JP2010192737A - 光モジュール及び光モジュールの接続方法 - Google Patents
光モジュール及び光モジュールの接続方法 Download PDFInfo
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- JP2010192737A JP2010192737A JP2009036328A JP2009036328A JP2010192737A JP 2010192737 A JP2010192737 A JP 2010192737A JP 2009036328 A JP2009036328 A JP 2009036328A JP 2009036328 A JP2009036328 A JP 2009036328A JP 2010192737 A JP2010192737 A JP 2010192737A
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- Japan
- Prior art keywords
- lead frame
- optical module
- mold resin
- solder connection
- resin
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Led Device Packages (AREA)
- Semiconductor Lasers (AREA)
Abstract
【解決手段】光モジュールは、LD21を実装したリードフレーム1がモールド樹脂2により一体成型されている。リードフレーム1は、外部回路基板と半田接続するための半田接続部15と、モールド樹脂2に内蔵される回路実装部16とを備え、半田接続部15と回路実装部16との間に、半田接続部15からの熱流入を抑制するための熱流入抑制部14が形成されている。
【選択図】図2
Description
また、図5は、図2〜図4に示す光モジュールを構成するリードフレーム1を上から見た図を示す。
Claims (4)
- 光学素子を実装したリードフレームがモールド樹脂により一体成型された光モジュールであって、
前記リードフレームは、外部回路基板と半田接続するための半田接続部と、前記モールド樹脂に内蔵される回路実装部とを備え、前記半田接続部と前記回路実装部との間に、該半田接続部からの熱流入を抑制するための熱流入抑制部が形成されていることを特徴とする光モジュール。 - 前記熱流入抑制部は、前記リードフレームに、前記半田接続部からの熱流入の方向と交わる断面の面積を部分的に小さくして形成されていることを特徴とする請求項1に記載の光モジュール。
- 前記熱流入抑制部は、前記リードフレームの一部を前記モールド樹脂から露出させて形成されていることを特徴とする請求項1又は2に記載の光モジュール。
- リードフレームの一部を露出させる露出部がモールド樹脂に形成された光モジュールを、外部回路基板に半田接続するための光モジュールの接続方法であって、
前記露出部に放熱部材を接触させ、前記リードフレームと前記外部回路基板とを半田接続した後に、前記露出部から前記放熱部材を除去し、該放熱部材を除去した前記露出部の少なくとも信号ラインに相当する部分に前記モールド樹脂と同等の誘電率を持つ樹脂を充填することを特徴とする光モジュールの接続方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009036328A JP5515315B2 (ja) | 2009-02-19 | 2009-02-19 | 光モジュールの接続方法 |
CN2010800083926A CN102449865A (zh) | 2009-02-19 | 2010-02-18 | 以透明模装树脂封装引线框和半导体光学装置的光学模块 |
US13/148,236 US20120025210A1 (en) | 2009-02-19 | 2010-02-18 | Optical module enclosing lead frame and semiconductor optical device mounted on the lead frame with transparaent mold resin |
PCT/JP2010/052908 WO2010095760A2 (en) | 2009-02-19 | 2010-02-18 | Optical module enclosing lead frame and semiconductor optical device mounted on the lead frame with transparaent mold resin |
Applications Claiming Priority (1)
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JP2009036328A JP5515315B2 (ja) | 2009-02-19 | 2009-02-19 | 光モジュールの接続方法 |
Publications (2)
Publication Number | Publication Date |
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JP2010192737A true JP2010192737A (ja) | 2010-09-02 |
JP5515315B2 JP5515315B2 (ja) | 2014-06-11 |
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JP2009036328A Active JP5515315B2 (ja) | 2009-02-19 | 2009-02-19 | 光モジュールの接続方法 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5070444U (ja) * | 1973-11-01 | 1975-06-21 | ||
JPS53136178U (ja) * | 1977-04-02 | 1978-10-27 | ||
JPS6454263U (ja) * | 1987-09-25 | 1989-04-04 | ||
JPH0163571U (ja) * | 1987-10-19 | 1989-04-24 | ||
JP2003264265A (ja) * | 2002-03-08 | 2003-09-19 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2004119492A (ja) * | 2002-09-24 | 2004-04-15 | Sharp Corp | 半導体装置 |
JP2004253415A (ja) * | 2003-02-18 | 2004-09-09 | Hitachi Ltd | 電子回路装置 |
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2009
- 2009-02-19 JP JP2009036328A patent/JP5515315B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5070444U (ja) * | 1973-11-01 | 1975-06-21 | ||
JPS53136178U (ja) * | 1977-04-02 | 1978-10-27 | ||
JPS6454263U (ja) * | 1987-09-25 | 1989-04-04 | ||
JPH0163571U (ja) * | 1987-10-19 | 1989-04-24 | ||
JP2003264265A (ja) * | 2002-03-08 | 2003-09-19 | Mitsubishi Electric Corp | 電力用半導体装置 |
JP2004119492A (ja) * | 2002-09-24 | 2004-04-15 | Sharp Corp | 半導体装置 |
JP2004253415A (ja) * | 2003-02-18 | 2004-09-09 | Hitachi Ltd | 電子回路装置 |
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JP5515315B2 (ja) | 2014-06-11 |
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