semiconductors Inc | Pin material for glass seal semiconductor rectifier |
US3401024A (en) * | 1965-10-04 | 1968-09-10 | Mallory & Co Inc P R | Electrical contact material |
JPH05154719A (ja) | 1991-11-29 | 1993-06-22 | Tanaka Kikinzoku Kogyo Kk | プローブピンの製造装置 |
JPH1038922A (ja) | 1996-07-26 | 1998-02-13 | Iwaki Electron Corp Ltd | プローブピン装置 |
US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
JP2004093355A (ja) | 2002-08-30 | 2004-03-25 | Toshiba Corp | Pd合金系プローブピンおよびそれを用いたプローブピン装置 |
EP1737075B1 (de) * | 2005-06-23 | 2017-03-08 | Feinmetall GmbH | Kontaktiervorrichtung |
JP2008305630A (ja) * | 2007-06-06 | 2008-12-18 | Ushio Inc | 光源装置 |
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2009
- 2009-05-29 JP JP2009129992A patent/JP4801757B2/ja active Active
-
2010
- 2010-05-27 TW TW099116958A patent/TWI486461B/zh active
- 2010-05-28 WO PCT/JP2010/059087 patent/WO2010137690A1/ja active Application Filing
- 2010-05-28 EP EP10780644.0A patent/EP2436790B1/en active Active
- 2010-05-28 US US13/057,370 patent/US8591805B2/en active Active
- 2010-05-28 CN CN201510672606.4A patent/CN105369049B/zh active Active
- 2010-05-28 CN CN2010800025225A patent/CN102137945A/zh active Pending
- 2010-05-28 KR KR1020117003906A patent/KR101260135B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6216896A (ja) * | 1985-07-17 | 1987-01-26 | Tanaka Kikinzoku Kogyo Kk | セラミツクス用ろう材 |
JP2002071714A (ja) * | 2000-08-31 | 2002-03-12 | Kanai Hiroaki | プローブカード用プローブピン |
JP2002311055A (ja) * | 2001-04-18 | 2002-10-23 | Tokyo Cathode Laboratory Co Ltd | プローブカード |
JP2004076055A (ja) * | 2002-08-13 | 2004-03-11 | Hitachi Metals Ltd | 導電性スペーサ用金属球 |
JP2005066686A (ja) * | 2003-08-27 | 2005-03-17 | Toshiba Corp | 接合材、接合材の製造方法、およびこれを用いた真空バルブ |
WO2008149886A1 (ja) * | 2007-06-06 | 2008-12-11 | Tanaka Kikinzoku Kogyo K.K. | プローブピン用材料 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016159316A1 (ja) * | 2015-03-31 | 2016-10-06 | 日本発條株式会社 | 合金材料、コンタクトプローブおよび接続端子 |
Also Published As
Publication number | Publication date |
---|---|
EP2436790B1 (en) | 2013-12-18 |
KR101260135B1 (ko) | 2013-05-02 |
CN102137945A (zh) | 2011-07-27 |
KR20110036625A (ko) | 2011-04-07 |
EP2436790A4 (en) | 2012-11-21 |
TWI486461B (zh) | 2015-06-01 |
WO2010137690A1 (ja) | 2010-12-02 |
CN105369049A (zh) | 2016-03-02 |
JP4801757B2 (ja) | 2011-10-26 |
US8591805B2 (en) | 2013-11-26 |
CN105369049B (zh) | 2018-04-10 |
EP2436790A1 (en) | 2012-04-04 |
TW201100563A (en) | 2011-01-01 |
US20110133767A1 (en) | 2011-06-09 |
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