JP2010180406A5 - - Google Patents
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- JP2010180406A5 JP2010180406A5 JP2010050839A JP2010050839A JP2010180406A5 JP 2010180406 A5 JP2010180406 A5 JP 2010180406A5 JP 2010050839 A JP2010050839 A JP 2010050839A JP 2010050839 A JP2010050839 A JP 2010050839A JP 2010180406 A5 JP2010180406 A5 JP 2010180406A5
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- epoxy resin
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- resin composition
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Description
このような目的は、下記（１）〜（５）に記載の本発明により達成される。
（１）基材に含浸させてシート状のプリプレグを形成するために用いる樹脂組成物であって、ジシクロペンタジエン型エポキシ樹脂を含むエポキシ樹脂と、ジシアンジアミドと、分子内にアミノ基を１つ有する芳香族アミノ化合物とを含有し、かつ、前記ジシクロペンタジエン型エポキシ樹脂の含有量は、エポキシ樹脂全体の７０〜９０重量％であることを特徴とする樹脂組成物。
（２）前記ジシアンジアミドの含有量は、エポキシ樹脂１００重量部に対して１．５〜３．５重量部である上記（１）に記載の樹脂組成物。
（３）前記分子内にアミノ基を１つ有する芳香族アミノ化合物の含有量は、エポキシ樹脂１００重量部に対して２〜１２重量部である上記（１）又は（２）に記載の樹脂組成物。
（４）上記（１）ないし（３）のいずれかに記載の樹脂組成物を基材に含浸させてなることを特徴とするプリプレグ。
（５）上記（４）に記載のプリプレグを１枚以上成形してなることを特徴とする積層板。
Such an object is achieved by the present invention described in the following (1) to (5).
(1) A resin composition used for impregnating a base material to form a sheet-like prepreg, having an epoxy resin containing a dicyclopentadiene type epoxy resin, dicyandiamide, and one amino group in the molecule A resin composition comprising an aromatic amino compound and a content of the dicyclopentadiene type epoxy resin of 70 to 90% by weight of the whole epoxy resin .
(2) The resin composition according to (1), wherein the content of the dicyandiamide is 1.5 to 3.5 parts by weight with respect to 100 parts by weight of the epoxy resin .
(3) The resin composition according to (1) or (2), wherein the content of the aromatic amino compound having one amino group in the molecule is 2 to 12 parts by weight with respect to 100 parts by weight of the epoxy resin. object.
(4) A prepreg obtained by impregnating a base material with the resin composition according to any one of (1) to (3).
(5) A laminate obtained by molding one or more prepregs according to (4) above.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010050839A JP5402732B2 (en) | 2010-03-08 | 2010-03-08 | Resin composition, prepreg and laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010050839A JP5402732B2 (en) | 2010-03-08 | 2010-03-08 | Resin composition, prepreg and laminate |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004365827A Division JP4600029B2 (en) | 2004-12-17 | 2004-12-17 | Resin composition, prepreg and laminate |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010180406A JP2010180406A (en) | 2010-08-19 |
| JP2010180406A5 true JP2010180406A5 (en) | 2010-09-30 |
| JP5402732B2 JP5402732B2 (en) | 2014-01-29 |
Family
ID=42762154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010050839A Expired - Fee Related JP5402732B2 (en) | 2010-03-08 | 2010-03-08 | Resin composition, prepreg and laminate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5402732B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020094111A (en) * | 2018-12-11 | 2020-06-18 | 住友ベークライト株式会社 | Prepreg, resin substrate, metal-clad laminate, printed circuit board, and semiconductor device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2542013B2 (en) * | 1987-10-26 | 1996-10-09 | 旭化成工業株式会社 | Epoxy resin composition for prepreg |
| JPH068388A (en) * | 1992-06-29 | 1994-01-18 | Dow Chem Japan Ltd | Epoxy resin laminated sheet |
| TW294694B (en) * | 1994-09-09 | 1997-01-01 | Siemens Ag | |
| JPH08176324A (en) * | 1994-12-22 | 1996-07-09 | Sumitomo Bakelite Co Ltd | Production of prepreg |
| JPH10330513A (en) * | 1997-06-02 | 1998-12-15 | Toray Ind Inc | Prepreg and fiber-reinforced composite material |
| JP3883149B2 (en) * | 1997-12-19 | 2007-02-21 | 住友ベークライト株式会社 | Resin composition, and semiconductor sealing material and laminate using the same |
| JP2004174730A (en) * | 2002-11-25 | 2004-06-24 | Sumitomo Bakelite Co Ltd | Method for continuously manufacturing laminated sheet |
-
2010
- 2010-03-08 JP JP2010050839A patent/JP5402732B2/en not_active Expired - Fee Related
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