US2196303A - Silver copper alloy - Google Patents
Silver copper alloy Download PDFInfo
- Publication number
- US2196303A US2196303A US312513A US31251340A US2196303A US 2196303 A US2196303 A US 2196303A US 312513 A US312513 A US 312513A US 31251340 A US31251340 A US 31251340A US 2196303 A US2196303 A US 2196303A
- Authority
- US
- United States
- Prior art keywords
- silver
- lithium
- alloys
- alloy
- copper alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 title description 3
- 229910000881 Cu alloy Inorganic materials 0.000 title description 2
- 229910045601 alloy Inorganic materials 0.000 description 18
- 239000000956 alloy Substances 0.000 description 18
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 13
- 229910052744 lithium Inorganic materials 0.000 description 13
- 239000000463 material Substances 0.000 description 10
- 229910052709 silver Inorganic materials 0.000 description 10
- 239000004332 silver Substances 0.000 description 10
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 229910001316 Ag alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- OPHUWKNKFYBPDR-UHFFFAOYSA-N copper lithium Chemical compound [Li].[Cu] OPHUWKNKFYBPDR-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- -1 for instance Chemical compound 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WUALQPNAHOKFBR-UHFFFAOYSA-N lithium silver Chemical class [Li].[Ag] WUALQPNAHOKFBR-UHFFFAOYSA-N 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/06—Alloys based on silver
Definitions
- This invention relates to a new silver-copper alloy for use as replacement of pure silver and for all uses to which previously known silver alloys have been employed, of which may be mentioned particularly, uses of the alloys of the present invention in connection with silver solders, electrical contacts, silverware, jewelry and dental applications.
- a still further object is to produce a new alloy which has superior electrical characteristics when used as an electrical make-and-break contact such as low material transfer, low contact resistance and freedom from welding or sticking.
- the present invention comprises the combination of elements, methods of manufacture and the product thereof brought out and exemplified in the disclosure hereinafter set forth, the scope of the invention being indicated in the appended claim.
- the present invention contemplates the addition of lithium and copper to silver base alloys.
- the alloy it is preferable to provide a composition of the materials specified in the following proportions by weight:
- the alloys of the present invention may be prepared by melting the ingredients together in the correct proportions.
- the lithium is preferably added in the form of a silver-lithium master alloy, containing approximately of lithium.
- This master alloy has a very low melting point which is in the neighborhood of 410 to 450 C. and therefore will go readily into solution when added to the silver-copper melt.
- the effect of lithium is to completely 'deoxidize the silver melt and to free it from other impurities which are harmful. Part of the lithium will be eliminated together with these impurities and the remaining melt will be free from inclusions and oxides.
- the presence of lithium also prevents the further oxidation of the melt during the heating periods to which the melt may be subjected and the material retains a very high fluidity during pouring, resulting in extremely clean castings.
- alloys of the coin silver type will show greatly improved electrical characteristics.
- Contact alloys of this type have very improved characteristics as far as material transfer and contact resistance are concerned. It was also of great interest to find that the material transfer for this composition was from the cathode to the anode. In most silver base alloys the material transfer is in the opposite direction, therefore it seems desirable to use the material of the present invention in combination with another silver alloy having opposite transfer characteristics.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Adornments (AREA)
Description
Patented Apr. 9, 1940 UNITED STATES PATENT OFFICE W. Wiggs, P. R. Mallory &
Indianapolis, Ind.,
00., Inc., Indianapolis,
assignors to Ind.,
a corporation of Delaware No Drawing. Original 1939, Serial No.
1 Claim.
This invention relates to a new silver-copper alloy for use as replacement of pure silver and for all uses to which previously known silver alloys have been employed, of which may be mentioned particularly, uses of the alloys of the present invention in connection with silver solders, electrical contacts, silverware, jewelry and dental applications.
This application is a division of prior filed copending application Serial No. 257,667, filed February 21, 1939.
It is one object of the present invention to provide an alloy which has improved electrical properties such as electrical conductivity.
