JP2010254789A5 - - Google Patents
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- Publication number
- JP2010254789A5 JP2010254789A5 JP2009105762A JP2009105762A JP2010254789A5 JP 2010254789 A5 JP2010254789 A5 JP 2010254789A5 JP 2009105762 A JP2009105762 A JP 2009105762A JP 2009105762 A JP2009105762 A JP 2009105762A JP 2010254789 A5 JP2010254789 A5 JP 2010254789A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- film
- toyobo
- adhesive layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920006257 Heat-shrinkable film Polymers 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000009472 formulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009105762A JP5599157B2 (ja) | 2009-04-24 | 2009-04-24 | 粘着シート |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009105762A JP5599157B2 (ja) | 2009-04-24 | 2009-04-24 | 粘着シート |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010254789A JP2010254789A (ja) | 2010-11-11 |
| JP2010254789A5 true JP2010254789A5 (enExample) | 2012-05-31 |
| JP5599157B2 JP5599157B2 (ja) | 2014-10-01 |
Family
ID=43316083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009105762A Expired - Fee Related JP5599157B2 (ja) | 2009-04-24 | 2009-04-24 | 粘着シート |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5599157B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012161221A1 (ja) * | 2011-05-24 | 2012-11-29 | 電気化学工業株式会社 | 仮固定用接着剤組成物 |
| KR20140047619A (ko) * | 2011-06-02 | 2014-04-22 | 키모토 컴파니 리미티드 | 박리 용이성 점착 필름 |
| JP2013047321A (ja) | 2011-07-28 | 2013-03-07 | Nitto Denko Corp | 粘着シート |
| JP5117629B1 (ja) * | 2012-06-28 | 2013-01-16 | 古河電気工業株式会社 | ウェハ加工用粘着テープ |
| EP2877883B1 (en) | 2012-07-26 | 2017-08-23 | 3M Innovative Properties Company | Heat de-bondable optical articles |
| KR102576310B1 (ko) * | 2018-03-30 | 2023-09-07 | 린텍 가부시키가이샤 | 경화 봉지체의 휨 방지용 적층체, 및 경화 봉지체의 제조 방법 |
| CN109449080B (zh) * | 2018-11-12 | 2021-01-26 | 京东方科技集团股份有限公司 | 胶膜及其制备方法、显示装置及胶膜的去除方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4005218B2 (ja) * | 1998-06-02 | 2007-11-07 | 三井化学株式会社 | 半導体ウエハ表面保護用粘着テープの使用方法 |
| JP2000129227A (ja) * | 1998-10-29 | 2000-05-09 | Lintec Corp | 半導体ウエハ保護用粘着シートおよびその使用方法 |
| JP4849993B2 (ja) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | 粘着シート、その製造方法および積層セラミックシートの切断方法 |
| JP2008297412A (ja) * | 2007-05-30 | 2008-12-11 | Nitto Denko Corp | 熱剥離型粘着シート |
| JP5047724B2 (ja) * | 2007-07-31 | 2012-10-10 | 日東電工株式会社 | 熱剥離型粘着シートを使用する被着体の加工方法。 |
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2009
- 2009-04-24 JP JP2009105762A patent/JP5599157B2/ja not_active Expired - Fee Related