JP2010180406A5 - - Google Patents
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- Publication number
- JP2010180406A5 JP2010180406A5 JP2010050839A JP2010050839A JP2010180406A5 JP 2010180406 A5 JP2010180406 A5 JP 2010180406A5 JP 2010050839 A JP2010050839 A JP 2010050839A JP 2010050839 A JP2010050839 A JP 2010050839A JP 2010180406 A5 JP2010180406 A5 JP 2010180406A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- weight
- parts
- resin composition
- content
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims description 12
- 229920000647 polyepoxide Polymers 0.000 claims description 12
- 239000011342 resin composition Substances 0.000 claims description 9
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 4
- 125000003277 amino group Chemical group 0.000 claims description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- -1 aromatic amino compound Chemical class 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 2
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010050839A JP5402732B2 (ja) | 2010-03-08 | 2010-03-08 | 樹脂組成物、プリプレグおよび積層板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010050839A JP5402732B2 (ja) | 2010-03-08 | 2010-03-08 | 樹脂組成物、プリプレグおよび積層板 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004365827A Division JP4600029B2 (ja) | 2004-12-17 | 2004-12-17 | 樹脂組成物、プリプレグおよび積層板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010180406A JP2010180406A (ja) | 2010-08-19 |
| JP2010180406A5 true JP2010180406A5 (https=) | 2010-09-30 |
| JP5402732B2 JP5402732B2 (ja) | 2014-01-29 |
Family
ID=42762154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010050839A Expired - Fee Related JP5402732B2 (ja) | 2010-03-08 | 2010-03-08 | 樹脂組成物、プリプレグおよび積層板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5402732B2 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020094111A (ja) * | 2018-12-11 | 2020-06-18 | 住友ベークライト株式会社 | プリプレグ、樹脂基板、金属張積層板、プリント配線基板、および半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2542013B2 (ja) * | 1987-10-26 | 1996-10-09 | 旭化成工業株式会社 | プリプレグ用エポキシ樹脂組成物 |
| JPH068388A (ja) * | 1992-06-29 | 1994-01-18 | Dow Chem Japan Ltd | エポキシ樹脂積層板 |
| TW294694B (https=) * | 1994-09-09 | 1997-01-01 | Siemens Ag | |
| JPH08176324A (ja) * | 1994-12-22 | 1996-07-09 | Sumitomo Bakelite Co Ltd | プリプレグの製造方法 |
| JPH10330513A (ja) * | 1997-06-02 | 1998-12-15 | Toray Ind Inc | プリプレグ及び繊維強化複合材料 |
| JP3883149B2 (ja) * | 1997-12-19 | 2007-02-21 | 住友ベークライト株式会社 | 樹脂組成物、並びにそれを用いた半導体封止材料および積層板 |
| JP2004174730A (ja) * | 2002-11-25 | 2004-06-24 | Sumitomo Bakelite Co Ltd | 積層板の連続製造方法 |
-
2010
- 2010-03-08 JP JP2010050839A patent/JP5402732B2/ja not_active Expired - Fee Related
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