It is a further object of the present invention to provide an alloy which shows great fluidity in the molten state and lends itself to casting of very intricate shapes.
It is a further object of the present invention to produce an alloy which has improved wetting characteristics when used as a silver solder.
A still further object is to produce a new alloy which has superior electrical characteristics when used as an electrical make-and-break contact such as low material transfer, low contact resistance and freedom from welding or sticking. Other objects of the invention will be apparent from the following description taken in connection with the appended claim.
The present invention comprises the combination of elements, methods of manufacture and the product thereof brought out and exemplified in the disclosure hereinafter set forth, the scope of the invention being indicated in the appended claim.
While a preferred embodiment of the invention is described herein, it is contemplated that considerable variation may be made in themethod of procedure and the combination of elements without departing from the spirit of the invention.
The present invention contemplates the addition of lithium and copper to silver base alloys. In the formation of the alloy it is preferable to provide a composition of the materials specified in the following proportions by weight:
Percent .002 to 3 35 to 50 Lithium Copper in excess of 5 Balance substantially all silver. a
257,667. Divided application January 5, 1940, Serial No.
application February 21, and this 312513 We have also found may also be added to of the new alloys of that the following elements improve the characteristics the present invention:
Percent 5 Cadmium Up to 25 Zinc Up to 28 Tin Up to 11 Manganese Up to 20 Nickel Up to 1o Phosphorus Up to 8 Silicon Up to 2 Magnesium Up to 8 Beryllium Up to 3 Calcium Up to 2 In addition to these baser elements, materials from the palladium, platinum or gold group may also be present up to 10% each.
The alloys of the present invention may be prepared by melting the ingredients together in the correct proportions. The lithium is preferably added in the form of a silver-lithium master alloy, containing approximately of lithium. This master alloy has a very low melting point which is in the neighborhood of 410 to 450 C. and therefore will go readily into solution when added to the silver-copper melt.
The effect of lithium is to completely 'deoxidize the silver melt and to free it from other impurities which are harmful. Part of the lithium will be eliminated together with these impurities and the remaining melt will be free from inclusions and oxides. The presence of lithium also prevents the further oxidation of the melt during the heating periods to which the melt may be subjected and the material retains a very high fluidity during pouring, resulting in extremely clean castings.
We have found that coin silver containing a small percentage of lithium such as, for instance, .01% or less will lend itself much more readily to rolling and wire drawing operations, resulting in a material which is entirely free from surface blemishes and oxide stringers. Furthermore if such silver wire is being spun or if silver wire produced in that manner is being headed a suriace'finish can be obtained with alloys of the new invention that excels anything obtainable so far with alloys of the prior art. Very often in heading of coin silver wire the formation ofv edge cracks or splits is encountered, causing a great number of rejects. By using the addition of lithium in these alloys in the proportions specified these dimculties can be eliminated or at least materially reduced.
If lithium is used in higher proportions such as .05 to 1% we have found that alloys of the coin silver type will show greatly improved electrical characteristics. Contact alloys of this type have very improved characteristics as far as material transfer and contact resistance are concerned. It was also of great interest to find that the material transfer for this composition was from the cathode to the anode. In most silver base alloys the material transfer is in the opposite direction, therefore it seems desirable to use the material of the present invention in combination with another silver alloy having opposite transfer characteristics.
Since lithium decreases the melting point of silver very materially and since an eutectic is formed at 2.7% lithium, having a melting point of 610 C. care must be exercised if these materials are being processed at elevated temperatures and if they contain higher percentages of lithium. By proportioning the ingredients correctly the and advantages, has been described herein as carried out in specific embodiments thereof, it is not desired to be limited thereby but it is intended to cover the invention broadly within the spirit and scope of the appended claim.
What is claimed is:
An alloy containing .002 to 3% lithium, from greater than to copper and the balance substantially all silver.
