JP2010254789A5 - - Google Patents
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- JP2010254789A5 JP2010254789A5 JP2009105762A JP2009105762A JP2010254789A5 JP 2010254789 A5 JP2010254789 A5 JP 2010254789A5 JP 2009105762 A JP2009105762 A JP 2009105762A JP 2009105762 A JP2009105762 A JP 2009105762A JP 2010254789 A5 JP2010254789 A5 JP 2010254789A5
- Authority
- JP
- Japan
- Prior art keywords
- thickness
- film
- toyobo
- adhesive layer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
［実施例１］
非熱収縮性フィルム（１２０℃における熱収縮率１０％未満、厚み５０μｍ、ポリエチレンテレフタレートフィルム、コスモシャインA4300：東洋紡績社）の一方の面に、下記処方の接着層塗布液をバーコーター法により塗布、乾燥させて、厚み５μｍの接着層を形成し、熱収縮性フィルム（１２０℃における熱収縮率７０％以上、厚み３０μｍ、ポリエチレンテレフタレートフィルム、スペースクリーンS7053：東洋紡績社）と貼り合せて実施例１の基材フィルムを作製した。
[Example 1]
Non-heat-shrinkable film (120 thermal shrinkage less than 10% at ° C., thickness 50 [mu] m, a polyethylene terephthalate film, Cosmoshine A 4300: Toyobo Co., Ltd.) on one side of the bar coater method an adhesive layer coating solution having the following formulation coating and dried, to form an adhesive layer having a thickness of 5 [mu] m, the heat-shrinkable film (120 ° C. thermal shrinkage rate of 70% or more in a thickness 30 [mu] m, a polyethylene terephthalate film, SPACECLEAN S7053: Toyobo Co., Ltd.) and bonded together The base film of Example 1 was produced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009105762A JP5599157B2 (en) | 2009-04-24 | 2009-04-24 | Adhesive sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009105762A JP5599157B2 (en) | 2009-04-24 | 2009-04-24 | Adhesive sheet |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010254789A JP2010254789A (en) | 2010-11-11 |
| JP2010254789A5 true JP2010254789A5 (en) | 2012-05-31 |
| JP5599157B2 JP5599157B2 (en) | 2014-10-01 |
Family
ID=43316083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009105762A Expired - Fee Related JP5599157B2 (en) | 2009-04-24 | 2009-04-24 | Adhesive sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5599157B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI547534B (en) * | 2011-05-24 | 2016-09-01 | Denka Company Ltd | Two-dose temporary fixation agent composition |
| WO2012165201A1 (en) * | 2011-06-02 | 2012-12-06 | 株式会社きもと | Easily releasable adhesive film |
| JP2013047321A (en) | 2011-07-28 | 2013-03-07 | Nitto Denko Corp | Pressure-sensitive adhesive sheet |
| JP5117629B1 (en) * | 2012-06-28 | 2013-01-16 | 古河電気工業株式会社 | Adhesive tape for wafer processing |
| WO2014018231A1 (en) | 2012-07-26 | 2014-01-30 | 3M Innovative Properties Company | Heat de-bondable optical articles |
| CN111886309B (en) * | 2018-03-30 | 2022-06-10 | 琳得科株式会社 | Laminate for preventing warpage of cured sealing body, and method for producing cured sealing body |
| CN109449080B (en) * | 2018-11-12 | 2021-01-26 | 京东方科技集团股份有限公司 | Adhesive film, preparation method thereof, display device and removing method of adhesive film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4005218B2 (en) * | 1998-06-02 | 2007-11-07 | 三井化学株式会社 | How to use adhesive tape for semiconductor wafer surface protection |
| JP2000129227A (en) * | 1998-10-29 | 2000-05-09 | Lintec Corp | Semiconductor wafer protective pressure-sensitive adhesive sheet and use thereof |
| JP4849993B2 (en) * | 2006-08-14 | 2012-01-11 | 日東電工株式会社 | Adhesive sheet, method for producing the same, and method for cutting laminated ceramic sheet |
| JP2008297412A (en) * | 2007-05-30 | 2008-12-11 | Nitto Denko Corp | Heat-peelable adhesive sheet |
| JP5047724B2 (en) * | 2007-07-31 | 2012-10-10 | 日東電工株式会社 | A method for processing an adherend using a heat-peelable pressure-sensitive adhesive sheet. |
-
2009
- 2009-04-24 JP JP2009105762A patent/JP5599157B2/en not_active Expired - Fee Related
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