JP2010199265A - 液体噴射ヘッドの製造方法及びアクチュエーター装置の製造方法 - Google Patents
液体噴射ヘッドの製造方法及びアクチュエーター装置の製造方法 Download PDFInfo
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Abstract
【解決手段】第1電極を形成する工程と、第1電極の上方に圧電体前駆体膜を形成する工程と、圧電体前駆体膜を熱処理により結晶化させ、圧電体膜を形成する第1の加熱工程と、第2電極を形成する工程と、第1電極と第2電極間との間に電圧を印加しながら150℃以上の温度で、圧電体膜で構成される圧電体層を加熱処理する第2の加熱工程と、を具備する。
【選択図】なし
Description
かかる態様では、圧電体層を構成する結晶に複合欠陥が生じても、第2の加熱工程において、複合欠陥を除去することができる。また、第2の加熱工程後の複合欠陥の再発生が抑制される。これにより、圧電体層の複合欠陥を低減し、良好な変位特性を有する圧電素子とすることができる。この結果、良好な液体吐出特性を有する液体噴射ヘッドを製造することができる。
かかる態様では、圧電体層を構成する結晶に複合欠陥が生じても、第2の加熱工程において、複合欠陥を除去することができる。また、第2の加熱工程後の複合欠陥の再発生が抑制される。これにより、圧電体層の複合欠陥を低減し、良好な変位特性を有するアクチュエーター装置を製造することができる。
(実施形態1)
図1は、本発明の実施形態1に係る液体噴射ヘッドの一例であるインクジェット式記録ヘッドの概略構成を示す分解斜視図であり、図2は、流路形成基板の平面図及びそのA−A′断面図である。
2e−+PtTi 0+V0 2+ → PtTi −2+V0 2+
→ V0PtTi
2h++V0PtTi → [V0PtTi]2+
→ PtTi 0+V0 2+
実施形態2に係るインクジェット式記録ヘッドの製造方法について、図11を用いて説明する。なお、実施形態2のインクジェット式記録ヘッドは、実施形態1と同様の構成からなる。
以上、本発明の実施形態について説明したが、本発明は、上述の実施形態に限定されるものではない。例えば、実施形態1では、第2の加熱工程を、圧電体層70及び第2電極をパターニングした後に行ったが、流路形成基板用ウェハー110の圧電素子300側に保護基板用ウェハー130を接合した後や、圧力発生室12、連通部13、インク供給路14及び連通路15等を形成した後に行ってもよい。この場合は、接合時や、圧力発生室12等の形成時に圧電体層70に発生する複合欠陥も除去することができる。保護基板用ウェハー130の接合以降に第2の加熱工程を行う場合は、第2の加熱工程における加熱温度は、他の特性を劣化させないように、比較的低い温度、例えば、150〜400℃程度に設定するのが好ましい。
Claims (9)
- 第1電極と、前記第1電極上に形成された圧電体層と、前記圧電体層の前記第1電極とは反対側に形成された第2電極と、を備える圧電素子を具備し、前記圧電素子により圧力発生室に圧力を発生させてノズル開口から液滴を吐出する液体噴射ヘッドの製造方法であって、
前記第1電極を形成する工程と、
前記第1電極の上に圧電体前駆体膜を形成する工程と、
前記圧電体前駆体膜を熱処理により結晶化させ、圧電体膜を形成する第1の加熱工程と、
前記第2電極を形成する工程と、
前記第1電極と前記第2電極間との間に電圧を印加しながら150℃以上の温度で、前記圧電体膜で構成される前記圧電体層を加熱処理する第2の加熱工程と、を具備することを特徴とする液体噴射ヘッドの製造方法。 - 前記第2の加熱工程は、前記第2電極を成膜し、前記圧電体層及び前記第2電極をパターニングした後に行うことを特徴とする請求項1に記載の液体噴射ヘッドの製造方法。
- 前記第2の加熱工程は、酸素雰囲気下で行うことを特徴とする請求項1又は2に記載の液体噴射ヘッドの製造方法。
- 前記第2の加熱工程では、前記第1電極と前記第2電極との間に1〜30Vの電圧を印加することを特徴とする請求項1〜3のいずれか一項に記載の液体噴射ヘッドの製造方法。
- 前記圧電体層は厚さが5μm以下であることを特徴とする請求項1〜4のいずれか一項に記載の液体噴射ヘッドの製造方法。
- 前記第1電極及び前記第2電極の少なくともいずれか一方が、ニッケル、銅、ニオブ、ルテニウム、ロジウム、パラジウム、銀、錫、オスミウム、イリジウム、白金、金及びビスマスからなる群から選択される少なくとも1つを含むものであることを特徴とする請求項1〜5のいずれか一項に記載の液体噴射ヘッドの製造方法。
- 前記圧電体前駆体膜上に前記第2電極を形成した後に、前記第1の加熱工程と、前記第2の加熱工程と、を同時に行うことを特徴とする請求項1〜6のいずれか一項に記載の液体噴射ヘッドの製造方法。
- 前記圧電体前駆体膜を形成する工程及び前記第1の加熱工程を繰返し行って複数の圧電体膜を形成した後、当該圧電体膜上に最上層の圧電体前駆体膜を形成し、当該圧電体前駆体膜上に前記第2電極を成膜した後、
前記第1電極と前記第2電極との間に電圧を印加しながら150℃以上の温度で加熱処理することにより、最上層の圧電体前駆体膜を熱処理して結晶化させ、最上層の圧電体膜を形成する第1の加熱工程と、前記第2の加熱工程とを同時に行うことを特徴とする請求項1〜7の何れか一項に記載の液体噴射ヘッドの製造方法。 - 第1電極と、前記第1電極上に形成された圧電体層と、前記圧電体層上に形成された第2電極と、を備えた圧電素子を具備するアクチュエーター装置の製造方法であって、
