JP2010251641A5 - - Google Patents

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Publication number
JP2010251641A5
JP2010251641A5 JP2009101860A JP2009101860A JP2010251641A5 JP 2010251641 A5 JP2010251641 A5 JP 2010251641A5 JP 2009101860 A JP2009101860 A JP 2009101860A JP 2009101860 A JP2009101860 A JP 2009101860A JP 2010251641 A5 JP2010251641 A5 JP 2010251641A5
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JP
Japan
Prior art keywords
connection terminal
region
bonding wire
semiconductor device
inductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009101860A
Other languages
English (en)
Japanese (ja)
Other versions
JP5390246B2 (ja
JP2010251641A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009101860A priority Critical patent/JP5390246B2/ja
Priority claimed from JP2009101860A external-priority patent/JP5390246B2/ja
Priority to US12/662,441 priority patent/US8350357B2/en
Publication of JP2010251641A publication Critical patent/JP2010251641A/ja
Publication of JP2010251641A5 publication Critical patent/JP2010251641A5/ja
Application granted granted Critical
Publication of JP5390246B2 publication Critical patent/JP5390246B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009101860A 2009-04-20 2009-04-20 半導体装置 Expired - Fee Related JP5390246B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009101860A JP5390246B2 (ja) 2009-04-20 2009-04-20 半導体装置
US12/662,441 US8350357B2 (en) 2009-04-20 2010-04-16 Semiconductor device including an inductor that is inductively coupled to another inductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009101860A JP5390246B2 (ja) 2009-04-20 2009-04-20 半導体装置

Publications (3)

Publication Number Publication Date
JP2010251641A JP2010251641A (ja) 2010-11-04
JP2010251641A5 true JP2010251641A5 (enExample) 2012-06-07
JP5390246B2 JP5390246B2 (ja) 2014-01-15

Family

ID=42991367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009101860A Expired - Fee Related JP5390246B2 (ja) 2009-04-20 2009-04-20 半導体装置

Country Status (2)

Country Link
US (1) US8350357B2 (enExample)
JP (1) JP5390246B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5578797B2 (ja) * 2009-03-13 2014-08-27 ルネサスエレクトロニクス株式会社 半導体装置
JP6129659B2 (ja) * 2013-06-25 2017-05-17 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
US8981842B1 (en) * 2013-10-25 2015-03-17 Taiwan Semiconductor Manufacturing Company Limited Integrated circuit comprising buffer chain

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3997851A (en) * 1976-01-28 1976-12-14 The United States Of America As Represented By The Secretary Of The Army RF-drive equalizer for multicell microwave transistor
JPH05167427A (ja) * 1991-12-13 1993-07-02 Toshiba Corp レベルシフト回路
JPH09106915A (ja) * 1995-10-13 1997-04-22 Matsushita Electric Ind Co Ltd 高周波用インダクタ
JPH1074625A (ja) 1996-08-30 1998-03-17 Ikeda Takeshi インダクタ素子
JP2002164214A (ja) * 2000-10-27 2002-06-07 Xerox Corp ボンディングワイヤを使用する非同一面マイクロコイル及びその製造方法
US6545227B2 (en) * 2001-07-11 2003-04-08 Mce/Kdi Corporation Pocket mounted chip having microstrip line
JP2005039023A (ja) 2003-07-14 2005-02-10 Yokogawa Electric Corp インダクタンス素子及びその製造方法
JP2010041499A (ja) * 2008-08-06 2010-02-18 Toshiba Corp 信号カプラ
US7902665B2 (en) * 2008-09-02 2011-03-08 Linear Technology Corporation Semiconductor device having a suspended isolating interconnect

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