WO2015041325A8 - シリコーン変性エポキシ樹脂およびその組成物と硬化物 - Google Patents

シリコーン変性エポキシ樹脂およびその組成物と硬化物 Download PDF

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Publication number
WO2015041325A8
WO2015041325A8 PCT/JP2014/074864 JP2014074864W WO2015041325A8 WO 2015041325 A8 WO2015041325 A8 WO 2015041325A8 JP 2014074864 W JP2014074864 W JP 2014074864W WO 2015041325 A8 WO2015041325 A8 WO 2015041325A8
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WO
WIPO (PCT)
Prior art keywords
epoxy resin
cured article
composition
silicone
carbon atoms
Prior art date
Application number
PCT/JP2014/074864
Other languages
English (en)
French (fr)
Other versions
WO2015041325A1 (ja
Inventor
塩原　利夫
純一 沢田
若尾　幸
柏木　努
直房 宮川
義浩 川田
智江 佐々木
政隆 中西
窪木　健一
Original Assignee
信越化学工業株式会社
日本化薬株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 信越化学工業株式会社, 日本化薬株式会社 filed Critical 信越化学工業株式会社
Priority to CN201480063205.2A priority Critical patent/CN105873976B/zh
Priority to JP2015537979A priority patent/JP6397823B2/ja
Priority to US15/023,263 priority patent/US9777107B2/en
Publication of WO2015041325A1 publication Critical patent/WO2015041325A1/ja
Publication of WO2015041325A8 publication Critical patent/WO2015041325A8/ja

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

【課題】　本発明は、上記事情に鑑みてなされたもので、低ガス透過性、強度に優れた硬化物を与えるシリコーン変性エポキシ樹脂組成物及び当該組成物を硬化することに得られるエポキシ樹脂硬化物を提供することを目的とする。 【解決手段】　下記式（１）で表されるエポキシ樹脂。 （式中、Ｒ１はエステル、エーテル結合を含有してもよい炭素数２～６のアルキレン基を、Ｒ２は炭素数１～６の一価脂肪族炭化水素基又は炭素数６～１２の一価芳香族炭化水素基を、Ｒ３は酸素原子もしくはフェニレン基を、ｋは平均値で１～１０を、ｍは０～２の整数を、ｎは平均値で０～１０をそれぞれ表す。式中、複数存在するＲ１～Ｒ３、ｋ、ｍはそれぞれ同一であっても異なっても構わない。）
PCT/JP2014/074864 2013-09-20 2014-09-19 シリコーン変性エポキシ樹脂およびその組成物と硬化物 WO2015041325A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201480063205.2A CN105873976B (zh) 2013-09-20 2014-09-19 有机硅改性环氧树脂及其组合物和固化物
JP2015537979A JP6397823B2 (ja) 2013-09-20 2014-09-19 シリコーン変性エポキシ樹脂およびその組成物と硬化物
US15/023,263 US9777107B2 (en) 2013-09-20 2014-09-19 Silicone-modified epoxy resin and composition and cured article thereof

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013196250 2013-09-20
JP2013-196250 2013-09-20

Publications (2)

Publication Number Publication Date
WO2015041325A1 WO2015041325A1 (ja) 2015-03-26
WO2015041325A8 true WO2015041325A8 (ja) 2015-06-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/074864 WO2015041325A1 (ja) 2013-09-20 2014-09-19 シリコーン変性エポキシ樹脂およびその組成物と硬化物

Country Status (5)

Country Link
US (1) US9777107B2 (ja)
JP (1) JP6397823B2 (ja)
CN (1) CN105873976B (ja)
TW (1) TWI629307B (ja)
WO (1) WO2015041325A1 (ja)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102534679B1 (ko) * 2015-07-10 2023-05-19 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물, 그 제조 방법 및 해당 조성물의 용도
TWI721039B (zh) * 2015-11-18 2021-03-11 日商住友精化股份有限公司 環氧樹脂組成物、其製造方法、及該組成物之用途
CN110191921B (zh) 2017-01-10 2022-04-26 住友精化株式会社 环氧树脂组合物
WO2018131571A1 (ja) * 2017-01-10 2018-07-19 住友精化株式会社 エポキシ樹脂組成物
KR102461514B1 (ko) 2017-01-10 2022-11-08 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
KR102512801B1 (ko) 2017-01-10 2023-03-23 스미토모 세이카 가부시키가이샤 에폭시 수지 조성물
CN110167989B (zh) * 2017-01-10 2022-11-11 住友精化株式会社 环氧树脂组合物
TW201841968A (zh) * 2017-03-31 2018-12-01 日商住友精化股份有限公司 環氧樹脂、環氧樹脂組成物及其硬化物、用途以及製造方法
JP7146766B2 (ja) * 2017-07-31 2022-10-04 住友精化株式会社 エポキシ樹脂組成物
US11427466B2 (en) * 2019-07-19 2022-08-30 Advanced Semiconductor Engineering, Inc. Semiconductor package structure and method for manufacturing the same
JP7390236B2 (ja) * 2020-03-31 2023-12-01 京セラ株式会社 異方導電性樹脂組成物、及びマイクロｌｅｄディスプレイ装置
JP2024029572A (ja) * 2022-08-22 2024-03-06 信越化学工業株式会社 カチオン硬化型組成物、硬化物、及び光半導体装置

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JPH02207087A (ja) * 1989-02-07 1990-08-16 Adeka Argus Chem Co Ltd エポキシ基含有シラン化合物
DE4328466C1 (de) 1993-08-24 1995-04-13 Siemens Ag Siloxanhaltiges Gießharzsystem
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US7034089B2 (en) * 2002-12-20 2006-04-25 National Starch And Chemical Investment Holding Corporation Epoxy-functional hybrid copolymers
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US20050261390A1 (en) 2004-05-13 2005-11-24 Jean-Marc Frances Stable cationically crosslinkable/polymerizable dental composition with a high filler content
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KR100840911B1 (ko) * 2004-05-13 2008-06-24 로디아 쉬미 양이온성 반응에 의해서 가교결합/중합될 수 있는 고도로충전된 안정한 치과용 조성물
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Also Published As

Publication number Publication date
TW201518393A (zh) 2015-05-16
US9777107B2 (en) 2017-10-03
TWI629307B (zh) 2018-07-11
JP6397823B2 (ja) 2018-09-26
WO2015041325A1 (ja) 2015-03-26
CN105873976B (zh) 2018-07-03
JPWO2015041325A1 (ja) 2017-03-02
US20160237202A1 (en) 2016-08-18
CN105873976A (zh) 2016-08-17

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