FRANZ R. HENSEL. KENNETH L. EMIVIERT. JAIUES W. WIGGS.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US312513A US2196303A (en) | 1939-02-21 | 1940-01-05 | Silver copper alloy |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US257667A US2196302A (en) | 1939-02-21 | 1939-02-21 | Silver copper alloy |
| US312513A US2196303A (en) | 1939-02-21 | 1940-01-05 | Silver copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| US2196303A true US2196303A (en) | 1940-04-09 |
Family
ID=26946118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| US312513A Expired - Lifetime US2196303A (en) | 1939-02-21 | 1940-01-05 | Silver copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| US (1) | US2196303A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2534643A (en) * | 1948-12-11 | 1950-12-19 | Machlett Lab Inc | Method for brazing beryllium |
| US2729558A (en) * | 1952-05-03 | 1956-01-03 | American Platinum Works | Silver brazing alloys |
| US2970248A (en) * | 1957-11-12 | 1961-01-31 | Pacific Semiconductors Inc | Pin material for glass seal semiconductor rectifier |
| US3124453A (en) * | 1964-03-10 | Brazing alloy | ||
| US4411864A (en) * | 1980-12-08 | 1983-10-25 | Mitsubishi Kinzoku Kabushiki Kaisha | Cu-Ag-Si Base alloy brazing filler material |
| US4869757A (en) * | 1987-04-13 | 1989-09-26 | Leach & Garner Company | Silver alloys of exceptional and reversible hardness |
| US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
| US20050247757A1 (en) * | 2000-12-29 | 2005-11-10 | United Technologies Corporation | Silver braze alloy |
| US20110123827A1 (en) * | 2008-08-08 | 2011-05-26 | Nhk Spring Co., Ltd. | Lathe machining member |
| EP2436790A1 (en) * | 2009-05-29 | 2012-04-04 | Tanaka Kikinzoku Kogyo K.K. | Silver alloy that is appropriately usable in probe pins having excellent contact resistance and excellent anti-stain properties |
-
1940
- 1940-01-05 US US312513A patent/US2196303A/en not_active Expired - Lifetime
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3124453A (en) * | 1964-03-10 | Brazing alloy | ||
| US2534643A (en) * | 1948-12-11 | 1950-12-19 | Machlett Lab Inc | Method for brazing beryllium |
| US2729558A (en) * | 1952-05-03 | 1956-01-03 | American Platinum Works | Silver brazing alloys |
| US2970248A (en) * | 1957-11-12 | 1961-01-31 | Pacific Semiconductors Inc | Pin material for glass seal semiconductor rectifier |
| US4411864A (en) * | 1980-12-08 | 1983-10-25 | Mitsubishi Kinzoku Kabushiki Kaisha | Cu-Ag-Si Base alloy brazing filler material |
| US4869757A (en) * | 1987-04-13 | 1989-09-26 | Leach & Garner Company | Silver alloys of exceptional and reversible hardness |
| US6596229B2 (en) * | 2000-12-29 | 2003-07-22 | United Technologies Corporation | Silver braze alloy |
| US20030180176A1 (en) * | 2000-12-29 | 2003-09-25 | Wangen Lin | Silver braze alloy |
| US6936218B2 (en) * | 2000-12-29 | 2005-08-30 | United Technologies Corporation | Silver braze alloy |
| US20050247757A1 (en) * | 2000-12-29 | 2005-11-10 | United Technologies Corporation | Silver braze alloy |
| US20110123827A1 (en) * | 2008-08-08 | 2011-05-26 | Nhk Spring Co., Ltd. | Lathe machining member |
| US9056355B2 (en) * | 2008-08-08 | 2015-06-16 | Nhk Spring Co., Ltd. | Lathe machining member |
| EP2436790A1 (en) * | 2009-05-29 | 2012-04-04 | Tanaka Kikinzoku Kogyo K.K. | Silver alloy that is appropriately usable in probe pins having excellent contact resistance and excellent anti-stain properties |
| EP2436790A4 (en) * | 2009-05-29 | 2012-11-21 | Tanaka Precious Metal Ind | Silver alloy that is appropriately usable in probe pins having excellent contact resistance and excellent anti-stain properties |
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