JP2010182773A5 - - Google Patents
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- Publication number
- JP2010182773A5 JP2010182773A5 JP2009023411A JP2009023411A JP2010182773A5 JP 2010182773 A5 JP2010182773 A5 JP 2010182773A5 JP 2009023411 A JP2009023411 A JP 2009023411A JP 2009023411 A JP2009023411 A JP 2009023411A JP 2010182773 A5 JP2010182773 A5 JP 2010182773A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic device
- substrate
- metal wire
- silicon substrate
- wire terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009023411A JP5210912B2 (ja) | 2009-02-04 | 2009-02-04 | 配線基板、電子装置及び電子装置実装構造 |
| US12/686,590 US8039967B2 (en) | 2009-02-04 | 2010-01-13 | Wiring substrate with a wire terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009023411A JP5210912B2 (ja) | 2009-02-04 | 2009-02-04 | 配線基板、電子装置及び電子装置実装構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010182773A JP2010182773A (ja) | 2010-08-19 |
| JP2010182773A5 true JP2010182773A5 (cg-RX-API-DMAC7.html) | 2012-02-02 |
| JP5210912B2 JP5210912B2 (ja) | 2013-06-12 |
Family
ID=42397014
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009023411A Active JP5210912B2 (ja) | 2009-02-04 | 2009-02-04 | 配線基板、電子装置及び電子装置実装構造 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8039967B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5210912B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8882301B2 (en) * | 2007-08-31 | 2014-11-11 | Nanofoil Corporation | Method for low temperature bonding of electronic components |
| KR101099586B1 (ko) * | 2010-11-12 | 2011-12-28 | 앰코 테크놀로지 코리아 주식회사 | 수직 실장형 반도체 패키지 |
| DE102011005963B3 (de) * | 2011-03-23 | 2012-05-31 | Robert Bosch Gmbh | Mikromechanische Vorrichtung sowie Verfahren zu dessen Herstellung |
| CN103380502B (zh) | 2011-03-24 | 2016-10-12 | 株式会社村田制作所 | 发光元件用基座基板以及led器件 |
| KR101337568B1 (ko) * | 2011-09-14 | 2013-12-06 | 한국전기연구원 | 마이크로 그리드 구조체 제조방법 |
| JP6382888B2 (ja) | 2016-06-09 | 2018-08-29 | Ｎｉｓｓｈａ株式会社 | 電極パターン一体化成形品及びその製造方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH037971Y2 (cg-RX-API-DMAC7.html) * | 1985-12-05 | 1991-02-27 | ||
| JPH10321874A (ja) * | 1997-05-21 | 1998-12-04 | Nippon Seiki Co Ltd | 半導体式圧力センサ及びその製造方法 |
| JP2003142518A (ja) * | 2001-11-02 | 2003-05-16 | Nec Electronics Corp | 半導体製造装置、半導体製造方法、半導体装置及び電子装置 |
| JP2006086480A (ja) * | 2004-09-17 | 2006-03-30 | Ngk Spark Plug Co Ltd | セラミック配線基板及びその製造方法 |
| JP4813035B2 (ja) * | 2004-10-01 | 2011-11-09 | 新光電気工業株式会社 | 貫通電極付基板の製造方法 |
| JP4511333B2 (ja) * | 2004-12-22 | 2010-07-28 | 新光電気工業株式会社 | センサ搭載のモジュール及び電子部品 |
| US7371676B2 (en) * | 2005-04-08 | 2008-05-13 | Micron Technology, Inc. | Method for fabricating semiconductor components with through wire interconnects |
| JP2007132687A (ja) | 2005-11-08 | 2007-05-31 | Sensata Technologies Japan Ltd | センサ用パッケージおよびこれを用いた検出装置 |
| US7307348B2 (en) * | 2005-12-07 | 2007-12-11 | Micron Technology, Inc. | Semiconductor components having through wire interconnects (TWI) |
| US7538413B2 (en) * | 2006-12-28 | 2009-05-26 | Micron Technology, Inc. | Semiconductor components having through interconnects |
| JP5137059B2 (ja) * | 2007-06-20 | 2013-02-06 | 新光電気工業株式会社 | 電子部品用パッケージ及びその製造方法と電子部品装置 |
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2009
- 2009-02-04 JP JP2009023411A patent/JP5210912B2/ja active Active
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2010
- 2010-01-13 US US12/686,590 patent/US8039967B2/en active Active