前記第1電極を形成する工程と、
前記第1電極の上方に圧電体前駆体膜を形成する工程と、
前記圧電体前駆体膜を熱処理により結晶化させ、圧電体膜を形成する第1の加熱工程と、
前記第2電極を形成する工程と、
前記第1電極と前記第2電極間との間に電圧を印加しながら150℃以上の温度で、前記圧電体膜で構成される前記圧電体層を加熱処理する第2の加熱工程と、を具備することを特徴とするアクチュエーター装置の製造方法。
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JP2017195346A (ja) * | 2016-04-22 | 2017-10-26 | 株式会社リコー | 電気機械変換装置、センサ、アクチュエータ、及びそれらの製造方法、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置 |
JP2017196787A (ja) * | 2016-04-27 | 2017-11-02 | セイコーエプソン株式会社 | 液体噴射ヘッドの製造方法及びmemsデバイスの製造方法 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0585706A (ja) * | 1991-03-07 | 1993-04-06 | Olympus Optical Co Ltd | 強誘電体薄膜の製造方法 |
JPH05218526A (ja) * | 1992-02-06 | 1993-08-27 | Nippon Seiko Kk | 圧電セラミックの熱処理方法 |
JPH05226322A (ja) * | 1992-02-12 | 1993-09-03 | Sharp Corp | 配向性強誘電体薄膜の製造方法 |
JP2006019592A (ja) * | 2004-07-02 | 2006-01-19 | Seiko Epson Corp | 誘電体膜の製造方法及び圧電素子の製造方法並びに液体噴射ヘッドの製造方法 |
JP2007059525A (ja) * | 2005-08-23 | 2007-03-08 | Fujifilm Corp | 積層型圧電素子及びそれを用いる装置、並びに、積層型圧電素子の製造方法 |
JP2008187303A (ja) * | 2007-01-26 | 2008-08-14 | Matsushita Electric Works Ltd | 共振装置の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4147954B2 (ja) * | 2002-03-25 | 2008-09-10 | 株式会社村田製作所 | 圧電素子の製造方法 |
JP2003289230A (ja) * | 2002-03-27 | 2003-10-10 | Seiko Epson Corp | ニオブ酸カリウム薄膜の製造方法、並びに表面弾性波素子、周波数フィルタ、周波数発振器、電子回路、及び電子機器 |
JP4058691B2 (ja) * | 2002-09-17 | 2008-03-12 | セイコーエプソン株式会社 | 液体吐出ヘッド及び液体吐出装置 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0585706A (ja) * | 1991-03-07 | 1993-04-06 | Olympus Optical Co Ltd | 強誘電体薄膜の製造方法 |
JPH05218526A (ja) * | 1992-02-06 | 1993-08-27 | Nippon Seiko Kk | 圧電セラミックの熱処理方法 |
JPH05226322A (ja) * | 1992-02-12 | 1993-09-03 | Sharp Corp | 配向性強誘電体薄膜の製造方法 |
JP2006019592A (ja) * | 2004-07-02 | 2006-01-19 | Seiko Epson Corp | 誘電体膜の製造方法及び圧電素子の製造方法並びに液体噴射ヘッドの製造方法 |
JP2007059525A (ja) * | 2005-08-23 | 2007-03-08 | Fujifilm Corp | 積層型圧電素子及びそれを用いる装置、並びに、積層型圧電素子の製造方法 |
JP2008187303A (ja) * | 2007-01-26 | 2008-08-14 | Matsushita Electric Works Ltd | 共振装置の製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017195346A (ja) * | 2016-04-22 | 2017-10-26 | 株式会社リコー | 電気機械変換装置、センサ、アクチュエータ、及びそれらの製造方法、液体吐出ヘッド、液体吐出ユニット、液体を吐出する装置 |
JP2017196787A (ja) * | 2016-04-27 | 2017-11-02 | セイコーエプソン株式会社 | 液体噴射ヘッドの製造方法及びmemsデバイスの製造方法 |
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